Meta Description: The XC2S200-6FGG1160 is a high-performance Xilinx Spartan-II FPGA featuring 200K system gates, 5,292 logic cells, and a 1160-ball FGG BGA package. Explore full specs, pinout, applications, and ordering info.

The XC2S200-6FGG1160 is a member of the Xilinx Spartan-II 2.5V FPGA family — one of the most cost-effective and versatile programmable logic solutions ever produced by Xilinx (now AMD). Designed for high-volume applications demanding fast performance and flexible logic density, the XC2S200-6FGG1160 delivers 200,000 system gates, 5,292 logic cells, and operates at speeds up to 263 MHz, all within a 1160-ball Fine-Pitch BGA (FGG) Pb-free package. Whether you are designing telecom equipment, industrial automation systems, or embedded computing platforms, this Xilinx FPGA remains a reliable and proven solution.

What Is the XC2S200-6FGG1160?

The XC2S200-6FGG1160 is an FPGA (Field Programmable Gate Array) from Xilinx’s Spartan-II product family. Breaking down the part number:

The “-6” speed grade is the highest-performance grade available in the Spartan-II family and is exclusively offered in the commercial temperature range, making the XC2S200-6FGG1160 the top-tier variant for speed-sensitive designs.

XC2S200-6FGG1160 Key Specifications

Core Logic Resources

Electrical & Speed Characteristics

Package & Mechanical Information

XC2S200-6FGG1160 Architecture Overview

Configurable Logic Blocks (CLBs)

The heart of the XC2S200-6FGG1160 is its array of 1,176 Configurable Logic Blocks, arranged in a 28-column by 42-row matrix. Each CLB contains four logic cells with look-up tables (LUTs), flip-flops, and carry logic, giving designers the flexibility to implement complex combinatorial and sequential digital circuits. The CLBs also provide 75,264 bits of distributed RAM, enabling fast, single-cycle on-chip data storage without requiring external memory.

Block RAM

The XC2S200-6FGG1160 contains 56K bits of dedicated block RAM organized in two columns on opposite sides of the die. This block RAM supports true dual-port operation and is ideal for FIFOs, shift registers, and look-up tables that require higher memory depth.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1160 supports a wide variety of I/O standards, including:

Each IOB supports programmable slew-rate control, pull-up/pull-down resistors, and input delay elements, giving designers maximum flexibility in PCB integration.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are embedded — one at each corner of the die — providing:

• Clock deskew and phase alignment
• Clock multiplication and division
• Spread-spectrum clock support
• Low-jitter clocking for high-speed interfaces

XC2S200-6FGG1160 vs. Other Spartan-II Devices

The XC2S200 is the largest and most capable device in the Spartan-II family. The table below shows how it compares to other family members:

The XC2S200-6FGG1160 offers the highest logic density in the family, making it the preferred choice for complex designs that require maximum gate count and I/O flexibility.

Typical Applications of the XC2S200-6FGG1160

The XC2S200-6FGG1160 FPGA is well-suited for a wide range of applications thanks to its high gate count, generous I/O count, and fast -6 speed grade:

Industrial & Embedded Systems

• Motor control and servo drive logic
• Programmable logic controller (PLC) replacements
• Sensor data fusion and processing

Telecommunications & Networking

• Protocol bridging (PCI, UART, SPI, I²C)
• Line-card logic and framing engines
• High-speed serial data interfaces

Consumer & Enterprise Electronics

• Printer and scanner control ASICs
• Laptop and notebook peripheral controllers
• Display interface logic

 Defense & Aerospace (COTS)

• Signal processing front-ends
• Bus interface logic (VME, PCIe bridge)
• Hardware security modules (HSM logic)

Prototyping & ASIC Emulation

• ASIC prototyping and verification platforms
• Algorithm acceleration on FPGA boards
• Custom IP core development and testing

Why Choose the XC2S200-6FGG1160 Over a Mask-Programmed ASIC?

The Spartan-II XC2S200-6FGG1160 is a cost-effective alternative to mask-programmed ASICs for many design scenarios. Consider these advantages:

For low-to-mid volume production or rapid prototyping, the XC2S200-6FGG1160 offers a compelling value proposition that ASICs simply cannot match.

Configuration and Programming

Configuration Modes

The XC2S200-6FGG1160 supports several configuration modes to suit different system architectures:

Recommended Configuration PROMs

Xilinx XCF (Platform Flash) serial PROMs are the most common companion devices for configuring the XC2S200-6FGG1160 in production designs.

Development & Synthesis Tools

The XC2S200-6FGG1160 is supported by the following Xilinx (AMD) software tools:

Note: The XC2S200-6FGG1160 is supported under Xilinx ISE, not Vivado, as the Spartan-II family predates Vivado’s device support scope. Always verify your toolchain version for Spartan-II compatibility.

Ordering Information and Part Number Decoder

Full Part Number Structure

XC2S200 - 6 - FGG - 1160 - C
   │       │    │     │      └─ Temperature: C = Commercial (0°C to +85°C)
   │       │    │     └──────── Pin Count: 1160 balls
   │       │    └────────────── Package: FGG = Fine-Pitch BGA, Pb-free
   │       └─────────────────── Speed Grade: -6 (fastest)
   └─────────────────────────── Device: Spartan-II, 200K gates

Available Package Options for XC2S200

The FGG1160 package provides the maximum number of signal connections — ideal for complex PCB designs where high I/O routing density is required.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1160 used for?

The XC2S200-6FGG1160 is used in embedded systems, telecom line cards, industrial controllers, ASIC prototyping platforms, and high-speed data processing applications that require a large, programmable logic device with 200K gates and 284 I/O pins.

 Is the XC2S200-6FGG1160 still in production?

The Spartan-II family, including the XC2S200, has reached end-of-life status with Xilinx (now AMD). However, the XC2S200-6FGG1160 remains widely available through authorized distributors, independent component distributors (ICDs), and excess inventory channels for legacy system support and repair.

What is the difference between FGG1160 and FG1160?

The extra “G” in FGG denotes a Pb-free (RoHS-compliant) package. The standard FG1160 package uses traditional tin-lead solder balls, while the FGG1160 uses lead-free solder, making it compliant with EU RoHS directives and most modern environmental regulations.

What speed grade options are available for the XC2S200?

The XC2S200 is available in speed grades -5 and -6. The -6 speed grade is the fastest and is only available in the commercial temperature range (0°C to +85°C). The -5 speed grade is available in both commercial and industrial temperature ranges.

Can I replace an XC2S200-6FGG1160 with a newer Xilinx FPGA?

While the XC2S200-6FGG1160 is not pin-compatible with newer families, Xilinx Spartan-3 and later families offer functional replacements with enhanced capabilities. A redesign is typically required due to package and architectural differences.

Summary: XC2S200-6FGG1160 at a Glance

The XC2S200-6FGG1160 remains one of the most feature-rich devices from the Spartan-II generation. Its combination of high gate count, flexible I/O standards, integrated block RAM, and the fastest available speed grade make it an enduring choice for legacy system maintenance, FPGA-based prototyping, and cost-sensitive production designs where proven reliability matters.