The XC2S200-6FGG1164C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a -6 speed grade in a 1164-pin Pb-free Fine-Pitch Ball Grid Array (FBGA) package, this device delivers robust programmable logic performance at a competitive price. Whether you are working on telecommunications, industrial automation, medical devices, or embedded systems, the XC2S200-6FGG1164C offers the flexibility and processing power your application demands. For a complete range of programmable logic solutions, explore our Xilinx FPGA catalog.

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What Is the XC2S200-6FGG1164C?

The XC2S200-6FGG1164C belongs to Xilinx’s Spartan-II 2.5V FPGA family — a product line engineered as a cost-effective alternative to mask-programmed ASICs. Unlike fixed-function ASICs, this FPGA can be reprogrammed in the field without any hardware replacement, dramatically reducing product development cycles and engineering risk.

Decoding the Part Number

Understanding the ordering code helps engineers quickly identify the exact variant they need:

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XC2S200-6FGG1164C Key Specifications

Core Logic and Memory Resources

The XC2S200 is the largest device in the Spartan-II family, providing the most gates, CLBs, and memory resources available within the series.

Electrical and Performance Characteristics

Package Information

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XC2S200-6FGG1164C Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1164C is its array of Configurable Logic Blocks. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinational or sequential digital logic function. With 1,176 total CLBs arranged in a 28×42 grid, designers have substantial capacity for complex control logic, state machines, and data path operations.

Block RAM Architecture

Two columns of block RAM are positioned on opposite sides of the die, between the CLB array and the I/O banks. This architecture allows simultaneous access to memory and logic without routing congestion. The 56K bits of total block RAM can be configured as single-port or dual-port memories, making it ideal for FIFOs, lookup tables, and local data buffering.

Input/Output Blocks (IOBs) and I/O Standards

The XC2S200-6FGG1164C supports a wide range of single-ended and differential I/O standards. Its programmable IOBs allow each pin to be individually configured for input, output, or bidirectional operation with selectable drive strength and slew rate control.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide precise clock management. DLLs eliminate clock distribution skew, perform clock multiplication and division, and shift clock phase, enabling reliable high-frequency synchronous designs.

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Spartan-II Family Comparison Table

The XC2S200 sits at the top of the Spartan-II lineup. The table below shows how it compares to other members of the family:

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Speed Grade Comparison for XC2S200

The XC2S200 is available in multiple speed grades. The -6 variant in the XC2S200-6FGG1164C is the fastest option within the Spartan-II family and is exclusively available in the commercial temperature range.

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Key Features of the XC2S200-6FGG1164C

✅ Reprogrammable Logic — No ASIC Mask Costs

Because the XC2S200-6FGG1164C is fully reprogrammable in the field, development teams can iterate on designs, fix bugs, and add features after deployment — something impossible with traditional ASICs. This dramatically lowers the cost and risk of high-volume designs.

✅ Pb-Free (Lead-Free) FGG Package

The double-G in “FGG1164” confirms that this device uses Pb-free solder balls, meeting modern environmental regulations including RoHS compliance standards. This is essential for products sold in European Union markets and other regions with strict hazardous material restrictions.

✅ -6 Speed Grade for Maximum Performance

The -6 speed grade delivers the fastest internal timing paths in the Spartan-II family. For applications requiring the highest achievable clock frequencies and minimum pin-to-pin propagation delays, the XC2S200-6FGG1164C is the optimal choice within the XC2S200 product line.

✅ Four On-Chip DLLs for Precise Clock Control

With four Delay-Locked Loops at each corner of the die, designers can implement multiple independent clock domains with accurate phase and frequency control — essential for high-speed memory interfaces and multi-rate communication systems.

✅ Abundant I/O Flexibility

Supporting up to 284 user I/O pins across multiple configurable I/O banks, the XC2S200-6FGG1164C interfaces easily with a wide range of external components, buses, and communication peripherals, including PCI, SSTL, and HSTL standards.

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Typical Applications for the XC2S200-6FGG1164C

Telecommunications and Networking

The XC2S200-6FGG1164C is well-suited for implementing high-speed communication protocols, line cards, network routers, and signal processing pipelines. Its fast -6 speed grade and abundant I/O make it a capable choice for PHY layer interfaces and data buffering applications.

Industrial Automation and Control

In industrial environments, FPGAs provide the deterministic real-time behavior required for motor control, process monitoring, and machine vision. The XC2S200-6FGG1164C supports the custom logic needed for PLCs, servo drives, and sensor fusion applications.

Medical and Diagnostic Equipment

Medical imaging systems, patient monitoring devices, and diagnostic instruments benefit from the XC2S200-6FGG1164C’s reconfigurable architecture. Engineers can update firmware to adapt to new medical standards and testing protocols without replacing hardware.

Embedded Systems and Prototyping

For teams prototyping ASIC designs or building custom SoC peripherals, the XC2S200-6FGG1164C provides the logic density and I/O count necessary to emulate complex digital systems before committing to silicon.

Security and Surveillance Systems

High-throughput data processing required for biometric identification, encryption engines, and video surveillance pipelines benefits from the FPGA’s parallel processing capabilities and programmable I/O interfaces.

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XC2S200-6FGG1164C vs. Similar Spartan-II Variants

Engineers frequently compare the FGG1164 package variant with smaller-package versions of the same die. The table below highlights the key differences:

Note: The FGG1164 package offers the same user I/O count (284) as the FGG456 package. The higher pin count in the 1164-ball package is occupied by additional power and ground connections, which improves power distribution integrity and signal integrity in high-density board designs.

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Configuration and Design Tool Support

Supported Configuration Modes

The XC2S200-6FGG1164C supports the following standard FPGA configuration modes:

• Master Serial — using Xilinx Platform Flash PROMs
• Slave Serial — driven by an external microcontroller or processor
• Master Parallel — for faster configuration with byte-wide PROM
• Slave Parallel (SelectMAP) — for fast parallel loading
• JTAG / Boundary Scan — IEEE 1149.1 compliant for board-level testing

Recommended Design Software

Xilinx Spartan-II devices including the XC2S200-6FGG1164C are supported by the following design tools:

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Frequently Asked Questions (FAQ)

What does the “6” speed grade mean in XC2S200-6FGG1164C?

The -6 speed grade is the fastest available in the Spartan-II family. It indicates the minimum guaranteed timing performance of the device, including the shortest propagation delays and highest achievable operating frequencies. Note that the -6 speed grade is only offered in the commercial temperature range (0°C to +85°C).

What is the difference between FGG and FG packages?

The extra “G” in FGG indicates a Pb-free (lead-free) package using RoHS-compliant solder balls. An “FG” package uses standard leaded solder. The FGG1164C is therefore the environmentally compliant version.

Is the XC2S200-6FGG1164C still recommended for new designs?

The Spartan-II family is a mature product line. Xilinx (now AMD) does not recommend the XC2S200 series for new designs and suggests engineers evaluate current-generation families such as Spartan-7 or Artix-7 for new development. However, the XC2S200-6FGG1164C remains widely used in legacy system maintenance, military/aerospace legacy programs, and industrial applications with long product life cycles.

What power supply does the XC2S200-6FGG1164C require?

The core logic operates at 2.5V. The I/O banks support multiple voltage standards and can interface with 3.3V, 2.5V, or lower-voltage systems depending on the selected I/O standard.

Can this FPGA be used in automotive applications?

The commercial-grade XC2S200-6FGG1164C is rated for 0°C to +85°C. For automotive-grade requirements, engineers should consult the Xilinx automotive-qualified variants or consider upgrading to a newer FPGA family with automotive-grade certification.

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Summary: Why Choose the XC2S200-6FGG1164C?

The XC2S200-6FGG1164C is the top-tier device in the Spartan-II family, combining the highest available gate count (200K), the fastest speed grade (-6), and a Pb-free 1164-ball package that provides superior power distribution for demanding board designs. Its reprogrammable architecture eliminates ASIC development costs, while its four on-chip DLLs and wide I/O standard support make it adaptable to virtually any digital design challenge.

For engineers sourcing Spartan-II components for legacy system support or evaluating programmable logic solutions across the full AMD Xilinx portfolio, this device offers a proven combination of performance, I/O flexibility, and design toolchain maturity.