The XC2S200-6FGG1133C is a Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family — one of the most capable and cost-effective programmable logic devices in its class. Combining 200,000 system gates with the fastest available -6 speed grade in a lead-free 1,133-ball Fine Pitch BGA package, the XC2S200-6FGG1133C delivers the performance, I/O density, and design flexibility that engineers need for demanding commercial applications.

Whether you are designing high-speed networking equipment, industrial control systems, or digital signal processing hardware, the XC2S200-6FGG1133C is a proven solution built on Xilinx’s robust 0.18 µm process technology. This guide covers everything you need to know — from electrical specifications and package details to supported applications and design tools.

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What Is the XC2S200-6FGG1133C?

The XC2S200-6FGG1133C is part of the Xilinx Spartan-II FPGA family, a product line engineered as a high-performance, low-cost alternative to mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1133C can be reprogrammed in the field, eliminating lengthy development cycles and costly hardware revisions.

The part number breaks down as follows:

This device is a Pb-free (RoHS-compliant) variant — indicated by the double “G” in “FGG” — making it suitable for environmentally regulated markets and modern PCB assembly processes.

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XC2S200-6FGG1133C Key Specifications

The table below summarizes the core electrical and physical specifications of the XC2S200-6FGG1133C.

Absolute Maximum Ratings & Electrical Characteristics

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XC2S200-6FGG1133C Package Details

Fine Pitch BGA (FGG1133) Package Overview

The FGG1133 package is a Fine Pitch Ball Grid Array with 1,133 solder balls arranged in a grid pattern. This large-pin-count package is designed for applications that require high I/O density — making the XC2S200-6FGG1133C ideal for complex board-level integrations where many parallel signals must be routed simultaneously.

The double “G” suffix in FGG specifically identifies this as the Pb-free packaging variant of the FG1133 package. Engineers migrating from older non-Pb-free versions should note that the FGG1133 is pin-compatible with the standard FG1133 package, simplifying board design transitions.

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Spartan-II Family Overview: Where XC2S200 Fits

The XC2S200 is the largest member of the Xilinx Spartan-II FPGA family, offering the most resources within this product line. The table below compares all Spartan-II devices so you can understand the XC2S200’s position.

Spartan-II FPGA Family Comparison Table

The XC2S200-6FGG1133C delivers the highest logic cell count, I/O count, and memory resources in the entire Spartan-II lineup — making it the best choice when you need maximum capability within this proven device family.

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Architecture and Core Features of the XC2S200-6FGG1133C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1133C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two Look-Up Tables (LUTs) and two flip-flops. This architecture supports efficient implementation of both combinational and sequential logic.

Block RAM

With 56K bits of total block RAM distributed across 14 dedicated block RAM modules, the XC2S200-6FGG1133C supports data buffering, FIFO queues, and on-chip memory applications without consuming CLB resources.

Distributed RAM

The 75,264 bits of distributed RAM are implemented within the CLB fabric itself, providing fast, low-latency storage for smaller data sets and look-up tables used in DSP functions.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1133C features four on-chip DLLs — one at each corner of the die — that provide:

• Zero-delay clock buffering
• Clock frequency synthesis (multiply/divide)
• Phase shifting for precise timing control
• Duty-cycle correction

These DLLs are essential for high-speed synchronous designs where clock skew must be minimized across the device.

Input/Output Blocks (IOBs)

The device supports up to 284 user I/O pins with programmable I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, and more. Each IOB features:

• Programmable input delay
• Optional input flip-flop or latch
• Programmable output slew rate control
• 3-state output enable

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Speed Grade -6: The Fastest Spartan-II Option

The -6 speed grade is the highest-performance option available for the Spartan-II XC2S200 — and it is exclusively available in the Commercial temperature range (0°C to +85°C). This means the XC2S200-6FGG1133C is specifically optimized for use in commercial-grade electronic systems where maximum clock speed is prioritized.

Speed Grade Comparison for XC2S200

Engineers should select the -6 speed grade when their application requires the highest toggle rates, shortest propagation delays, or the most aggressive timing margins within the Spartan-II family.

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Applications of the XC2S200-6FGG1133C

The XC2S200-6FGG1133C is a versatile FPGA suited for a wide range of commercial and industrial applications. Its combination of large gate count, abundant I/O, and fastest speed grade makes it particularly effective in the following use cases.

Typical Application Areas

The XC2S200-6FGG1133C’s field-programmability is a major advantage over mask-programmed ASICs: firmware updates and design changes can be deployed in the field without hardware replacement — a critical benefit for products with long lifecycles.

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Design Tools and Programming Support

Xilinx ISE Design Suite

The XC2S200-6FGG1133C is supported by the Xilinx ISE Design Suite, which includes:

• ISE Project Navigator — top-level design management
• XST (Xilinx Synthesis Technology) — RTL synthesis from VHDL or Verilog
• NGD Build / MAP / PAR — implementation tools for fitting and routing
• BitGen — bitstream generation for device configuration
• ChipScope Pro — on-chip debugging and signal monitoring

Supported HDL Languages

• VHDL
• Verilog / SystemVerilog
• ABEL (for simple logic equations)
• Schematic entry (via ISE tools)

Configuration Methods

The XC2S200-6FGG1133C supports multiple configuration modes:

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XC2S200-6FGG1133C vs. Similar Variants

If you are evaluating the XC2S200-6FGG1133C against similar variants, the table below highlights the key differences across common XC2S200 ordering options.

The XC2S200-6FGG1133C offers the largest ball count of all XC2S200 variants, maximizing available I/O routing flexibility on your PCB — a critical advantage in high-pin-count system designs.

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Ordering and Procurement Information

When sourcing the XC2S200-6FGG1133C, consider the following:

• Manufacturer: Xilinx, Inc. (now AMD)
• Product Status: Mature / End-of-Life (not recommended for new designs — consider migration to newer Spartan families)
• Typical Distributors: Digi-Key, Mouser, Arrow, Avnet, and authorized component brokers
• RoHS Compliance: Yes (Pb-free FGG package)
• Temperature Grade: Commercial (0°C to +85°C)
• Quantity Pricing: Volume discounts available; request a quote from authorized distributors for current lead times and pricing

Note: The -6 speed grade is exclusively available in the Commercial temperature range. If your application requires Industrial temperature support, consider the -5I variants.

For a broader selection of Xilinx programmable logic devices, visit Xilinx FPGA to explore current and legacy FPGA families, datasheets, and procurement options.

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Frequently Asked Questions (FAQ)

What does the “FGG” mean in XC2S200-6FGG1133C?

The “FGG” designation indicates a Fine Pitch Ball Grid Array (FBGA) package with Pb-free (lead-free) solder balls. The extra “G” differentiates it from the standard “FG” package, which uses tin-lead solder. The FGG variant is RoHS compliant.

Is the XC2S200-6FGG1133C still in production?

The Spartan-II family, including the XC2S200-6FGG1133C, is considered a mature product and is not recommended for new designs by AMD (Xilinx). Replacement stock may still be available through distributors and component brokers. Engineers starting new projects should evaluate the Spartan-6, Artix-7, or newer Xilinx FPGA families.

What is the maximum clock frequency of the XC2S200-6FGG1133C?

The XC2S200-6FGG1133C supports system performance up to 200 MHz, with internal paths capable of exceeding 263 MHz depending on the specific logic implementation and timing closure.

What programming software supports the XC2S200-6FGG1133C?

The Xilinx ISE Design Suite (version 14.7 and earlier) fully supports the Spartan-II family. VHDL, Verilog, and schematic entry are all supported design flows.

Can the XC2S200-6FGG1133C be used in industrial temperature environments?

No. The “C” suffix in the part number indicates a Commercial temperature range (0°C to +85°C). For industrial temperature applications (-40°C to +100°C), you must use the “I” suffix variants (e.g., XC2S200-5PQ208I).

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Conclusion

The XC2S200-6FGG1133C is a high-performance, feature-rich FPGA that represents the top of the Xilinx Spartan-II product line. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56K bits of block RAM, and the fastest available -6 speed grade in a modern Pb-free 1,133-ball FBGA package, it delivers exceptional capability for commercial-grade digital design.

While newer Xilinx FPGA families now offer greater density and lower power consumption, the XC2S200-6FGG1133C remains a reliable choice for legacy system maintenance, high-pin-count prototyping, and cost-sensitive production applications where its proven architecture and established tool support are decisive advantages.