Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1149C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

The XC2S200-6FGG1149C is a high-density Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family. Delivering up to 200,000 system gates in a robust 1149-ball Fine-Pitch BGA package, this device is engineered for high-volume, cost-sensitive applications that demand programmable logic without sacrificing performance. Whether you’re developing telecommunications infrastructure, industrial control systems, or embedded computing platforms, the XC2S200-6FGG1149C offers an outstanding balance of logic capacity, I/O flexibility, and 2.5V low-power operation.


What Is the XC2S200-6FGG1149C?

The XC2S200-6FGG1149C is part of Xilinx’s Spartan-II FPGA series, a family of 2.5V programmable logic devices built on advanced 0.18µm CMOS technology. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest available; commercial range only)
FGG Fine-Pitch Ball Grid Array, Pb-free packaging
1149 1149-pin package
C Commercial temperature range (0°C to +85°C)

This device is a superior, cost-effective alternative to mask-programmed ASICs, eliminating long development cycles and allowing in-field design upgrades — something conventional ASICs cannot support.


XC2S200-6FGG1149C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Block RAM Modules 14

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6 (Fastest in Spartan-II)
Maximum Clock Frequency Up to 263 MHz
Technology Node 0.18µm CMOS
Operating Temperature 0°C to +85°C (Commercial)

Package Information

Parameter Detail
Package Type Fine-Pitch BGA (FGG)
Pin Count 1,149
Lead-Free (Pb-Free) Yes (“G” suffix in FGG)
Package Marking XC2S200 -6 FGG 1149 C

XC2S200-6FGG1149C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 array. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and dedicated carry logic. This architecture enables efficient implementation of arithmetic, data-path, and control logic functions.

Block RAM

The device includes 14 block RAM modules, each providing 4K bits of synchronous dual-port RAM, totaling 56K bits of on-chip memory. Block RAM supports independent read/write clock domains, making it ideal for FIFOs, data buffers, and lookup table applications.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1149C supports multiple I/O standards, including LVTTL, LVCMOS (1.5V, 2.5V, 3.3V), PCI (33 MHz/66 MHz), GTL, HSTL, SSTL2, and SSTL3. Each IOB features programmable slew rate, optional pull-up/pull-down resistors, and input delay elements.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide zero-propagation-delay clock distribution, clock phase shifting, and frequency synthesis. DLLs significantly reduce clock skew across the entire device fabric.

Configuration & Programming

Configuration Mode CCLK Direction Data Width
Master Serial Output 1-bit
Slave Serial Input 1-bit
Slave Parallel (SelectMAP) Input 8-bit
Boundary-Scan (JTAG) N/A 1-bit

The XC2S200 supports JTAG (IEEE 1149.1) boundary-scan testing, simplifying board-level test and in-system programming. Configuration data can be stored in external PROMs (e.g., Xilinx XCF series) or loaded via a microprocessor interface.


XC2S200-6FGG1149C vs. Other Spartan-II Devices

Understanding where the XC2S200 sits in the Spartan-II family helps engineers select the right device for their design requirements.

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8 × 12 86 16K
XC2S50 1,728 50,000 16 × 24 176 32K
XC2S100 2,700 100,000 20 × 30 176 40K
XC2S150 3,888 150,000 24 × 36 260 48K
XC2S200 5,292 200,000 28 × 42 284 56K

The XC2S200 is the highest-capacity device in the Spartan-II family, offering the most logic cells, the widest I/O count, and the largest memory capacity — making it the preferred choice for the most demanding Spartan-II designs.


Speed Grade -6: Why It Matters

The -6 speed grade is the fastest speed grade offered in the Spartan-II family and is exclusively available in the Commercial temperature range. Compared to slower grades (-5, -4), the -6 grade delivers:

  • Lower propagation delays through LUTs and routing
  • Higher maximum system clock frequencies (up to 263 MHz)
  • Tighter setup and hold time margins

For timing-critical applications such as high-speed data interfaces, signal processing pipelines, or fast control loops, specifying the -6 speed grade ensures the design has adequate timing margin.


Typical Applications of the XC2S200-6FGG1149C

The XC2S200-6FGG1149C is well-suited for a broad range of industries and applications:

#### Telecommunications & Networking

  • Line card logic and protocol processing
  • Framer/mapper interfaces
  • High-speed serial data handling

#### Industrial Automation & Control

  • Motor control interfaces
  • PLC co-processing
  • Real-time sensor fusion

#### Embedded Computing & SoC Prototyping

  • Processor peripheral glue logic
  • Custom DSP pipelines
  • Co-simulation and hardware emulation

#### Test & Measurement Equipment

  • Digital signal acquisition
  • Pattern generation
  • High-speed I/O bridging

#### Consumer Electronics & Multimedia

  • Video processing pipelines
  • Image scaling and filtering
  • Audio DSP implementations

Development Tools & Software Support

Xilinx Spartan-II devices like the XC2S200-6FGG1149C are supported by the Xilinx ISE Design Suite (legacy) and can be targeted using:

Tool Purpose
Xilinx ISE Synthesis, implementation, bitstream generation
ModelSim / Vivado Simulator RTL and post-route simulation
ChipScope Pro On-chip logic analysis
IMPACT Device programming via JTAG
CORE Generator IP core instantiation

HDL design entry in VHDL or Verilog is supported, and schematic-based entry is also available for smaller designs.


Ordering & Part Number Decoder

When sourcing the XC2S200-6FGG1149C, always verify the complete part number with your distributor to ensure the correct speed grade, package, and lead-free status:

Position Code Description
Device XC2S200 Spartan-II, 200K gates
Speed -6 Fastest commercial grade
Package Base FG Fine-Pitch BGA
Lead-Free G Pb-Free packaging
Pin Count 1149 1149-ball BGA
Temp Range C Commercial (0°C to +85°C)

Note: The “G” in “FGG” indicates Pb-free (RoHS-compliant) packaging. Standard (non-Pb-free) variants use “FG” without the second “G.”


Why Choose the XC2S200-6FGG1149C?

  • Highest gate count in the Spartan-II family (200K gates, 5,292 cells)
  • Fastest speed grade (-6) for timing-critical designs
  • Pb-free packaging for RoHS compliance
  • 284 user I/O pins for maximum connectivity
  • 56K bits block RAM for on-chip data buffering
  • Four on-chip DLLs for low-skew clock management
  • Multiple I/O standards supported (LVTTL, LVCMOS, PCI, SSTL, HSTL, GTL)
  • JTAG boundary-scan for easy board-level testing
  • 2.5V low-power core for energy-efficient operation

Where to Buy Xilinx Spartan-II FPGAs

Looking for the XC2S200-6FGG1149C or other Xilinx FPGA devices? Always source from authorized distributors to ensure product authenticity, proper documentation, and warranty coverage. Reputable distributors carry both active and legacy Xilinx parts, including Spartan-II devices, with volume pricing and lead-time visibility.


Frequently Asked Questions (FAQs)

Q: What is the XC2S200-6FGG1149C? A: It is a Xilinx Spartan-II FPGA with 200,000 system gates, -6 speed grade, Pb-free 1149-ball Fine-Pitch BGA package, and Commercial temperature range operation.

Q: What voltage does the XC2S200-6FGG1149C operate at? A: The core (VCCINT) operates at 2.5V, while I/O banks (VCCO) support voltages from 1.5V to 3.3V depending on the I/O standard used.

Q: Is the -6 speed grade available in industrial temperature range? A: No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). Industrial range devices are available at slower speed grades.

Q: What is the maximum clock frequency of the XC2S200-6FGG1149C? A: The device supports system clock frequencies up to 263 MHz with the -6 speed grade.

Q: What programming software is used for the XC2S200-6FGG1149C? A: The Xilinx ISE Design Suite is the primary development environment for Spartan-II devices. IMPACT software is used for JTAG-based device programming.

Q: Is the XC2S200-6FGG1149C RoHS compliant? A: Yes. The “G” in the FGG package designation indicates Pb-free, RoHS-compliant packaging.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.