Meta Description: Buy the XC2S200-6FGG1162C – Xilinx Spartan-II FPGA with 200K system gates, 5,292 logic cells, speed grade -6, and 1162-ball Pb-free FGG BGA package. Full specs, features & datasheet guide.

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The XC2S200-6FGG1162C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It combines 200,000 system gates with a compact 1162-ball Fine-Pitch Ball Grid Array (FGG BGA) package, making it a go-to choice for engineers working on cost-sensitive yet performance-demanding digital designs. Whether you are building communication equipment, industrial control systems, or embedded processing solutions, the XC2S200-6FGG1162C delivers the logic density, I/O flexibility, and speed you need.

Explore the full range of Xilinx FPGA devices to find the right part for your project.

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What Is the XC2S200-6FGG1162C?

The XC2S200-6FGG1162C is a member of Xilinx’s Spartan-II FPGA family, built on a proven 0.18 µm process technology. It operates at a core supply voltage of 2.5V and is rated for commercial temperature range (0°C to +85°C). The “-6” speed grade is the fastest available in the Spartan-II series and is exclusively offered in the commercial temperature range, providing a maximum system performance of up to 200 MHz.

The FGG1162 package is a 1162-ball Fine-Pitch Ball Grid Array with a “G” suffix, indicating a Pb-free (RoHS-compliant) package — critical for modern manufacturing and environmental compliance requirements.

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XC2S200-6FGG1162C Key Specifications

General Product Parameters

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Logic & Memory Resources

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Spartan-II Family Comparison Table

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density and memory resources across the entire lineup.

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XC2S200-6FGG1162C Part Number Breakdown

Understanding the part number helps you identify the exact variant you need before purchasing.

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Key Features of the XC2S200-6FGG1162C

High-Density Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1162C houses 1,176 CLBs arranged in a 28×42 matrix. Each CLB contains Look-Up Tables (LUTs), flip-flops, and multiplexers. This architecture allows engineers to implement complex, custom digital logic designs with high efficiency.

Embedded Block RAM

With 56K bits of block RAM integrated on-chip, the XC2S200-6FGG1162C supports high-speed data buffering, temporary storage, and FIFO implementations. Two columns of block RAM are symmetrically placed on opposite sides of the die for optimized routing access.

Four Delay-Locked Loops (DLLs)

The device includes four on-chip DLLs, one at each corner of the die. These are used for clock distribution, phase alignment, and frequency synthesis, ensuring clean, low-jitter clocking for high-speed system designs.

Rich I/O Flexibility

With up to 284 user I/O pins, the XC2S200-6FGG1162C supports a wide variety of interface standards. I/O blocks (IOBs) are positioned around the device periphery and support multiple voltage levels, enabling seamless communication with external components and mixed-voltage systems.

Pb-Free, RoHS-Compliant Packaging

The “G” designation in the FGG package confirms this part complies with RoHS environmental directives. This is essential for manufacturers targeting European markets, consumer electronics, and any production environment with restrictions on hazardous substances.

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XC2S200-6FGG1162C vs. Similar Variants

The XC2S200-6FGG1162C is the premium variant in its pin-count family — offering the fastest speed grade (-6) with the highest ball count (1162) in a lead-free package.

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Applications of the XC2S200-6FGG1162C

#### Communication Systems

The XC2S200-6FGG1162C handles high-speed data processing and complex signal manipulation, making it well-suited for network routers, serial communication controllers, and protocol bridges.

#### Industrial Automation & Control

In industrial environments, this FPGA drives motor control, process automation, and real-time machine control tasks where deterministic timing and logic flexibility are essential.

#### Embedded Processing & DSP

The combination of large distributed RAM, block RAM, and fast clock rates enables DSP pipelines, signal filtering, and embedded processor architectures within a single chip.

#### Medical Devices

Its reliability and in-field reconfigurability make it a strong fit for medical imaging systems, diagnostic equipment, and patient monitoring devices requiring field-upgradeable firmware.

#### Security & Access Control

The XC2S200-6FGG1162C is used in surveillance systems, biometric identification hardware, and secure access control solutions that demand high data integrity and processing throughput.

#### Aerospace & Defense (Legacy Systems)

Its mature, proven architecture makes it a reliable choice for legacy system maintenance and MRO (Maintenance, Repair & Overhaul) in defense platforms.

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Why Choose the XC2S200-6FGG1162C Over Mask-Programmed ASICs?

Unlike ASICs, the XC2S200-6FGG1162C eliminates costly non-recurring engineering (NRE) fees and lengthy development cycles. Key advantages include:

• Field Upgradeable: Logic can be reprogrammed in-system — no hardware replacement required.
• Lower Development Risk: Changes to design do not require a new silicon spin.
• Faster Time-to-Market: Skip mask fabrication lead times entirely.
• Cost Efficiency at Low–Mid Volumes: Avoid the minimum order quantities common with custom ASICs.

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Design Tools & Software Support

The XC2S200-6FGG1162C is supported by Xilinx’s ISE Design Suite, which includes synthesis, place-and-route, and simulation tools. For newer projects, AMD’s Vivado Design Suite can also be used as a reference, though ISE remains the primary toolchain for Spartan-II devices.

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XC2S200-6FGG1162C Ordering & Availability

When sourcing the XC2S200-6FGG1162C, verify the following to ensure you receive a genuine, quality part:

• Confirm the full part number including speed grade (-6) and package (FGG1162C)
• Ensure the distributor provides date code traceability
• Check for original manufacturer (Xilinx/AMD) documentation and packaging
• Request RoHS compliance certificates where required by your manufacturing process

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Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1162C?
A: The XC2S200-6FGG1162C supports system performance up to 200 MHz with the -6 speed grade.

Q: Is the XC2S200-6FGG1162C RoHS compliant?
A: Yes. The “G” in FGG denotes a Pb-free, RoHS-compliant package.

Q: What temperature range does this part support?
A: The “C” suffix indicates a commercial temperature range of 0°C to +85°C.

Q: What programming software should I use with the XC2S200-6FGG1162C?
A: Xilinx ISE Design Suite is the primary design tool. Use iMPACT for device configuration and programming.

Q: How does the XC2S200-6FGG1162C differ from the XC2S200-5FGG1162C?
A: The only difference is the speed grade. The -6 part offers faster timing performance and is the highest speed grade available for the Spartan-II family.

Q: Is the XC2S200-6FGG1162C recommended for new designs?
A: The Spartan-II family is a mature product line. For new designs, Xilinx recommends newer FPGA families. However, this part remains widely sourced for legacy system maintenance and long-lifecycle applications.