The XC2S200-6FGG1151C is a high-density, commercial-grade Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Combining 200,000 system gates, a fast -6 speed grade, and a large 1151-ball fine-pitch BGA package, this device is engineered for engineers who need maximum I/O flexibility in cost-sensitive, high-volume designs. Whether you are working in telecommunications infrastructure, industrial control, or embedded computing, the XC2S200-6FGG1151C delivers the programmable logic density and pin count to bring complex digital designs to life.
What Is the XC2S200-6FGG1151C? — Part Number Breakdown
Understanding the part number helps engineers quickly identify the exact variant they need:
| Field |
Value |
Meaning |
| XC2S200 |
Device |
Spartan-II family, 200K system gates |
| -6 |
Speed Grade |
Fastest available speed grade for Spartan-II (-6) |
| FGG |
Package Type |
Fine-Pitch Ball Grid Array, Pb-free (lead-free) |
| 1151 |
Pin Count |
1,151 solder balls |
| C |
Temperature Range |
Commercial (0°C to +85°C) |
Key Insight: The “G” suffix in “FGG” confirms this is a RoHS-compliant, Pb-free package — critical for designs targeting EU markets or modern manufacturing standards.
XC2S200-6FGG1151C Core Specifications at a Glance
| Parameter |
Specification |
| Manufacturer |
Xilinx (AMD) |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 total CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (fastest for Spartan-II) |
| Max System Clock |
Up to 200 MHz |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm |
| Package |
FGG1151 (Fine-Pitch BGA, 1151 balls) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Status |
Compliant (Pb-free “G” suffix) |
XC2S200-6FGG1151C Architecture and Internal Logic Features
Configurable Logic Blocks (CLBs)
The XC2S200 contains 1,176 CLBs arranged in a 28-column by 42-row matrix. Each CLB contains four logic cells, and every logic cell includes a 4-input Look-Up Table (LUT), a storage element (flip-flop or latch), and dedicated carry logic. This architecture enables efficient implementation of arithmetic, counters, state machines, and custom digital logic pipelines.
Distributed RAM and Block RAM Resources
| Memory Type |
Total Capacity |
| Distributed RAM (in CLBs) |
75,264 bits |
| Block RAM |
56,000 bits (56K) |
| Combined On-Chip Memory |
~131 Kbits |
The two dedicated Block RAM columns flanking the CLB array provide high-speed, dual-port synchronous memory for FIFOs, look-up tables, and data buffering — without consuming any CLB resources.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide clock deskewing, frequency synthesis, and phase shifting. The DLLs are essential for building high-speed synchronous systems with tight timing margins.
Input/Output Blocks (IOBs)
With up to 284 user I/O pins in this device, the IOBs support:
- Single-ended standards: LVTTL, LVCMOS2, PCI, GTL, SSTL2, SSTL3
- Differential I/O signaling capability
- Programmable input delay to meet setup time requirements
- 3-state output control
FGG1151 Package Details
The FGG1151 package is a Fine-Pitch Ball Grid Array with 1,151 solder balls, designed for high-pin-count applications where PCB space must be used efficiently. Compared to smaller packages in the Spartan-II family (such as the FG256 or PQ208), the FGG1151 unlocks the full I/O capability of the XC2S200 die.
| Package Attribute |
Detail |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Ball Count |
1,151 |
| Lead Finish |
Pb-free (RoHS compliant) |
| Mounting Style |
Surface Mount (SMD) |
| Ball Pitch |
Fine pitch |
| Temperature Grade |
Commercial (C) |
Design Note: The large 1151-ball footprint demands careful PCB stack-up planning and controlled-impedance routing. Xilinx application notes recommend a minimum of 8-layer PCB construction for designs utilizing high I/O counts in this package.
Speed Grade -6: Performance Advantages
The -6 speed grade is the fastest speed grade available for the Spartan-II XC2S200. According to Xilinx documentation, this grade is exclusively available in the Commercial temperature range, making the XC2S200-6FGG1151C a purpose-built choice for performance-critical, commercial-environment applications.
| Speed Grade |
Availability |
Max Frequency |
| -6 |
Commercial only |
Up to 200 MHz system performance |
| -5 |
Commercial & Industrial |
Moderate |
| -4 |
Industrial only |
Conservative |
Choosing the -6 speed grade is ideal when your design involves high-speed serial communication, fast DSP data paths, or tightly constrained timing closure requirements.
XC2S200 Spartan-II Family Comparison
The XC2S200 sits at the top of the six-member Spartan-II family:
| Device |
Logic Cells |
System Gates |
CLB Array |
User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 provides approximately 36% more logic cells than the XC2S150, along with the highest block RAM capacity and user I/O count in the entire Spartan-II family.
Key Applications for the XC2S200-6FGG1151C
The high I/O count of the FGG1151 package combined with the -6 speed grade and 200K gate density makes this component well-suited for:
Telecommunications & Networking
Line cards, protocol bridging, framing logic, and multi-channel signal processing benefit from the large I/O bus width and the on-chip DLL-driven clock management.
Industrial Automation & Control
Motor control systems, PLC replacement logic, encoder interfaces, and high-speed sensor acquisition pipelines can leverage the abundant CLB resources and flexible I/O standards.
Embedded Computing & Co-Processing
Custom bus controllers, PCIe/PCI glue logic, cache controllers, and co-processor accelerators for embedded systems benefit from the 200K gate density.
Test & Measurement Equipment
Logic analyzers, data acquisition systems, and automated test equipment (ATE) use the high I/O pin count of the FGG1151 package to interface directly with large device-under-test (DUT) buses.
Legacy System Maintenance & Repair
Many military, aerospace, and industrial OEM systems built in the early 2000s were designed around Spartan-II FPGAs. The XC2S200-6FGG1151C remains critical for board repair, reverse engineering support, and lifecycle extension programs.
Design Tool Support
The XC2S200-6FGG1151C is supported by Xilinx’s legacy ISE Design Suite. Engineers implementing new designs around Spartan-II should note the following toolchain information:
| Tool |
Notes |
| ISE Design Suite |
Primary tool for Spartan-II synthesis, implementation, and bitstream generation |
| VHDL / Verilog |
Both HDL languages fully supported |
| Vivado |
Does NOT support Spartan-II; use ISE only |
| ChipScope Pro |
Supported for in-system debug |
| iMPACT |
Programming/configuration tool for JTAG and SelectMAP |
For new projects requiring modern toolchain support and longer device availability, AMD/Xilinx recommends evaluating newer FPGA families. However, for maintenance of existing designs or legacy-compatible replacements, the XC2S200-6FGG1151C remains the correct device.
Configuration and Programming
Spartan-II FPGAs including the XC2S200 support multiple configuration modes:
| Configuration Mode |
Description |
| Master Serial |
FPGA controls a serial PROM |
| Slave Serial |
External controller drives serial data |
| Master Parallel (SelectMAP) |
8-bit parallel interface for fast configuration |
| Slave Parallel (SelectMAP) |
Host-controlled 8-bit parallel loading |
| JTAG (Boundary Scan) |
IEEE 1149.1 compliant; used for testing and partial config |
| Express |
High-speed parallel configuration |
Configuration data is stored externally in a Xilinx Platform Flash PROM (e.g., XCF01S or XCF02S). The FPGA loads its configuration bitstream at power-up and is fully operational within milliseconds.
Electrical Characteristics Summary
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V ± 5% |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V (bank-configurable) |
| Input Voltage (VIH/VIL) |
Per I/O standard selected |
| Operating Temperature |
0°C to +85°C (Commercial) |
| ESD Protection |
Industry-standard IOB protection |
| Power Consumption |
Depends on design activity and I/O switching |
Ordering Information
| Part Number |
Speed Grade |
Package |
Temp Range |
Pb-Free |
| XC2S200-6FGG1151C |
-6 (Fastest) |
FGG1151 (1151-Ball BGA) |
Commercial (0 to +85°C) |
Yes ✓ |
| XC2S200-5FGG1151C |
-5 |
FGG1151 |
Commercial |
Yes ✓ |
| XC2S200-6FG456C |
-6 |
FG456 (456-Ball BGA) |
Commercial |
No |
| XC2S200-6PQ208C |
-6 |
PQ208 (208-Pin PQFP) |
Commercial |
No |
Note: The “G” in “FGG” distinguishes the Pb-free package from the standard “FG” package. Always verify the Pb-free vs. standard designation when ordering for RoHS-compliant manufacturing.
XC2S200-6FGG1151C vs. Competitors
| Feature |
XC2S200-6FGG1151C |
Altera Cyclone EP1C20 |
Lattice EC20 |
| System Gates |
200,000 |
~20,000 LE equivalent |
~20,000 LUT4 |
| Speed Grade |
-6 (200 MHz) |
Up to 200 MHz |
Up to 200 MHz |
| On-Chip RAM |
~131 Kbits |
~294 Kbits |
~240 Kbits |
| I/O Pins |
284 |
301 |
270 |
| Core Voltage |
2.5V |
1.5V |
1.2V |
| Process Node |
0.18 µm |
0.13 µm |
0.13 µm |
| Toolchain |
ISE Design Suite |
Quartus II |
Diamond |
While newer devices offer lower core voltages and denser logic, the Spartan-II family’s maturity, robust documentation, and supply chain availability make the XC2S200-6FGG1151C the right choice for legacy-compatible and long-lifecycle designs.
Frequently Asked Questions (FAQ)
Q: Is the XC2S200-6FGG1151C recommended for new designs? Xilinx/AMD classifies the Spartan-II family as “Not Recommended for New Designs” (NRND). For new designs, Xilinx recommends migrating to newer families such as Spartan-7 or Artix-7. However, for repair, legacy support, or existing Spartan-II based systems, this part remains fully viable.
Q: What is the difference between FGG1151 and FG1152 packages? The FGG1151 is a lead-free (Pb-free) BGA package with 1,151 balls. Always verify ball count and lead finish against your PCB land pattern when substituting packages.
Q: Can Vivado be used with this device? No. AMD’s Vivado Design Suite does not support the Spartan-II family. Use the Xilinx ISE Design Suite (version 14.7 is the final release) for all XC2S200 designs.
Q: What PROM should be used to configure the XC2S200? Xilinx Platform Flash PROMs such as the XCF01S (1 Mbit) or XCF02S (2 Mbit) are recommended companion devices for Spartan-II configuration.
Q: What is the commercial temperature range for the “-C” suffix? Commercial grade specifies an operating junction temperature range of 0°C to +85°C. For industrial temperature range (-40°C to +85°C), look for parts with an “I” suffix.
Where to Buy the XC2S200-6FGG1151C
The XC2S200-6FGG1151C is available through authorized distributors and specialty component brokers. For a comprehensive selection of Spartan-II and other programmable logic devices, visit Xilinx FPGA for sourcing options and availability.
When purchasing, always request:
- Certificate of Conformance (CoC)
- RoHS compliance documentation
- Date code and country of origin declaration
- Anti-counterfeit verification from authorized distribution channels
Conclusion
The XC2S200-6FGG1151C is the flagship device of the Xilinx Spartan-II family — combining 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and the fastest -6 speed grade in a RoHS-compliant 1151-ball fine-pitch BGA package. While not intended for new design starts, it remains an essential component for legacy system maintenance, field repair, and long-lifecycle industrial applications. Its proven architecture, well-documented tool support via ISE Design Suite, and multi-mode configuration flexibility make it a reliable and thoroughly understood programmable logic device for demanding engineering environments.
