The XC2S200-6FGG1155C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume applications that demand fast programmable logic, the XC2S200-6FGG1155C delivers 200,000 system gates, 5,292 logic cells, and a rich feature set — all within a 2.5V architecture. Whether you are designing embedded systems, communications equipment, or industrial controllers, this device offers a proven, flexible, and cost-effective alternative to mask-programmed ASICs.

For a broader selection of compatible devices, visit Xilinx FPGA — a trusted source for Xilinx programmable logic solutions.

What Is the XC2S200-6FGG1155C?

The XC2S200-6FGG1155C is part of the Xilinx Spartan-II FPGA family, a 2.5V, SRAM-based programmable logic device manufactured on a 0.18µm process. The part number decodes as follows:

This device is a member of the largest density option within the Spartan-II family, making it ideal for logic-intensive designs that require maximum resources at minimal cost.

XC2S200-6FGG1155C Key Specifications

Core Logic Resources

Electrical & Timing Characteristics

Package Information

XC2S200-6FGG1155C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture consists of look-up tables (LUTs), flip-flops, and carry logic arranged in a highly efficient matrix. The XC2S200 features a 28 × 42 CLB array with 1,176 total CLBs, each containing four slices — offering rich logic density for complex combinational and sequential designs.

Block RAM

The XC2S200-6FGG1155C includes 56K bits of block RAM distributed across two dedicated RAM columns on opposite sides of the die. Each block RAM is a true dual-port memory configurable for various width/depth combinations, ideal for FIFOs, lookup tables, and data buffering.

Distributed RAM

With 75,264 bits of distributed RAM embedded within the CLB fabric, the device supports fast on-chip data storage without consuming dedicated block RAM resources — a key advantage in bandwidth-intensive signal processing applications.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide precise clock management, phase alignment, and frequency synthesis. This enables glitch-free, jitter-minimized clocking essential for high-speed digital interfaces.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1155C supports up to 284 user I/O pins, each individually configurable for a wide range of I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. The 1,155-pin FGG package provides abundant connectivity for complex multi-bus or high-density board designs.

Configuration Modes

The XC2S200-6FGG1155C supports multiple configuration modes, allowing flexible integration into diverse system architectures:

The device begins configuration on power-up and enters user mode as soon as the bitstream is fully loaded. The JTAG boundary-scan mode supports IEEE 1149.1 compliance for in-system testing and debugging.

Spartan-II Family Comparison

To understand where the XC2S200 fits in the Spartan-II lineup, see the complete family comparison below:

The XC2S200 is the highest-density member of the Spartan-II family, providing the most logic, I/O, and memory resources available in this product line.

Why Choose the XC2S200-6FGG1155C?

#### Cost-Effective Alternative to ASICs

The Spartan-II XC2S200-6FGG1155C is engineered as a cost-effective replacement for mask-programmed ASICs. It eliminates ASIC NRE (Non-Recurring Engineering) costs, shortens time-to-market, and allows field upgrades via reprogramming — none of which are possible with a fixed ASIC.

#### High I/O Density with 1,155-Pin FGG Package

The large FGG1155 BGA package provides access to all 284 user I/O pins with room to spare, enabling complex multi-interface board designs, multi-bus systems, and high pin-count peripherals without board redesign.

#### Speed Grade -6 — Maximum Performance

The -6 speed grade is the fastest available within the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1155C the optimal choice for timing-critical applications requiring system performance up to 200 MHz.

#### Pb-Free (RoHS Compliant) Packaging

The FGG designation confirms Pb-Free solder ball packaging, meeting RoHS environmental requirements for modern electronics manufacturing. This is critical for designs targeting EU markets and global compliance standards.

#### Flexible I/O Standard Support

Supporting a wide range of single-ended and differential I/O standards (LVTTL, LVCMOS18/25/33, PCI, GTL/GTL+, HSTL, SSTL), the device integrates easily into mixed-voltage board environments without the need for external level-translation components.

Typical Applications for the XC2S200-6FGG1155C

The XC2S200-6FGG1155C is widely deployed across industries wherever re-programmable, high-density logic is required:

Ordering & Part Number Decoding

When ordering the XC2S200-6FGG1155C, it is important to understand the full part number structure:

XC2S200 - 6 - FGG - 1155 - C
  |        |    |     |     |
  |        |    |     |     +-- Temperature: C = Commercial (0°C to +85°C)
  |        |    |     +-------- Pin Count: 1155
  |        |    +-------------- Package: FGG = Fine-pitch BGA, Pb-Free
  |        +------------------- Speed Grade: -6 (fastest)
  +---------------------------- Device: Spartan-II, 200K gates

Note: The “G” in “FGG” signifies the Pb-Free (RoHS) version. The standard Pb package would be “FG”. The -6 speed grade is exclusively available in the Commercial temperature range.

Design Tool Support

The XC2S200-6FGG1155C is supported by Xilinx’s legacy ISE Design Suite, which provides a complete RTL-to-bitstream flow including synthesis, simulation, place-and-route, and programming. Engineers migrating to newer tooling may also reference AMD’s current documentation archives for Spartan-II design support files.

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1155C RoHS compliant? Yes. The “FGG” in the part number confirms Pb-Free BGA packaging, making it RoHS compliant for use in environmentally regulated markets.

Q: What is the maximum operating frequency of the XC2S200-6FGG1155C? The device supports system performance up to 200 MHz. The -6 speed grade offers the best timing performance within the Spartan-II family.

Q: Can the XC2S200-6FGG1155C be reprogrammed in the field? Yes. As an SRAM-based FPGA, it can be reconfigured as many times as needed, either via JTAG, Master Serial, or Slave Parallel configuration modes.

Q: What is the operating temperature range? The “C” suffix indicates the Commercial temperature range: 0°C to +85°C. The -6 speed grade is only available in this commercial range.

Q: What I/O standards does the XC2S200-6FGG1155C support? The device supports LVTTL, LVCMOS (1.8V, 2.5V, 3.3V), PCI, GTL, GTL+, HSTL, SSTL2, and SSTL3 among others.

Summary

The XC2S200-6FGG1155C delivers the highest logic density in the Xilinx Spartan-II family, packaged in a Pb-free 1,155-pin FGG BGA with the fastest available -6 speed grade. With 200,000 system gates, 284 user I/O pins, 75,264 bits of distributed RAM, 56K bits of block RAM, and four on-chip DLLs, this FPGA is a powerful and economical solution for high-volume, performance-sensitive digital designs. Its reprogrammability, wide I/O standard support, and ASIC-alternative economics make it a go-to choice for engineers across telecommunications, industrial, embedded, and consumer electronics markets.