Meta Description: Buy the XC2S200-6FGG1169C – a Xilinx Spartan-II FPGA with 200K gates, 5,292 logic cells, -6 speed grade, and 1169-pin Pb-free BGA package. Full specs, features, and applications inside.
What Is the XC2S200-6FGG1169C?
The XC2S200-6FGG1169C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx (now AMD), belonging to the Spartan-II 2.5V FPGA family. This device delivers 200,000 system gates and 5,292 configurable logic cells in a Pb-free 1169-pin Fine-Pitch Ball Grid Array (FGG) package. The “-6” speed grade is the fastest commercially available grade in the Spartan-II lineup, and the “C” suffix confirms the commercial operating temperature range (0°C to +85°C).
Whether you are designing embedded systems, telecommunications equipment, or industrial control boards, the XC2S200-6FGG1169C provides the logic density, I/O flexibility, and programmability engineers demand. Explore the full range of Xilinx FPGA solutions to find the right part for your project.
XC2S200-6FGG1169C Part Number Breakdown
Understanding the Xilinx ordering code helps you confirm you are purchasing the exact device your design requires.
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200,000 system gates |
| -6 |
Speed grade 6 – fastest commercial grade |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (lead-free) |
| 1169 |
1169 total package pins/balls |
| C |
Commercial temperature range: 0°C to +85°C |
The “G” in “FGG” indicates RoHS-compliant, Pb-free packaging, distinguishing it from the standard “FG” variant.
XC2S200-6FGG1169C Key Specifications
General Device Parameters
| Parameter |
Value |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Part Number |
XC2S200-6FGG1169C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Core Supply Voltage |
2.5V (2.375V – 2.625V) |
| Technology Node |
0.18 µm |
| Speed Grade |
-6 (fastest commercial) |
| Operating Temperature |
0°C to +85°C (Commercial) |
Memory Resources
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56,000 bits (56K) |
| Total Embedded RAM |
~131,264 bits |
I/O and Clock Resources
| Resource |
Count |
| Maximum User I/Os |
284 |
| Delay-Locked Loops (DLLs) |
4 (one per die corner) |
| I/O Standards Supported |
16 selectable standards |
| Global Clock Inputs |
4 dedicated pins |
Package Information
| Parameter |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG1169 |
| Total Pins |
1,169 |
| Lead-Free (Pb-Free) |
Yes (RoHS Compliant) |
| Mounting Type |
Surface Mount |
XC2S200-6FGG1169C Performance Highlights
Maximum Speed and Timing
The -6 speed grade is exclusively available in the commercial temperature range and represents the peak performance tier of the XC2S200 family. Key timing characteristics include:
- System clock frequency: Up to 200 MHz+
- Internal CLB propagation delay: Optimized for -6 grade
- Pin-to-pin path delay: Industry-competitive for 2.5V FPGA devices
- DLL-compensated clock distribution: Reduces clock skew across the entire device
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1169C features a 28 × 42 array of 1,176 CLBs. Each CLB contains:
- Two slices per CLB
- Two 4-input Look-Up Tables (LUTs) per slice
- Two flip-flops per slice
- Fast-carry and arithmetic logic
This architecture enables efficient implementation of counters, multiplexers, state machines, and custom DSP pipelines.
Input/Output Blocks (IOBs) and I/O Standards
With 284 maximum user I/Os and support for 16 programmable I/O standards, the XC2S200-6FGG1169C supports a wide range of interfacing requirements. Supported I/O standards include:
| I/O Standard |
Type |
| LVCMOS2 |
Low-voltage CMOS (2.5V) |
| LVCMOS33 |
Low-voltage CMOS (3.3V) |
| LVTTL |
Low-voltage TTL |
| PCI |
3.3V PCI bus standard |
| GTL |
Gunning Transceiver Logic |
| GTL+ |
GTL with termination |
| HSTL (Class I–IV) |
High-speed transceiver logic |
| SSTL2 (Class I–II) |
Stub-series terminated logic (2.5V) |
| SSTL3 (Class I–II) |
Stub-series terminated logic (3.3V) |
| AGP |
Accelerated Graphics Port |
XC2S200-6FGG1169C Architecture Overview
Spartan-II FPGA Core Architecture
The Spartan-II family uses a regular, programmable architecture built around three core functional elements:
- Configurable Logic Blocks (CLBs) – The primary logic resources, arranged in a uniform 2D array for predictable routing and timing closure.
- Input/Output Blocks (IOBs) – Surround the CLB array as a perimeter ring, providing flexible interface to external devices and buses.
- Block RAM Columns – Two dedicated columns of embedded SRAM, positioned between the CLB array and IOB ring on opposite sides of the die.
Delay-Locked Loop (DLL) Clock Management
The XC2S200-6FGG1169C includes four DLLs, one positioned at each corner of the die. These DLLs provide:
- Zero clock-skew distribution across the device
- Clock multiplication and division
- Phase shifting for source-synchronous interfaces
- Input clock deskew
Interconnect Hierarchy
A hierarchical routing architecture connects CLBs, IOBs, and block RAM. This multi-level interconnect—spanning local, long-line, and global routing resources—enables efficient signal routing for both low-latency local logic and high-fanout global signals.
XC2S200-6FGG1169C vs. Other XC2S200 Variants
The table below compares the XC2S200-6FGG1169C against closely related part numbers to help you select the right variant.
| Part Number |
Speed Grade |
Package |
Pins |
Lead-Free |
Temp Range |
| XC2S200-5FG456C |
-5 |
FBGA |
456 |
No |
Commercial |
| XC2S200-5FGG456C |
-5 |
FBGA |
456 |
Yes |
Commercial |
| XC2S200-6FG456C |
-6 |
FBGA |
456 |
No |
Commercial |
| XC2S200-6FG256C |
-6 |
FBGA |
256 |
No |
Commercial |
| XC2S200-6FGG1169C |
-6 |
FBGA |
1169 |
Yes |
Commercial |
| XC2S200-5FG456I |
-5 |
FBGA |
456 |
No |
Industrial |
Key takeaway: The XC2S200-6FGG1169C combines the fastest speed grade (-6), the largest pin-count package (1169 pins), and Pb-free (RoHS) compliance — making it the preferred choice for designs requiring maximum I/O routing flexibility.
XC2S200-6FGG1169C Spartan-II Family Comparison
To provide design context, here is how the XC2S200 sits within the full Spartan-II device family.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/Os |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
6,144 bits |
16K bits |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
13,824 bits |
24K bits |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
24,576 bits |
32K bits |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
38,400 bits |
40K bits |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
55,296 bits |
48K bits |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
75,264 bits |
56K bits |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, the most logic cells, the deepest embedded RAM, and the greatest I/O count.
Top Applications for the XC2S200-6FGG1169C
The XC2S200-6FGG1169C is widely used across demanding industries. Its combination of reprogrammability, high gate count, and Pb-free packaging makes it suitable for both legacy system maintenance and new product designs.
Telecommunications and Networking
- Line card and framer logic
- Protocol conversion (SONET/SDH, Ethernet bridging)
- Signal conditioning and clock recovery
- Backplane interface management
Industrial Automation and Control
- PLC co-processors and motion control interfaces
- Real-time sensor data acquisition
- Multi-axis servo controller logic
- Safety and interlock systems
Embedded Vision and Imaging
- Pre-processing pipelines for image sensors
- Pixel filtering and frame buffering
- Interface bridging between camera modules and processors
- Machine vision in robotics and inspection systems
Wireless Communication
- Baseband signal processing
- Modulation/demodulation algorithm acceleration
- Protocol framing for 4G/LTE infrastructure equipment
- IoT gateway interface logic
Defense and Aerospace (Legacy Support)
- Existing board-level design maintenance
- Form-fit-function replacement in legacy systems
- Radiation-tolerant application bridging
Design Tools and Programming Support
Xilinx ISE Design Suite
The XC2S200-6FGG1169C is supported by the Xilinx ISE Design Suite (specifically ISE 14.x and earlier). Note that the newer Vivado Design Suite does not support Spartan-II devices. ISE supports:
- VHDL and Verilog RTL entry
- Logic synthesis via XST (Xilinx Synthesis Tool)
- Place-and-route for Spartan-II device targets
- JTAG-based configuration and in-system programming
- Timing analysis and static timing reports
Configuration Methods
The XC2S200-6FGG1169C supports multiple configuration modes:
| Mode |
Description |
| Master Serial |
FPGA drives clock; reads from external serial PROM |
| Slave Serial |
External device drives clock and data |
| Master Parallel |
FPGA reads from parallel flash or EPROM |
| Slave Parallel |
Processor-controlled parallel download |
| JTAG (Boundary Scan) |
IEEE 1149.1 JTAG configuration and test |
Electrical and Environmental Specifications
| Parameter |
Min |
Typical |
Max |
Unit |
| Core Supply Voltage (VCCINT) |
2.375 |
2.5 |
2.625 |
V |
| I/O Supply Voltage (VCCO) |
1.14 |
— |
3.6 |
V |
| Input Voltage (LVCMOS33) |
-0.5 |
— |
3.6 |
V |
| Operating Temperature (TJ) |
0 |
— |
+85 |
°C |
| Storage Temperature |
-65 |
— |
+150 |
°C |
Why Choose the XC2S200-6FGG1169C?
Superior to Mask-Programmed ASICs for Many Use Cases
The Spartan-II FPGA eliminates the high NRE (non-recurring engineering) cost and long lead times of custom ASICs. The XC2S200-6FGG1169C delivers:
- Field-upgradeable logic – reprogram in the system without hardware swap
- Shorter time-to-market – no mask fabrication cycles
- Lower development risk – logic errors corrected via configuration update
- Cost-effective scaling – same hardware, different firmware for multiple product variants
Pb-Free and RoHS Compliance
The “G” in the FGG package designation confirms that the XC2S200-6FGG1169C uses lead-free solder balls, satisfying RoHS Directive 2011/65/EU requirements. This is essential for products sold in the European Union, UK, California, and other regulated markets.
Commercial Grade Reliability
The commercial temperature range (0°C to +85°C junction temperature) aligns with standard indoor industrial and computing environments, providing a well-characterized performance envelope for reliable, repeatable operation.
Frequently Asked Questions (FAQ)
What does the -6 speed grade mean on the XC2S200-6FGG1169C?
The -6 speed grade indicates the fastest timing class in the Spartan-II XC2S200 lineup. It guarantees the lowest propagation delays through CLBs and routing, enabling higher system clock frequencies compared to the -5 speed grade. The -6 grade is exclusively available for the commercial temperature range.
Is the XC2S200-6FGG1169C RoHS compliant?
Yes. The double “G” in “FGG” confirms Pb-free, RoHS-compliant packaging. The solder balls do not contain lead (Pb), making this part compliant with global environmental regulations.
What software do I use to program the XC2S200-6FGG1169C?
Use Xilinx ISE Design Suite (version 14.7 is the final release). The newer Vivado suite does not support Spartan-II. Download ISE from the AMD/Xilinx support archive for free.
What is the difference between XC2S200-6FGG1169C and XC2S200-6FG456C?
Both parts share the same die, speed grade, and temperature range. The key differences are the package pin count (1169 vs. 456) and lead-free status (FGG1169 is Pb-free; FG456 is standard). The larger 1169-pin package provides more PCB routing options for high pin-count board designs.
Can the XC2S200-6FGG1169C be used in industrial temperature applications?
No. The “C” suffix denotes the commercial temperature range (0°C to +85°C). For industrial operation (-40°C to +100°C), look for the “I” suffix variant (e.g., XC2S200-5FG456I).
Summary
The XC2S200-6FGG1169C is the flagship member of the Xilinx Spartan-II 2.5V FPGA family. It combines 200,000 system gates, 5,292 logic cells, 131K bits of embedded RAM, 284 user I/Os, and the fastest commercial speed grade (-6) in a lead-free 1169-pin BGA package. It is the ideal choice for engineers maintaining legacy systems, prototyping embedded logic, or deploying high-density FPGA designs that demand RoHS compliance and maximum routing flexibility.
For broader FPGA selection guidance, visit Xilinx FPGA to compare parts across the full AMD/Xilinx portfolio.
