What Is the XC2S200-6FGG1163C? A High-Performance Spartan-II FPGA
The XC2S200-6FGG1163C is a field-programmable gate array (FPGA) manufactured by Xilinx (now AMD Xilinx), belonging to the industry-proven Spartan-II family. This device packs 200,000 system gates and 5,292 configurable logic cells into a 1163-ball Fine-Pitch Ball Grid Array (FBGA) Pb-free package, making it one of the most capable and I/O-rich variants in the Spartan-II lineup.
Designed for commercial-temperature applications, the XC2S200-6FGG1163C operates with a 2.5V core voltage and achieves system performance up to 200 MHz. It is therefore an ideal solution for high-volume, cost-sensitive designs that demand the flexibility and reconfigurability of an FPGA over the rigidity of a traditional mask-programmed ASIC.
For engineers and procurement teams looking for a reliable Xilinx FPGA solution, the XC2S200-6FGG1163C delivers an outstanding balance of density, speed, memory, and I/O capacity.
XC2S200-6FGG1163C Key Specifications at a Glance
| Parameter |
Value |
| Part Number |
XC2S200-6FGG1163C |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| Technology Node |
0.18 µm |
| Core Supply Voltage |
2.5V |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O Pins |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Delay-Locked Loops (DLLs) |
4 |
| Speed Grade |
-6 (Fastest available) |
| Package Type |
FGG1163 – Fine-Pitch BGA, Pb-Free |
| Number of Pins |
1,163 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS / Pb-Free |
Yes (FGG = Pb-Free variant) |
Understanding the XC2S200-6FGG1163C Part Number Decoder
Before diving into features, it helps to understand exactly what each segment of the part number means. The XC2S200-6FGG1163C part number is structured as follows:
| Code Segment |
Meaning |
| XC |
Xilinx commercial product identifier |
| 2S |
Spartan-II FPGA family |
| 200 |
200,000 system gates (device density) |
| -6 |
Speed grade –6 (fastest in the Spartan-II family) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (the extra “G” = lead-free) |
| 1163 |
1,163 total package pins |
| C |
Commercial temperature range (0°C to +85°C) |
The -6 speed grade is exclusively available in the Commercial temperature range and represents the highest-performance option within the Spartan-II family. In addition, the FGG (double-G) designation confirms full RoHS compliance and Pb-free construction, which is critical for modern production environments and export regulations.
XC2S200-6FGG1163C Core Architecture & Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1163C contains 1,176 CLBs arranged in a 28×42 grid. Each CLB consists of two slices, and each slice contains two look-up tables (LUTs) and two flip-flops. This architecture enables highly flexible combinational and sequential logic design. As a result, engineers can implement complex state machines, arithmetic units, and custom datapaths with ease.
Block RAM and Distributed RAM
One of the standout features of the XC2S200-6FGG1163C is its dual-memory architecture:
| Memory Type |
Capacity |
Location |
| Distributed RAM |
75,264 bits |
Embedded within CLB LUTs |
| Block RAM |
56,000 bits (56K) |
Dedicated columns on die periphery |
| Total On-Chip RAM |
~131,264 bits |
— |
Block RAM modules support true dual-port operation, enabling simultaneous read and write from two independent ports. This is particularly useful for FIFOs, buffers, and dual-clock domain crossing.
Delay-Locked Loops (DLLs)
The XC2S200-6FGG1163C includes four Delay-Locked Loops (DLLs), one placed at each corner of the die. These DLLs serve several critical functions:
- Clock de-skewing – removes clock distribution delay
- Frequency synthesis – generates derived clock frequencies
- Phase shifting – adjusts clock phase for timing optimization
Therefore, the DLLs dramatically simplify high-speed, multi-clock-domain designs without requiring external clock conditioning circuitry.
Input/Output Blocks (IOBs)
The XC2S200-6FGG1163C offers up to 284 user I/O pins, which is the maximum for the XC2S200 device. Each IOB supports a wide variety of I/O standards, including:
| I/O Standard |
Type |
| LVTTL |
3.3V Low-Voltage TTL |
| LVCMOS |
2.5V / 3.3V CMOS |
| PCI |
3.3V PCI-compliant |
| GTL+ |
Gunning Transceiver Logic Plus |
| HSTL |
High-Speed Transceiver Logic |
| SSTL |
Stub Series Terminated Logic |
| AGP |
Accelerated Graphics Port |
This broad I/O standard support makes the XC2S200-6FGG1163C highly compatible with a wide range of system interfaces and bus architectures.
XC2S200-6FGG1163C vs. Other XC2S200 Package Variants
The XC2S200 die is available in several package options. The FGG1163 package provides the most I/O pins and is therefore best suited for I/O-intensive designs. Here is a comparison of the main available variants:
| Part Number |
Package |
Pins |
Max User I/O |
Pb-Free |
| XC2S200-6PQ208C |
PQFP |
208 |
140 |
No |
| XC2S200-6PQG208C |
PQFP |
208 |
140 |
Yes |
| XC2S200-6FG256C |
FBGA |
256 |
176 |
No |
| XC2S200-6FGG256C |
FBGA |
256 |
176 |
Yes |
| XC2S200-6FG456C |
FBGA |
456 |
176 |
No |
| XC2S200-6FGG456C |
FBGA |
456 |
176 |
Yes |
| XC2S200-6FGG1163C |
FBGA |
1,163 |
284 |
Yes |
As the table clearly shows, the XC2S200-6FGG1163C is the only variant that achieves the full 284 user I/O while also being fully RoHS-compliant. This makes it the preferred choice for designs that require maximum connectivity.
XC2S200-6FGG1163C Speed Grade & Timing Performance
The -6 speed grade is the highest performance option in the Spartan-II family. Key timing benchmarks for the XC2S200-6 include:
| Timing Parameter |
Value |
| Maximum System Frequency |
Up to 200 MHz |
| Internal Clock Speed |
Up to 263 MHz |
| Pin-to-Pin Logic Delay |
~5.5 ns |
| Clock-to-Output (Tco) |
~4.4 ns |
| Setup Time (Tsu) |
~1.8 ns |
Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). Industrial temperature range variants use -5 or -4 speed grades instead.
Top Applications for the XC2S200-6FGG1163C
Because of its high logic density, maximum I/O count, fast speed grade, and Pb-free package, the XC2S200-6FGG1163C is well suited for a broad range of applications:
#### Communications & Networking
The device handles high-speed protocol processing with ease. It is widely used in network switches, routers, DSL modems, and wireless baseband processing units where fast, deterministic logic is essential.
#### Industrial Automation & Control
In industrial environments, the XC2S200-6FGG1163C enables real-time motor control, process monitoring, and programmable logic controller (PLC) replacement. Its field-reconfigurability is a key advantage when system requirements evolve post-deployment.
#### Video & Image Processing
The combination of 75K+ bits of distributed RAM, 56K block RAM, and high I/O count makes this FPGA an excellent choice for image preprocessing pipelines, video frame buffering, and multi-channel sensor data acquisition.
#### Military, Aerospace & Defense (COTS Applications)
Although the “C” suffix indicates a commercial temperature rating, many defense-adjacent programs use COTS-grade FPGAs in controlled enclosures. The device’s reprogrammability supports mission-profile updates without hardware replacement.
#### Embedded Systems & Prototyping
The XC2S200-6FGG1163C serves as a powerful ASIC prototyping platform. Its 200,000-gate equivalent capacity allows engineers to implement and validate complex digital subsystems before committing to silicon.
XC2S200-6FGG1163C: Absolute Maximum Ratings
| Parameter |
Min |
Max |
| Core Supply Voltage (VCCINT) |
–0.5V |
+3.0V |
| I/O Supply Voltage (VCCO) |
–0.5V |
+4.0V |
| Storage Temperature |
–65°C |
+150°C |
| Junction Temperature |
— |
+125°C |
| Input Voltage (any pin) |
–0.5V |
VCCO + 0.5V |
Configuration & Programming the XC2S200-6FGG1163C
The XC2S200-6FGG1163C supports several industry-standard configuration modes, providing flexibility for different system architectures:
| Configuration Mode |
Description |
| Master Serial |
FPGA controls the configuration clock from an external PROM |
| Slave Serial |
External processor drives configuration data serially |
| Master Parallel |
FPGA reads configuration from a parallel flash/PROM |
| Slave Parallel (SelectMAP) |
High-speed byte-wide configuration from a processor |
| JTAG (IEEE 1149.1) |
Boundary-scan and in-system programming |
In addition, the device retains its configuration as long as power is applied. Because the Spartan-II is SRAM-based, configuration must be reloaded on power-up, typically from a Xilinx Platform Flash PROM or external SPI/parallel flash.
Recommended design tools:
- Xilinx ISE Design Suite (legacy, fully supports Spartan-II)
- ModelSim / XSIM for simulation
- ChipScope Pro for in-system debugging
Why Choose the XC2S200-6FGG1163C Over an ASIC?
The XC2S200-6FGG1163C provides several compelling advantages over mask-programmed ASICs, especially for low-to-medium volume production:
| Criterion |
XC2S200-6FGG1163C (FPGA) |
Mask-Programmed ASIC |
| NRE Cost |
$0 – No non-recurring engineering fee |
$500K–$5M+ |
| Time to Market |
Days to weeks |
12–24 months |
| Design Iteration |
Unlimited, in-field reprogramming |
Requires new mask set |
| Risk |
Low – validate before production |
High – costly to fix post-tape-out |
| Volume Economics |
Best for low–medium volume |
Best for very high volume |
First, the FPGA approach eliminates the NRE (non-recurring engineering) cost entirely. Furthermore, any design changes can be deployed in the field with a simple configuration update, which is impossible with a fixed ASIC.
Ordering & Availability Information
The XC2S200-6FGG1163C is an end-of-life (EOL) / last-time-buy component. Xilinx issued a Product Discontinuation Notice (PDN) for the Spartan-II family. Therefore, sourcing should be done through authorized distributors, certified independent distributors, or excess-inventory brokers.
Key ordering details:
| Field |
Value |
| Manufacturer |
Xilinx / AMD |
| Part Number |
XC2S200-6FGG1163C |
| Package |
1163-ball FBGA (Fine-Pitch BGA) |
| RoHS Status |
Compliant (Pb-Free) |
| Lifecycle Status |
EOL / Not Recommended for New Designs |
| Suggested Alternative |
Xilinx Spartan-6 (XC6SLX series) |
Frequently Asked Questions (FAQ) About the XC2S200-6FGG1163C
What does the “C” at the end of XC2S200-6FGG1163C mean?
The “C” suffix denotes the Commercial temperature range, which means the device is rated for operation from 0°C to +85°C ambient/junction temperature. Industrial-grade devices carry an “I” suffix and operate from –40°C to +100°C.
Is the XC2S200-6FGG1163C RoHS compliant?
Yes. The double-G in FGG specifically indicates a Pb-free (lead-free), RoHS-compliant package. This distinguishes it from the older FG456 package (single “G”) which used standard tin-lead solder.
What is the difference between -6 and -5 speed grades?
The -6 speed grade is the fastest in the Spartan-II family, offering shorter propagation delays and higher maximum clock frequencies. However, it is only available in the Commercial temperature range. The -5 speed grade supports both Commercial and Industrial temperature ranges.
Can I use Vivado to program the XC2S200-6FGG1163C?
No. Vivado does not support the Spartan-II family. You must use the Xilinx ISE Design Suite (version 14.7 is the last release and supports Spartan-II devices).
What is a suitable modern replacement for the XC2S200-6FGG1163C?
The Xilinx Spartan-6 LX series (e.g., XC6SLX25 or XC6SLX45) offers significantly more logic resources, a modern 45nm process node, support for Vivado/ISE, and remains in active production.
Conclusion: Is the XC2S200-6FGG1163C Right for Your Design?
The XC2S200-6FGG1163C remains a powerful and proven FPGA choice for legacy system maintenance, spares procurement, and specialized designs that already rely on the Spartan-II architecture. Its combination of the fastest available speed grade (-6), maximum I/O connectivity (284 user I/Os), full Pb-free RoHS compliance, and a robust 0.18µm silicon process makes it a dependable component for commercial-temperature applications.
However, for new designs, migrating to a modern Xilinx Spartan-6 or Artix-7 FPGA is strongly recommended to ensure long-term supply chain continuity and access to current EDA toolchains.
