The XC2S200-6FGG1144C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, featuring 200,000 system gates, 5,292 logic cells, and a 1144-ball Fine-Pitch Ball Grid Array (FBGA) package. Designed for demanding commercial applications, this device delivers powerful programmable logic in a robust, lead-free (Pb-free) package. Whether you are developing embedded systems, digital signal processing platforms, or high-speed communication interfaces, the XC2S200-6FGG1144C provides the gate density, I/O flexibility, and speed performance engineers rely on.
What Is the XC2S200-6FGG1144C?
The XC2S200-6FGG1144C belongs to the Xilinx Spartan-II FPGA family — a second-generation ASIC replacement technology built on a cost-effective 0.18-micron process. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200K system gates |
| -6 |
Speed grade -6 (fastest in Spartan-II; commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (lead-free) package |
| 1144 |
1144 total package pins/balls |
| C |
Commercial temperature range (0°C to +85°C) |
This FPGA is part of AMD Xilinx’s legacy Spartan-II lineup and is well suited for high-volume, cost-sensitive designs that still demand substantial programmable logic resources. For a broader range of Xilinx FPGA products and sourcing options, engineers can explore the full AMD Xilinx portfolio.
XC2S200-6FGG1144C Key Specifications
Core Device Specifications
| Parameter |
Value |
| Series |
Spartan-II |
| Manufacturer |
AMD Xilinx |
| Part Number |
XC2S200-6FGG1144C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Speed Grade |
-6 (fastest available) |
| Maximum Clock Frequency |
263 MHz |
| Process Technology |
0.18 µm CMOS |
| Core Supply Voltage (VCCINT) |
2.5V (2.375V – 2.625V) |
| Temperature Range |
Commercial: 0°C to +85°C |
Memory Resources
| Memory Type |
Capacity |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56K bits (56,000 bits) |
| Block RAM Configuration |
Configurable 4K-bit blocks |
| Distributed RAM per LUT |
16 bits |
I/O and Package Details
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch BGA, Pb-free) |
| Total Package Pins |
1,144 |
| Maximum User I/O Pins |
284 |
| Global Clock/User Input Pins |
4 (additional, not included in I/O count) |
| Delay-Locked Loops (DLLs) |
4 (one per die corner) |
| Supported I/O Standards |
16 selectable standards (LVTTL, LVCMOS, GTL, SSTL, etc.) |
| Mounting Type |
Surface Mount |
| RoHS Compliant |
Yes (Pb-free “G” suffix) |
XC2S200-6FGG1144C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1144C implements a 28 × 42 CLB array totaling 1,176 CLBs. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture, derived from the Virtex FPGA family, enables efficient implementation of complex combinatorial and sequential logic, including arithmetic functions, multiplexers, and shift registers.
SelectRAM™ Hierarchical Memory
The device supports Xilinx’s SelectRAM™ hierarchical memory system:
- Distributed RAM: Each LUT can be individually configured as 16-bit synchronous RAM, yielding up to 75,264 bits of distributed memory across the full CLB array.
- Block RAM: Two dedicated columns of block RAM provide 56K bits of high-performance synchronous dual-port memory, ideal for FIFOs, large lookup tables, and data buffering.
Input/Output Blocks (IOBs) and I/O Standards
The XC2S200-6FGG1144C supports 16 programmable I/O standards, giving designers broad compatibility with surrounding logic and external interfaces. Supported standards include LVTTL, LVCMOS2, LVCMOS3, GTL, GTLP, HSTL, SSTL2, and SSTL3. Each IOB features:
- Programmable slew rate control
- Programmable drive strength
- Optional pull-up / pull-down resistors
- 3-state (tristate) output control
- Input delay capability
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops (DLLs) are positioned at each corner of the die. The DLLs provide:
- Zero propagation delay clock distribution
- Clock edge alignment and deskewing
- Frequency synthesis (clock multiplication and division)
- Duty-cycle correction
Spartan-II Family Comparison: Where Does the XC2S200 Fit?
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K bits |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K bits |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K bits |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K bits |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K bits |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K bits |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering maximum logic density, I/O count, and on-chip memory resources.
XC2S200-6FGG1144C Package Variants
The XC2S200 is offered in several package options. The FGG1144 is the largest and highest-I/O package:
| Part Number |
Package |
Pins |
Max User I/O |
Pb-Free |
| XC2S200-6FG256C |
FBGA-256 |
256 |
140 |
No |
| XC2S200-6FGG256C |
FBGA-256 |
256 |
140 |
Yes |
| XC2S200-6FG456C |
FBGA-456 |
456 |
176 |
No |
| XC2S200-6FGG456C |
FBGA-456 |
456 |
176 |
Yes |
| XC2S200-6FGG1144C |
FBGA-1144 |
1,144 |
284 |
Yes |
Note: The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). Industrial temperature variants are offered at lower speed grades.
Electrical Characteristics
| Parameter |
Min |
Typical |
Max |
| Core Supply Voltage (VCCINT) |
2.375V |
2.5V |
2.625V |
| I/O Supply Voltage (VCCO) – 3.3V mode |
3.0V |
3.3V |
3.6V |
| I/O Supply Voltage (VCCO) – 2.5V mode |
2.375V |
2.5V |
2.625V |
| Maximum System Clock |
— |
200 MHz |
263 MHz |
| Operating Temperature (Commercial) |
0°C |
— |
+85°C |
XC2S200-6FGG1144C Applications
The combination of 200K gates, 284 user I/Os, four DLLs, and dual-ported block RAM makes this FPGA particularly well-suited for:
#### Communications and Networking
High-speed serial and parallel interface bridging, protocol conversion (UART, SPI, I²C), and packet-processing pipelines benefit from the device’s 263 MHz maximum clock rate and large I/O count.
#### Industrial Control and Automation
The XC2S200-6FGG1144C supports real-time control logic, motor drive sequencing, and sensor fusion algorithms where deterministic timing and abundant I/O are critical.
#### Digital Signal Processing (DSP)
With 75,264 bits of distributed RAM and 56K bits of block RAM, the device can implement multiply-accumulate (MAC) chains, FIR/IIR filter banks, and FFT pipelines in programmable logic without requiring external memory.
#### Embedded Systems and Prototyping
The Spartan-II architecture is a proven ASIC replacement platform, allowing hardware teams to validate full-chip designs before committing to mask costs. The FGG1144 package provides enough I/O to emulate complex SoC peripherals.
#### Test and Measurement Equipment
On-chip DLLs provide precise, skew-free clock distribution essential for multichannel data acquisition, logic analyzers, and automated test equipment (ATE) timing engines.
Development Tools and Design Flow
The XC2S200-6FGG1144C is supported by Xilinx ISE (Integrated Software Environment). Note that newer AMD Xilinx tools such as Vivado do not support legacy Spartan-II devices — ISE remains the official toolchain for this family.
| Tool |
Role |
| Xilinx ISE Design Suite |
Synthesis, implementation, bitstream generation |
| ISim / ModelSim |
RTL and gate-level simulation |
| ChipScope Pro |
On-chip debug and signal capture |
| IMPACT |
Device programming and JTAG boundary scan |
Design entry supports VHDL, Verilog, and schematic capture. The ISE toolchain handles synthesis-through-bitstream generation and delivers optimized placement and routing for the Spartan-II architecture.
Ordering and Compliance Information
| Attribute |
Details |
| Manufacturer |
AMD Xilinx (formerly Xilinx, Inc.) |
| Full Part Number |
XC2S200-6FGG1144C |
| Package |
1144-ball Fine-Pitch BGA (Pb-free) |
| Temperature Grade |
Commercial (C) — 0°C to +85°C |
| Speed Grade |
-6 (fastest; commercial only) |
| RoHS / Pb-free |
Yes — “GG” in part number indicates Pb-free packaging |
| Mounting |
Surface Mount Technology (SMT) |
| Datasheet Reference |
Xilinx DS001 (Spartan-II FPGA Family Data Sheet) |
Frequently Asked Questions (FAQ)
What does the “6” speed grade mean in XC2S200-6FGG1144C?
Speed grade -6 is the fastest speed grade offered for the Spartan-II family. It is exclusively available in the commercial temperature range (0°C to +85°C). A higher speed grade number in Spartan-II notation indicates better performance and lower propagation delays.
What is the difference between FG and FGG packages?
The “GG” in the package code (FGG1144) indicates a Pb-free (lead-free) package, compliant with RoHS environmental regulations. The standard “FG” package uses conventional tin-lead solder balls. Functionally, both package variants are identical.
Is the XC2S200-6FGG1144C still in production?
The Spartan-II family is a legacy product line from AMD Xilinx. Some package variants have been discontinued per Product Discontinuation Notices (PDNs). Engineers designing new products should check AMD Xilinx’s current availability and consider the Spartan-6 or Artix-7 families for new designs requiring long-term supply continuity.
Can I use Vivado to program the XC2S200-6FGG1144C?
No. Vivado does not support Spartan-II devices. The correct tool is Xilinx ISE Design Suite, which remains available for legacy Spartan-II design and programming.
What is the maximum I/O count for the XC2S200-6FGG1144C?
The FGG1144 package provides a maximum of 284 user I/O pins, plus 4 dedicated global clock/user input pins, making it the highest-I/O variant in the XC2S200 product family.
