The XC2S200-6FGG1158C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a large 1158-ball Fine-Pitch Ball Grid Array (FBGA) package, this device is engineered for engineers who demand maximum I/O flexibility combined with proven programmable logic performance. Whether you are designing for telecommunications, industrial control, embedded systems, or high-speed data processing, the XC2S200-6FGG1158C delivers a reliable, reprogrammable platform manufactured on an advanced 0.18-micron CMOS process.

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What Is the XC2S200-6FGG1158C? Decoding the Part Number

Understanding the part number is the first step to confirming you have the right component for your design.

The -6 speed grade is exclusively available in the commercial temperature range and represents the highest-performance variant of the XC2S200, making the XC2S200-6FGG1158C ideal for timing-critical, high-throughput applications.

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XC2S200-6FGG1158C Key Specifications at a Glance

Core Logic Resources

Electrical & Physical Characteristics

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XC2S200-6FGG1158C Architecture: Inside the Spartan-II Design

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1158C is built around a 28 × 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two D-type flip-flops or level-sensitive latches. This architecture enables efficient mapping of complex combinational and sequential logic, supporting both synchronous and asynchronous design styles.

CLB Breakdown

SelectRAM™ Hierarchical Memory

One of the most versatile features of the XC2S200-6FGG1158C is its two-tier memory architecture:

• Distributed RAM: Each LUT can be configured as a 16-bit RAM, providing 75,264 bits of fast, distributed storage across the fabric — ideal for small FIFOs, shift registers, and lookup tables tightly coupled with logic.
• Block RAM: Two columns of 4K-bit synchronous block RAM modules provide 56K bits of dedicated on-chip memory for larger buffers, dual-port memory, and data queues without consuming CLB resources.

Input/Output Blocks (IOBs) & I/O Standards

The XC2S200-6FGG1158C’s large 1,158-ball FGG package maximizes available I/O connectivity. Each IOB supports three registers and is highly configurable:

This broad I/O standard support makes it straightforward to interface the XC2S200-6FGG1158C with industry-standard buses, memory interfaces, and mixed-voltage systems.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) are positioned at each corner of the die. These DLLs deliver:

• Zero-delay clock buffering
• Clock edge alignment and phase shifting
• Frequency synthesis and duty-cycle correction
• Reduction of clock skew across the device

Configuration Modes

The XC2S200-6FGG1158C supports multiple standard configuration interfaces, making it adaptable to virtually any system boot architecture:

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Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest and most powerful member of the Xilinx Spartan-II family, offering the maximum available logic, memory, and I/O resources.

The XC2S200-6FGG1158C’s 1,158-pin package specifically targets designs that need the maximum pin count available in the Spartan-II lineup, unlocking all 284 user I/Os and providing extensive power and ground connectivity for system-level stability.

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Key Features & Advantages of the XC2S200-6FGG1158C

Fastest Commercial Speed Grade (-6)

The -6 speed grade represents the peak performance tier of the XC2S200 series, with propagation delays tightly constrained and system clock rates reaching up to 263 MHz. This makes the XC2S200-6FGG1158C the go-to choice for high-throughput data pipelines and timing-critical digital designs.

Lead-Free (Pb-Free) Packaging

The “GG” designation in FGG confirms full RoHS-compliant, lead-free packaging, ensuring compliance with environmental regulations in the EU (RoHS Directive), China (ROHS), and global export markets — a critical requirement for modern electronics manufacturing.

Unlimited Reprogrammability

Unlike mask-programmed ASICs, the XC2S200-6FGG1158C can be reprogrammed an unlimited number of times using SRAM-based configuration. Design revisions, bug fixes, and feature additions are deployed in the field with no hardware replacement, dramatically reducing time-to-market and revision costs.

Superior ASIC Replacement

The Spartan-II XC2S200 was purpose-built as a second-generation ASIC replacement technology. It eliminates ASIC NRE (Non-Recurring Engineering) costs, avoids lengthy mask development cycles, and removes the inherent risk of first-silicon failures — all while offering comparable performance on a cost-effective 0.18-micron process.

Hierarchical Routing Architecture

A powerful, multi-tiered routing fabric connects CLBs, IOBs, and block RAM modules. This hierarchy — comprising local, long-line, and global routing resources — ensures that even complex, high-fanout designs achieve optimal timing closure with minimal routing congestion.

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XC2S200-6FGG1158C Applications: What Is This FPGA Used For?

Thanks to its large gate count, extensive I/O, and high-speed operation, the XC2S200-6FGG1158C is well-suited for a broad range of applications:

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Development Tools & Design Flow for XC2S200-6FGG1158C

Xilinx ISE Design Suite (Recommended)

The XC2S200-6FGG1158C is fully supported by the Xilinx ISE (Integrated Software Environment) design suite. ISE provides:

• HDL synthesis (VHDL, Verilog)
• Place-and-route with timing-driven optimization
• Static timing analysis
• Bitstream generation and configuration file creation
• Simulation integration (ModelSim, ISim)

Note: Newer Xilinx tools such as Vivado do not support legacy Spartan-II devices. ISE remains the correct and only supported toolchain for XC2S200-6FGG1158C design implementation.

Configuration & Programming

The device can be configured via:

• Xilinx Platform Cable USB II (JTAG boundary-scan programming)
• Serial Flash PROM (master serial boot from external EPROM/Flash)
• Parallel PROM (slave parallel mode from external memory)

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XC2S200-6FGG1158C vs. Alternative Part Numbers

Designers sometimes need to evaluate whether a different package or speed grade better fits their requirements. The table below compares common XC2S200 variants:

The XC2S200-6FGG1158C’s 1,158-pin package is the largest available for this device, making it the optimal choice when maximum user I/O utilization and the fastest speed grade are simultaneously required.

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Handling, Storage & PCB Design Guidelines

 Electrostatic Discharge (ESD) Protection

The XC2S200-6FGG1158C, like all CMOS FPGAs, is sensitive to electrostatic discharge. Always handle the device using:

• ESD-safe wrist straps and mats
• Anti-static packaging until point of placement
• Grounded soldering and rework equipment

 Moisture Sensitivity

BGA packages are moisture-sensitive devices (MSD). Follow IPC/JEDEC J-STD-020 guidelines for baking and storage to prevent delamination during reflow soldering.

PCB Design Recommendations

• Use a multi-layer PCB with dedicated power and ground planes for VCCINT (2.5V) and VCCO rails
• Implement decoupling capacitors (100nF ceramic) placed as close as possible to each VCCINT/VCCO pin pair
• Follow Xilinx PCB Design Guidelines for BGA escape routing with 0.8mm–1.0mm ball pitch considerations
• Apply controlled-impedance routing on high-speed I/O signals

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Frequently Asked Questions (FAQ) About XC2S200-6FGG1158C

Q: Is the XC2S200-6FGG1158C still in production? The Spartan-II family has been subject to product discontinuation notices (PDN). Buyers should verify current availability through authorized distributors and consider last-time-buy opportunities or pin-compatible migration to newer Spartan-3 or Spartan-6 devices for new designs.

Q: What is the difference between FGG and FG in the part number? The extra “G” in “FGG” indicates a lead-free, RoHS-compliant package. The “FG” variant uses standard tin-lead (SnPb) solder balls and is not RoHS compliant.

Q: Can I replace the XC2S200-6FGG1158C with a Spartan-3 device? Spartan-3 devices offer significantly higher gate counts, lower power, and newer process nodes. However, they are not pin-compatible and require design migration. For applications requiring pin compatibility, other XC2S200 package variants should be used.

Q: What is the maximum number of user I/Os available in the 1158-pin package? The 1,158-pin FGG package provides access to all 284 maximum user I/Os of the XC2S200 device, plus four global clock/user input pins, maximizing the connectivity potential of the silicon.

Q: Does this device support JTAG boundary scan? Yes. The XC2S200-6FGG1158C includes full IEEE 1149.1 JTAG boundary-scan support for in-system testing, configuration, and debug.

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Why Choose the XC2S200-6FGG1158C for Your Design?

The XC2S200-6FGG1158C combines the largest logic capacity in the Spartan-II family, the fastest available speed grade, a maximum-pin-count lead-free package, and a proven 0.18-micron architecture into a single component. It eliminates ASIC risk, accelerates product development, and provides the flexibility of unlimited reprogrammability — all at a cost point well below custom silicon.

For engineers sourcing Xilinx programmable logic devices, the XC2S200-6FGG1158C remains a benchmark component for high-I/O, high-performance legacy and industrial system designs. Explore the full range of Xilinx FPGA solutions to find the right device for your next project.