The XC2S200-6FGG1139C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, engineered for high-volume, performance-critical embedded applications. Featuring 200,000 system gates, a 1139-ball Fine-Pitch BGA (FBGA) package, speed grade -6, and commercial temperature range operation, this device delivers the flexibility and performance of a programmable logic solution at a fraction of the cost of traditional ASICs.

Whether you’re designing for telecommunications, industrial control, consumer electronics, or data processing, the XC2S200-6FGG1139C offers a compelling blend of logic density, I/O capability, and low-power 2.5V operation. For a broad selection of compatible devices, visit Xilinx FPGA.

What Is the XC2S200-6FGG1139C?

The XC2S200-6FGG1139C is part of Xilinx’s Spartan-II FPGA series — a family designed as a direct, programmable alternative to mask-programmed ASICs. The “XC2S200” core indicates 200K system gates, while the suffix breaks down as:

This part number confirms the device ships in a lead-free (Pb-free) 1139-ball FBGA package, making it compliant with modern environmental regulations for commercial applications.

XC2S200-6FGG1139C Key Specifications

Core Logic & Architecture

Package & Ordering Information

XC2S200-6FGG1139C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB architecture is the fundamental building block of the XC2S200-6FGG1139C. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This gives designers maximum flexibility for implementing combinational and sequential logic. With 1,176 total CLBs arranged in a 28×42 grid, the XC2S200 delivers ample resources for complex state machines, data path logic, and interface controllers.

Block RAM & Distributed RAM

The XC2S200-6FGG1139C includes 56K bits of dedicated block RAM organized in two columns on opposite sides of the die. In addition, 75,264 bits of distributed RAM is available via the LUT resources in each CLB. This dual-memory architecture is ideal for FIFO buffers, lookup tables, and on-chip data storage in embedded applications.

Input/Output Blocks (IOBs)

With 284 maximum user I/O pins, the XC2S200-6FGG1139C provides abundant connectivity. Each IOB supports programmable input/output standards including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and more. The IOBs also feature optional input registers, output registers, and three-state control, enabling high-speed interface design.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide precise clock management. The DLLs eliminate clock skew, multiply or divide clock frequencies, and generate phase-shifted clock signals. This makes the XC2S200-6FGG1139C well-suited for synchronous multi-clock-domain designs.

Spartan-II Family Comparison: XC2S200 vs. Other Members

To help engineers select the right device, here is how the XC2S200 compares within the Spartan-II family:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, greatest I/O count, and most on-chip memory.

Speed Grade -6: What Does It Mean for the XC2S200-6FGG1139C?

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the commercial temperature range (0°C to +85°C). It is the optimal choice for applications requiring the highest clock frequencies and minimum propagation delays.

Engineers designing high-throughput data processing pipelines, fast communication interfaces, or real-time control systems should prioritize the -6 speed grade for maximum performance headroom.

FGG1139 Package: Why 1139 Pins?

The FGG1139 package (Fine Pitch BGA, 1139 balls, Pb-free) is one of the larger footprints offered in the Spartan-II lineup. The high pin count accommodates the XC2S200’s maximum 284 user I/O lines while also providing adequate power and ground connections for signal integrity and thermal management.

FGG1139 Package Key Details

The large BGA footprint requires careful PCB layout with controlled impedance traces and via-in-pad or dog-bone fanout patterns, but it offers excellent electrical performance at high I/O utilization.

Applications for the XC2S200-6FGG1139C

The XC2S200-6FGG1139C Spartan-II FPGA excels in a wide range of embedded and system-level applications:

Programming & Design Tools for XC2S200-6FGG1139C

Supported Design Toolchains

The XC2S200-6FGG1139C is supported by Xilinx’s legacy ISE Design Suite, which includes all tools needed for HDL synthesis, implementation, and bitstream generation:

• ISE Project Navigator – Top-level project management and design flow
• XST (Xilinx Synthesis Technology) – HDL synthesis for VHDL and Verilog
• PAR (Place and Route) – Optimized placement and routing for timing closure
• IMPACT – Configuration and programming utility

Configuration Methods

The Spartan-II FPGA supports multiple configuration modes:

XC2S200-6FGG1139C vs. Competing FPGAs

Ordering the XC2S200-6FGG1139C: Part Number Decoder

Understanding the Xilinx part numbering system helps engineers quickly confirm they are ordering the exact device required:

XC2S200 - 6 - FGG - 1139 - C

  │         │    │     │     └── Temperature: C = Commercial (0°C to +85°C)
  │         │    │     └──────── Package Pin Count: 1139
  │         │    └────────────── Package: FGG = Pb-Free Fine Pitch BGA
  │         └─────────────────── Speed Grade: -6 (fastest)
  └───────────────────────────── Device: Spartan-II, 200K Gates

Why Choose the XC2S200-6FGG1139C for Your Design?

The XC2S200-6FGG1139C stands out as the flagship device of the Spartan-II family for good reason:

• Highest logic density in the Spartan-II lineup (5,292 logic cells / 200K gates)
• Fastest speed grade (-6) available in the Spartan-II commercial range
• Maximum I/O flexibility with 284 user-accessible pins
• Pb-free FGG1139 package ensures modern RoHS compliance
• Proven 0.18 µm process with mature design ecosystem and extensive documentation
• Four DLLs for robust, zero-skew clock distribution
• ASIC replacement advantage — eliminates NRE costs and supports field upgrades

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1139C used for?

The XC2S200-6FGG1139C is used in applications requiring high logic density, multiple I/O interfaces, and high-speed operation in a commercial temperature environment. Typical uses include telecom line cards, industrial controllers, embedded processing, and high-throughput data interfaces.

What is the difference between FGG and FG packages?

The double “G” in FGG indicates a Pb-free (lead-free) package, while the single “G” in FG denotes the standard (tin-lead) version. The FGG variant is RoHS-compliant and is the recommended option for new designs.

Is the XC2S200-6FGG1139C still available?

While the Spartan-II family has been largely superseded by newer Xilinx/AMD FPGA families (Spartan-6, Artix-7, etc.), the XC2S200-6FGG1139C remains available through authorized distributors and specialty electronics suppliers for legacy system support and industrial maintenance.

What programming software supports the XC2S200-6FGG1139C?

Xilinx ISE Design Suite (available as a free download from AMD/Xilinx) is the primary design environment for Spartan-II devices. The IMPACT tool within ISE handles JTAG and serial configuration.

Can the XC2S200-6FGG1139C be used for industrial applications?

The “C” suffix indicates a commercial temperature range (0°C to +85°C). For industrial temperature requirements (-40°C to +100°C), you would need the “I” variant (e.g., XC2S200-5FGG1139I) — noting that the -6 speed grade is exclusive to the commercial range.

Summary: XC2S200-6FGG1139C at a Glance

The XC2S200-6FGG1139C remains a capable and well-documented FPGA solution for engineers maintaining legacy systems or seeking a cost-effective, high-density programmable logic device. Its proven architecture, rich I/O resources, and fastest-in-family speed grade make it a reliable choice for a broad spectrum of digital design challenges.