Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1156C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1156C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers up to 200,000 system gates in a fine-pitch ball grid array (FBGA) package with 1,156 pins. Whether you are prototyping a complex digital design or replacing a mask-programmed ASIC, the XC2S200-6FGG1156C provides the programmability, speed, and I/O density your project demands.

If you are sourcing Xilinx Spartan-II devices, explore the full selection at Xilinx FPGA for competitive pricing and availability.


What Is the XC2S200-6FGG1156C?

The XC2S200-6FGG1156C is the largest member of the Spartan-II FPGA family, manufactured by Xilinx (now AMD). It is built on a 0.18 µm, 6-layer copper CMOS process and operates at a core voltage of 2.5V. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with ~200K system gates
-6 Speed grade 6 (fastest commercially available)
FGG Fine-pitch Ball Grid Array, Pb-free package
1156 1,156 total ball count
C Commercial temperature range (0°C to +85°C)

Key Features of the XC2S200-6FGG1156C

The XC2S200-6FGG1156C stands out among Spartan-II FPGAs due to its rich feature set optimized for high I/O count applications and complex logic designs.

Logic and Memory Architecture

  • 5,292 Logic Cells organized in a 28×42 CLB array
  • 1,176 Configurable Logic Blocks (CLBs), each containing two slices with look-up tables (LUTs) and flip-flops
  • 75,264 bits of distributed RAM embedded within the CLB array
  • 56K bits of dedicated Block RAM (four 14K-bit dual-port block RAM modules)
  • Four Delay-Locked Loops (DLLs) for clock management and deskewing

I/O and Packaging

  • 284 maximum user I/Os (not including four dedicated global clock inputs)
  • Housed in a 1,156-ball Fine-Pitch BGA package — the highest pin-count package in the Spartan-II lineup, enabling dense board designs
  • Supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and CTT

Speed and Performance

  • Speed grade -6 — the fastest available for the XC2S200 in commercial temperature range
  • System clock frequency up to 263 MHz
  • Propagation delay as low as 2.8 ns for fast combinatorial paths

XC2S200-6FGG1156C Full Technical Specifications

Parameter Specification
Manufacturer Xilinx (AMD)
Family Spartan-II
Part Number XC2S200-6FGG1156C
Logic Cells 5,292
System Gates ~200,000
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 57,344 bits (56K)
Max User I/Os 284
DLLs 4
Speed Grade -6
Max Frequency 263 MHz
Core Voltage 2.5V
I/O Voltage 3.3V / 2.5V (programmable)
Process Technology 0.18 µm, 6-layer Cu CMOS
Package 1156-ball FBGA (FGG)
Package Type Fine-Pitch Ball Grid Array (Pb-free)
Operating Temperature 0°C to +85°C (Commercial)
Configuration Cells 1,335,840

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The table below compares the XC2S200-6FGG1156C’s core device — the XC2S200 — against other members of the Spartan-II family to help you choose the right device for your application.

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8×12 96 86 6,144 16K
XC2S30 972 30,000 12×18 216 92 13,824 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 56K

The XC2S200 is the top-of-range device in the Spartan-II family, making it ideal when maximum gate count and I/O density are required.


Configuration Modes Supported

The XC2S200-6FGG1156C supports multiple industry-standard configuration modes, giving designers flexibility in how the device is programmed on the board.

Configuration Mode Pre-config Pull-ups CCLK Direction Data Width Serial DOUT
Master Serial No Output 1 bit Yes
Slave Serial Yes Input 1 bit Yes
Slave Parallel Yes Input 8 bits No
Boundary-Scan (JTAG) Yes N/A 1 bit No

Supported I/O Standards

The XC2S200-6FGG1156C’s programmable I/O buffers support a wide range of single-ended and differential signaling standards:

I/O Standard Type Voltage
LVTTL Single-ended 3.3V
LVCMOS33 / LVCMOS25 Single-ended 3.3V / 2.5V
PCI Single-ended 3.3V
GTL / GTL+ Single-ended Ref-based
HSTL I / HSTL III Single-ended Ref-based
SSTL2 / SSTL3 Single-ended Ref-based
CTT Single-ended Ref-based

XC2S200-6FGG1156C vs. Other Package Options

Xilinx offered the XC2S200 in several package variants. The FGG1156 is the largest and most I/O-capable option:

Part Number Package Pin Count Max User I/Os Pb-Free
XC2S200-6PQ208C PQFP 208 140 No
XC2S200-6PQG208C PQFP 208 140 Yes
XC2S200-6FG256C FBGA 256 176 No
XC2S200-6FGG256C FBGA 256 176 Yes
XC2S200-6FG456C FBGA 456 284 No
XC2S200-6FGG456C FBGA 456 284 Yes
XC2S200-6FGG1156C FBGA 1,156 284 Yes

Note: The FGG1156 package offers the same 284 user I/Os as the FGG456 but in a larger physical footprint, which can be advantageous for boards requiring more generous ball pitch for ease of PCB routing and assembly.


Applications: Who Should Use the XC2S200-6FGG1156C?

The XC2S200-6FGG1156C is a proven solution across multiple industries and use cases. Its large gate count, abundant block RAM, and 284 I/Os make it especially suitable for:

### Digital Communications

  • Ethernet MAC and PHY interfaces
  • Serial protocol controllers (UART, SPI, I²C)
  • High-speed data multiplexing

### Signal Processing

  • DSP pipelines for audio and video processing
  • FIR/IIR filter implementations using distributed RAM
  • Image buffering leveraging block RAM

### Embedded Systems Prototyping

  • Soft-core processor implementations (e.g., MicroBlaze-compatible designs)
  • Rapid ASIC prototyping and emulation
  • SoC (System-on-Chip) design validation

### Industrial Control

  • Motor drive controllers
  • PLC (Programmable Logic Controller) logic replacement
  • Real-time sensor data acquisition

### Legacy System Replacement

  • Drop-in FPGA replacement for obsolete ASICs or CPLDs
  • Bridging legacy bus protocols to modern interfaces

Development Tools for the XC2S200-6FGG1156C

Xilinx’s ISE Design Suite is the primary development toolchain for Spartan-II devices. Because the Spartan-II is a legacy family, it is not supported in Vivado. Engineers working with this device should use:

  • Xilinx ISE (version 14.7, the final release — free WebPACK edition available)
  • VHDL or Verilog hardware description languages
  • JTAG-based programming via Xilinx Platform Cable USB or compatible programmer
  • ChipScope Pro for in-system logic analysis and debugging

Ordering and Availability

The XC2S200-6FGG1156C is a legacy/end-of-life part from Xilinx. Stock availability varies among authorized distributors and the open market. When sourcing this component, verify:

  1. Date code and lot traceability — essential for counterfeit avoidance
  2. Pb-free (RoHS) compliance — the “G” in “FGG” confirms this device is Pb-free
  3. Temperature grade — the “C” suffix confirms commercial range (0°C to +85°C)
  4. ESD and moisture sensitivity — store in dry, anti-static packaging (MSL rating applies)

Frequently Asked Questions (FAQ)

What does the -6 speed grade mean on the XC2S200-6FGG1156C?

Speed grade -6 is the fastest speed grade available for the XC2S200 in the commercial temperature range. A higher number indicates better performance with shorter propagation delays and higher achievable clock frequencies (up to 263 MHz).

Is the XC2S200-6FGG1156C RoHS compliant?

Yes. The “G” in the “FGG” package designation indicates that this is a Pb-free, RoHS-compliant package variant.

What is the difference between FGG1156 and FGG456 packages?

Both packages support the same maximum of 284 user I/Os for the XC2S200 device. The FGG1156 has a larger physical ball array (1,156 balls), which results in a coarser effective ball pitch and can simplify PCB layout and manufacturing. This makes it preferable for designs where PCB routing density or assembly yield is a concern.

Can I program this FPGA with Vivado?

No. Xilinx Vivado does not support the Spartan-II family. You must use Xilinx ISE 14.7 (the final supported release) for design, synthesis, implementation, and programming of the XC2S200-6FGG1156C.

What core voltage does the XC2S200-6FGG1156C require?

The device requires a 2.5V core supply (VCCINT). I/O banks can be powered at 3.3V or 2.5V depending on the selected I/O standard.


Summary

The XC2S200-6FGG1156C remains a reliable and capable FPGA for legacy system maintenance, ASIC prototyping, and industrial applications demanding a high I/O count in a well-understood, mature architecture. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, 284 user I/Os, and the fastest -6 speed grade in the Spartan-II commercial lineup, this device continues to serve engineers who need a proven programmable solution.

For sourcing and pricing information on Xilinx Spartan-II and other Xilinx devices, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.