The XC2S200-6FGG1176C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, designed to deliver 200,000 system gates in a robust fine-pitch ball grid array package. Whether you are an embedded systems engineer, PCB designer, or procurement specialist, this guide covers everything you need to know — from core architecture and electrical characteristics to real-world applications and ordering information.

What Is the XC2S200-6FGG1176C?

The XC2S200-6FGG1176C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic solution built on 0.18 µm CMOS process technology. It targets cost-sensitive, high-volume applications where design flexibility and speed are equally critical. The “FGG” in the part number denotes a Fine-pitch Ball Grid Array (FBGA) package, while the “-6” denotes its speed grade — the fastest available in the commercial temperature range for this family.

If you are looking for a reliable, reprogrammable alternative to mask-programmed ASICs, explore the full lineup of Xilinx FPGA solutions available for various design requirements.

XC2S200-6FGG1176C Key Specifications at a Glance

XC2S200-6FGG1176C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 core consists of a 28 × 42 array of 1,176 Configurable Logic Blocks, giving it 5,292 logic cells. Each CLB contains:

• Four function generators (Look-Up Tables) capable of implementing any 4-input Boolean function
• Four storage elements configurable as edge-triggered flip-flops or level-sensitive latches
• Fast carry and arithmetic logic for efficient arithmetic operations
• Wide-function multiplexers for logic consolidation

This CLB architecture allows engineers to implement complex state machines, DSP pipelines, and communication protocol controllers within a single device.

Block RAM and Distributed RAM

The two columns of dedicated Block RAM sit on opposite sides of the die, between the CLBs and the I/O columns. Each Block RAM is independently configurable for various width/depth combinations, making it ideal for FIFOs, line buffers, and lookup tables in high-throughput systems.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1176C provides 284 maximum user I/O pins, each implemented as a fully programmable Input/Output Block (IOB). Key IOB capabilities include:

• Programmable input delay for setup-time management
• Registered inputs and outputs for pipeline efficiency
• 3-state output control
• Internal pull-up and pull-down resistors
• Compatibility with multiple I/O standards (LVTTL, LVCMOS, PCI, GTL, etc.)

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) are placed at each corner of the die. The DLLs provide:

• Zero clock skew distribution across the device
• Clock frequency synthesis and division
• Phase shifting for timing closure in high-speed designs
• Elimination of clock distribution delay

Speed Grade and Performance Specifications

The -6 speed grade is the highest performance option available for the XC2S200 in the commercial temperature range. This translates to the tightest propagation delays and the highest achievable operating frequencies.

Note: The -6 speed grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1176C suited for controlled-environment applications such as consumer electronics, networking equipment, and laboratory instruments.

Package Information: Understanding “FGG1176”

The suffix FGG refers to a Fine-pitch Ball Grid Array package with lead-free (Pb-free) solder balls (the extra “G” in “FGG” indicates the Pb-free/RoHS-compliant variant). The number 1176 reflects the total CLB count of the XC2S200 device (28 × 42 = 1,176 CLBs), which is also used in part numbering to differentiate package and device configurations within the ordering system.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, memory, and I/O count, making it the preferred choice for more complex designs.

Configuration Modes

The XC2S200-6FGG1176C supports four standard configuration modes:

Configuration data is stored in an external non-volatile memory device (such as a Xilinx Platform Flash PROM). Upon power-up, the FPGA automatically loads its configuration bitstream, consuming 1,335,840 configuration bits.

Applications of the XC2S200-6FGG1176C

Communications and Networking

The high I/O count (284 pins) and DLL-based clock management make the XC2S200-6FGG1176C ideal for implementing serial/parallel protocol bridges, network interface controllers, and line cards operating in the hundreds-of-MHz range.

Industrial Automation and Motor Control

The device’s reconfigurability allows rapid design iteration for PID controllers, stepper/servo motor drives, encoder interfaces, and safety-rated I/O modules — without incurring ASIC NRE costs.

Medical Imaging and Diagnostics

Reliability and reprogrammability make the XC2S200-6FGG1176C a strong candidate for ultrasound front-end processing, patient monitoring systems, and digitizer boards where field upgradability is important.

Signal Processing and Test Equipment

With 1,176 CLBs and 263 MHz max frequency, the device handles real-time FFT pipelines, digital filters, and arbitrary waveform generation tasks well within budget and power constraints.

Security and Surveillance Systems

The Spartan-II FPGA supports high-throughput video stream processing and hardware-based encryption, enabling FPGA-accelerated surveillance controllers and biometric authentication engines.

Advantages Over Mask-Programmed ASICs

Design Tools and Software Support

The XC2S200-6FGG1176C is supported by Xilinx’s legacy ISE Design Suite, which provides:

• XST – Xilinx Synthesis Technology for HDL synthesis
• PACE / Floorplanner – Pin assignment and physical layout
• iMPACT – JTAG-based device programming
• ChipScope Pro – In-system logic analysis

Designs are described in VHDL or Verilog, and the bitstream is generated through synthesis, mapping, place-and-route, and bitstream generation steps.

Ordering Information and Part Number Decoder

XC 2S 200 - 6 FGG 1176 C
|  |   |    |  |    |    |
|  |   |    |  |    |    └── Temperature Range: C = Commercial (0°C to +85°C)
|  |   |    |  |    └─────── Package Pin Count / CLB Reference: 1176
|  |   |    |  └──────────── Package Type: FGG = Fine-pitch BGA, Pb-Free
|  |   |    └─────────────── Speed Grade: -6 (Fastest)
|  |   └──────────────────── Gate Count: 200 (= 200,000 system gates)
|  └──────────────────────── Family: 2S = Spartan-II
└─────────────────────────── Manufacturer prefix: XC = Xilinx

Frequently Asked Questions (FAQs)

Q: What is the difference between XC2S200-6FGG1176C and XC2S200-6FGG456C? The primary difference is the package pin count and CLB referencing in the part number. The XC2S200 core remains identical (5,292 logic cells, 284 I/O, 200K gates), but the physical package configuration and ball map differ. Always verify PCB footprint compatibility before substitution.

Q: Is the XC2S200-6FGG1176C RoHS compliant? Yes. The double “G” in “FGG” indicates a Pb-free (lead-free) package, making this device compliant with RoHS (Restriction of Hazardous Substances) directives.

Q: What voltage does the XC2S200-6FGG1176C operate at? The core logic operates at 2.5V. I/O banks can be powered at different voltages (1.5V, 2.5V, 3.3V) to interface with various external logic standards.

Q: Can the XC2S200-6FGG1176C be used in industrial temperature applications? No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). For industrial temperature (-40°C to +100°C) requirements, consider the -5I or -5 grade equivalents.

Q: What programmers are compatible with this FPGA? Xilinx’s Platform Cable USB II and legacy Parallel Cable IV are compatible with the XC2S200 via JTAG. The device is also configurable from external PROMs in master serial or slave parallel modes.

Summary

The XC2S200-6FGG1176C stands as the flagship device of the Xilinx Spartan-II family, combining 200,000 system gates, 5,292 logic cells, 284 user I/O, and 263 MHz performance in a Pb-free fine-pitch BGA package. Its 2.5V core, quad DLL clock management, and support for both serial and parallel configuration make it a versatile, proven platform for communications, industrial, medical, and signal processing applications. As a reprogrammable FPGA, it eliminates the cost and time-to-market risks of ASICs while delivering the deterministic hardware performance that software-based solutions cannot match.