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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1140C: Xilinx Spartan-II FPGA – Complete Product Guide & Specifications

Product Details

The XC2S200-6FGG1140C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and up to 284 user I/O pins — all within a 1140-ball Fine Pitch BGA (FGG1140) package. Whether you are prototyping an embedded system, replacing a mask-programmed ASIC, or designing industrial-grade hardware, the XC2S200-6FGG1140C offers the performance, density, and flexibility you need.


What Is the XC2S200-6FGG1140C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1140C belongs to Xilinx’s Spartan-II 2.5V FPGA family, a product line purpose-built to deliver programmable logic at competitive cost points. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest commercial grade)
FGG Fine Pitch Ball Grid Array (Pb-free package)
1140 1,140 total package pins
C Commercial temperature range (0°C to +85°C)

This device is ideal for engineers seeking a powerful yet affordable programmable logic solution that can be upgraded in the field without hardware replacement — a key advantage over traditional ASICs.


XC2S200-6FGG1140C Key Features and Technical Highlights

Core Logic Architecture

The XC2S200 is based on Xilinx’s proven SRAM-based programmable logic architecture. It features a rich array of Configurable Logic Blocks (CLBs), dedicated memory, and robust I/O resources that make it suitable for complex digital designs.

  • 5,292 Logic Cells with 200,000 equivalent system gates
  • 28 × 42 CLB array totaling 1,176 CLBs
  • Four Delay-Locked Loops (DLLs) for precise clock management
  • 2.5V core operating voltage with multi-standard I/O support
  • 0.18µm process technology for efficient power and performance balance
  • 263 MHz maximum frequency for high-speed design requirements

Memory Resources

Memory Type Capacity
Distributed RAM (LUT-based) 75,264 bits
Block RAM 56K bits (14 × 4K-bit blocks)
Total On-Chip Memory ~131K bits

I/O and Package Details

The FGG1140 package is the largest available for the XC2S200, offering the maximum number of accessible user I/O pins and the most routing flexibility for board designers.

Feature Specification
Package Type Fine Pitch BGA (FGG1140)
Total Package Pins 1,140
Maximum User I/O 284
I/O Standards Supported LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL
Operating Voltage (Core) 2.5V
I/O Bank Voltage Adjustable per bank

XC2S200-6FGG1140C Full Electrical Specifications

Absolute Maximum Ratings

Parameter Value
Core Supply Voltage (VCCINT) 2.5V ± 10%
I/O Supply Voltage (VCCO) 3.3V max
Operating Temperature (Commercial) 0°C to +85°C
Storage Temperature -65°C to +150°C

DC Operating Characteristics

Parameter Min Typical Max
Core Supply Voltage 2.375V 2.5V 2.625V
Input High Voltage (VIH) 2.0V VCCO + 0.5V
Input Low Voltage (VIL) -0.5V 0.8V
Quiescent Current (ICC) ~90 mA

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the go-to choice for designs that require maximum gate count within this product line.

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

XC2S200-6FGG1140C Applications and Use Cases

#### Industrial and Embedded Control Systems

The XC2S200-6FGG1140C is widely deployed in industrial automation, motor control, and embedded processing platforms. Its large I/O count and flexible clock management make it ideal for interfacing with sensors, actuators, and communication buses in real time.

#### Telecommunications and Networking Equipment

With its 263 MHz maximum operating frequency and support for high-speed I/O standards such as HSTL and SSTL, the XC2S200 is a proven choice for telecom line cards, switching fabric controllers, and protocol conversion hardware.

#### ASIC Prototyping and Design Verification

Engineers use the XC2S200-6FGG1140C to prototype ASIC designs before committing to silicon. Its large gate count and abundant I/O resources allow full-chip emulation of moderately complex ASICs, dramatically shortening development time and reducing risk.

#### Consumer and PC Peripherals

The Spartan-II family was specifically architected for high-volume consumer applications. The XC2S200-6FGG1140C is used in connected peripherals, storage controllers, printers, and PC I/O expansion cards.

#### Medical and Test Equipment

The device’s commercial temperature range, proven reliability, and field-upgradeable nature make it a suitable candidate for diagnostic instruments, measurement systems, and medical imaging hardware where firmware updates in the field are a critical operational requirement.


Why Choose the XC2S200-6FGG1140C Over Competing FPGAs?

#### FPGA vs. ASIC: The Programmable Advantage

Traditional mask-programmed ASICs carry high non-recurring engineering (NRE) costs, multi-month lead times, and zero flexibility once manufactured. The XC2S200-6FGG1140C eliminates all of these drawbacks. Designs can be updated in the field simply by reloading the configuration bitstream — no board respin required.

#### Speed Grade -6: Maximum Commercial Performance

The -6 speed grade is the highest available for commercial-range Spartan-II devices and is exclusively offered in the commercial temperature variant. This makes the XC2S200-6FGG1140C the optimal choice for timing-critical applications within the Spartan-II family.

#### Pb-Free (RoHS-Compliant) Packaging

The FGG designation in the part number indicates a lead-free (Pb-free) BGA package, complying with global RoHS directives. This is essential for products sold into European, Japanese, and other regulated markets.

For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA to explore available inventory and alternatives.


XC2S200-6FGG1140C Ordering and Availability Information

#### Decoding the Full Part Number

Code Description
XC2S200 Spartan-II, 200K gates, 5,292 cells
-6 Speed grade 6 (fastest commercial)
FGG Pb-free Fine Pitch BGA package
1140 1,140 ball count
C Commercial temperature (0°C to +85°C)

#### Available Package Options for XC2S200

Package Pin Count Type Temperature
PQ208 / PQG208 208 PQFP Commercial / Industrial
FG256 / FGG256 256 Fine Pitch BGA Commercial / Industrial
FG456 / FGG456 456 Fine Pitch BGA Commercial / Industrial
FGG1140 1,140 Fine Pitch BGA (Pb-free) Commercial

Configuration and Programming the XC2S200-6FGG1140C

Configuration Modes

The XC2S200-6FGG1140C supports multiple configuration modes, enabling integration with a wide variety of host processors and configuration PROMs:

  • Master Serial – uses Xilinx serial configuration PROMs (XC17V and XC18V series)
  • Slave Serial – configuration driven by an external host processor
  • Master Parallel (SelectMAP) – high-speed byte-wide configuration bus
  • Slave Parallel (SelectMAP) – parallel mode driven by external controller
  • JTAG (IEEE 1149.1 Boundary Scan) – industry-standard debug and configuration

 Supported Design Tools

The XC2S200-6FGG1140C is supported by Xilinx ISE Design Suite (legacy) for synthesis, implementation, and bitstream generation. Third-party synthesis tools including Synopsys Synplify and Mentor Graphics Precision also support the Spartan-II architecture.


XC2S200-6FGG1140C vs. Common Alternatives

Specification XC2S200-6FGG1140C XC2S150-6FG456C XC3S200-4FT256C
Family Spartan-II Spartan-II Spartan-3
Logic Cells 5,292 3,888 4,320
System Gates 200K 150K 200K
Max User I/O 284 (FGG1140) 260 173
Core Voltage 2.5V 2.5V 1.2V
Block RAM 56K bits 48K bits 72K bits
Speed Grade -6 (fastest) -6 (fastest) -4
Package 1140-ball BGA 456-ball BGA 256-ball BGA

Frequently Asked Questions About the XC2S200-6FGG1140C

What does the “G” in FGG1140 mean?

The extra “G” in the package code (FGG vs. FG) indicates a Pb-free (lead-free) package, compliant with RoHS environmental regulations. Standard FG packages contain lead solder balls, while FGG packages use lead-free alternatives.

Is the XC2S200-6FGG1140C still in production?

The Spartan-II family has reached end-of-life status with Xilinx (now AMD). However, the XC2S200-6FGG1140C remains widely available through authorized distributors and component brokers for maintenance, repair, and legacy design support.

What FPGA would replace the XC2S200-6FGG1140C?

For new designs, Xilinx recommends migrating to the Spartan-3 or Spartan-6 families, which offer greater gate density, improved performance, lower power consumption, and longer product life cycles. The XC3S400 or XC3S1000 are common functional migration targets.

Can the XC2S200-6FGG1140C be reprogrammed in the field?

Yes. Like all Spartan-II devices, the XC2S200-6FGG1140C uses SRAM-based configuration, meaning it can be reconfigured an unlimited number of times. Configuration is loaded at power-up from an external PROM or via JTAG, enabling seamless field updates without hardware replacement.


Summary: XC2S200-6FGG1140C at a Glance

Specification Value
Manufacturer Xilinx (AMD)
Product Family Spartan-II
Part Number XC2S200-6FGG1140C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Distributed RAM 75,264 bits
Block RAM 56K bits
Max User I/O 284
Speed Grade -6 (Commercial)
Package FGG1140 (Pb-free Fine Pitch BGA)
Total Pins 1,140
Core Voltage 2.5V
Process Node 0.18µm
Max Frequency 263 MHz
Operating Temperature 0°C to +85°C (Commercial)
Configuration Interface Serial, Parallel, JTAG
DLLs 4
RoHS Compliant Yes (Pb-free)

The XC2S200-6FGG1140C represents the peak of the Spartan-II family — offering the highest gate count, widest I/O access, fastest commercial speed grade, and Pb-free packaging in a single device. For legacy system maintenance or cost-sensitive high-volume designs that cannot yet migrate to newer architectures, this component remains a dependable and proven solution.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.