The XC2S200-6FGG1179C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for commercial-temperature applications, this device delivers 200,000 system gates and 5,292 logic cells in a robust 1179-ball Fine-Pitch BGA (FBGA) package. Whether you are prototyping a new design or sourcing components for high-volume production, the XC2S200-6FGG1179C offers an outstanding balance of logic density, speed, and I/O flexibility.

For a broader view of available Xilinx programmable solutions, visit our dedicated Xilinx FPGA page.

What Is the XC2S200-6FGG1179C?

The XC2S200-6FGG1179C is part of Xilinx’s Spartan-II FPGA product line — a 2.5V programmable logic family built on 0.18 µm process technology. The part number decodes as follows:

The -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1179C the top-performance variant for non-industrial environments.

XC2S200-6FGG1179C Key Technical Specifications

The table below summarizes the core electrical and logic specifications for the XC2S200-6FGG1179C.

XC2S200-6FGG1179C Package & Pinout Details

Understanding the FGG1179 Package

The FGG1179 suffix indicates a Fine-Pitch Ball Grid Array with 1,179 solder balls arranged in a grid pattern. The extra “G” in “FGG” confirms this is the Pb-Free (RoHS-compliant lead-free) variant, distinguishing it from the standard “FG” version. This makes the XC2S200-6FGG1179C a green packaging option suitable for RoHS-compliant designs.

Package Comparison: XC2S200 Available Packages

The FGG1179 offers the highest pin count in the XC2S200 package family, providing maximum routing flexibility and additional signal integrity benefits in complex PCB designs.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II family, providing the most logic resources while maintaining the family’s cost-effective pricing model.

Core Architecture & Features of the XC2S200-6FGG1179C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1179C is organized around a 28×42 array of CLBs, totaling 1,176 CLBs. Each CLB contains four logic cells, where each cell includes a 4-input Look-Up Table (LUT) and a flip-flop. This architecture enables efficient implementation of combinational and sequential logic.

Distributed RAM and Block RAM

The device provides two types of on-chip memory:

• Distributed RAM (75,264 bits): Implemented within CLB LUTs, ideal for small, fast data buffers.
• Block RAM (56K bits): Dedicated synchronous dual-port memory blocks placed alongside CLBs, suitable for larger data storage, FIFOs, and lookup tables.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1179C supports a wide range of I/O standards, including LVTTL, LVCMOS, GTL, GTL+, PCI (3.3V), SSTL2, SSTL3, and AGP. Each IOB features both input and output flip-flops for high-speed, registered I/O performance.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide clock management capabilities. The DLLs enable zero-skew clock distribution, frequency synthesis, and phase shifting, critical for high-speed synchronous designs.

JTAG Boundary Scan

The XC2S200-6FGG1179C fully complies with the IEEE 1149.1 JTAG boundary scan standard, simplifying board-level testing and in-system debugging.

Configuration Modes for the XC2S200-6FGG1179C

The device supports multiple configuration interfaces, giving designers flexibility in how they load the bitstream:

Typical Applications for the XC2S200-6FGG1179C

The XC2S200-6FGG1179C is well-suited for a broad range of industrial and consumer electronics applications:

• Telecommunications: Line cards, protocol bridges, and signal processing pipelines
• Industrial Automation: Motor control, sensor fusion, and real-time logic controllers
• Consumer Electronics: Set-top boxes, digital displays, and multimedia processing
• Networking Equipment: Packet processing, switching fabric, and interface bridging
• Embedded Systems: Co-processing, bus interfacing, and custom peripheral logic
• Automotive Electronics: Commercial-grade in-vehicle infotainment and control units

XC2S200-6FGG1179C vs. Common Alternatives

When selecting an FPGA for your project, it is helpful to compare the XC2S200-6FGG1179C with other devices in its class:

The XC2S200-6FGG1179C stands out with its highest speed grade (-6), Pb-Free package, and maximum pin count (1179 balls) within the Spartan-II XC2S200 tier.

Ordering Information & Part Number Decoding

Understanding how to decode a Xilinx Spartan-II part number ensures you select exactly the right variant for your application.

XC2S200-6FGG1179C Part Number Breakdown

XC  2  S  200  -  6  FGG  1179  C
|   |  |   |      |   |    |    |
|   |  |   |      |   |    |    └── Temperature: C = Commercial (0°C to +85°C)
|   |  |   |      |   |    └─────── Pin Count: 1179 balls
|   |  |   |      |   └──────────── Package: FGG = Fine-Pitch BGA, Pb-Free
|   |  |   |      └──────────────── Speed Grade: -6 (fastest)
|   |  |   └─────────────────────── Gate Count: 200K system gates
|   |  └─────────────────────────── Family: S = Spartan
|   └────────────────────────────── Generation: 2 = Spartan-II
└────────────────────────────────── Xilinx

Design Tools & Software Support

The XC2S200-6FGG1179C is fully supported by Xilinx’s legacy design toolchain:

• ISE Design Suite: The primary design environment for Spartan-II devices, supporting VHDL, Verilog, and schematic entry
• ChipScope Pro: In-system logic analysis for debugging running designs
• IMPACT: Configuration tool for programming via JTAG or configuration PROM
• PlanAhead: Floorplanning and physical design guidance

Note: Since Xilinx’s acquisition by AMD, modern design teams may also reference AMD’s documentation portal for archived Spartan-II resources and datasheets.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1179C used for?

The XC2S200-6FGG1179C is a Xilinx Spartan-II FPGA used in telecommunications, industrial automation, embedded processing, and consumer electronics applications requiring up to 200,000 system gates in a commercial-temperature environment.

What does the “-6” speed grade mean on the XC2S200?

The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). It provides the lowest propagation delays and supports system performance up to 200 MHz.

Is the XC2S200-6FGG1179C RoHS compliant?

Yes. The “GG” in the FGG package designation indicates a Pb-Free (lead-free) green package, making the XC2S200-6FGG1179C RoHS-compliant and suitable for use in environmentally regulated markets.

What is the difference between FG and FGG packages?

In Xilinx’s naming convention, FG denotes a standard Fine-Pitch Ball Grid Array with tin-lead (SnPb) solder balls. FGG indicates the same package in a Pb-Free (lead-free) variant, adding the extra “G” to distinguish it in the ordering code.

What voltage does the XC2S200-6FGG1179C operate at?

The XC2S200-6FGG1179C operates at a 2.5V core supply voltage (VCC). I/O voltages depend on the selected I/O standard and are typically 2.5V, 3.3V, or lower depending on the interface.

Conclusion

The XC2S200-6FGG1179C is the flagship device of the Xilinx Spartan-II FPGA family, delivering 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and the fastest -6 speed grade — all in a Pb-Free 1179-ball BGA package for commercial-temperature designs. Its proven 0.18 µm architecture, on-chip DLLs, dual-port Block RAM, and comprehensive configuration options make it a reliable choice for a wide range of digital design applications.

If you are evaluating Xilinx programmable logic devices for your next project, explore our full selection on the Xilinx FPGA page for more options, datasheets, and pricing information.