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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
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XC2S200-6FGG1131C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1131C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1,131-ball Fine Pitch BGA (FBGA) lead-free package, and the fastest -6 commercial speed grade, this device delivers exceptional logic density and I/O flexibility for a wide range of embedded, industrial, and consumer applications. If you are sourcing or evaluating Xilinx FPGA solutions, the XC2S200-6FGG1131C is a strong candidate worth understanding in depth.


What Is the XC2S200-6FGG1131C? Overview of the Spartan-II FPGA Family

The XC2S200-6FGG1131C belongs to Xilinx’s Spartan-II 2.5V FPGA family, a product line designed to offer the programmability and flexibility of FPGAs at a price point competitive with mask-programmed ASICs. The Spartan-II family was positioned as a superior alternative to conventional ASICs by eliminating upfront NRE (Non-Recurring Engineering) costs, reducing development time, and enabling in-field design updates — none of which are possible with hard-wired ASICs.

Breaking Down the Part Number: XC2S200-6FGG1131C

Understanding the part number is critical for procurement and design verification:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gate device
-6 Speed Grade 6 (fastest available for commercial range)
FGG Fine Pitch Ball Grid Array, Pb-Free (G = RoHS-compliant)
1131 1,131-ball package pin count
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1131C Key Specifications at a Glance

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K

Package & Electrical Specifications

Parameter Value
Package Type Fine Pitch BGA (FBGA), Pb-Free
Pin Count 1,131
Core Supply Voltage 2.5V
I/O Voltage 2.5V (multi-standard IOBs supported)
Process Technology 0.18µm
Speed Grade -6 (Commercial Only)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Yes (G suffix = Pb-Free)

XC2S200-6FGG1131C Architecture: A Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28 × 42 matrix. Each CLB consists of two slices, and each slice contains two Look-Up Tables (LUTs) and two flip-flops. This architecture allows flexible implementation of combinational logic, registered logic, and small distributed memory structures. The total of 5,292 logic cells provides ample capacity for mid-complexity digital designs.

Block RAM: On-Chip High-Speed Memory

The XC2S200 integrates 56 Kbits of dedicated block RAM, organized in two columns of symmetrical dual-port RAM blocks positioned on opposite sides of the die. Block RAM operates independently from the routing fabric, delivering high-speed, deterministic memory access that is ideal for FIFOs, data buffers, and look-up table acceleration. The 56 Kbits of block RAM complement the 75,264 bits of distributed RAM embedded within the CLB array.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1131C includes four on-chip Delay-Locked Loops (DLLs), one placed at each corner of the die. The DLLs provide:

  • Zero-delay clock distribution
  • Clock edge alignment and deskewing
  • Frequency synthesis (multiply and divide)
  • Phase shifting for source-synchronous interfaces

These DLL resources are critical for high-speed synchronous design and reduce the burden of external clock conditioning circuitry.

Input/Output Blocks (IOBs) and Multi-Standard Support

The device provides up to 284 user I/O pins through its programmable Input/Output Blocks. Each IOB supports:

  • Selectable input delay (with or without DLL compensation)
  • Programmable slew rate control (fast/slow)
  • Programmable drive strength
  • Optional pull-up, pull-down, and keeper feedback
  • Support for multiple I/O standards (LVCMOS2.5, LVCMOS3.3, LVTTL, PCI, GTL, SSTL, and more)

The large 1,131-ball FGG package makes the XC2S200-6FGG1131C ideal for designs that require maximum pin accessibility and routing flexibility on the PCB.


Speed Grade -6: Why It Matters for the XC2S200-6FGG1131C

The -6 speed grade is the fastest available for the Spartan-II family and is exclusively offered in the Commercial temperature range. This means the XC2S200-6FGG1131C is optimized for:

  • Maximum operating frequency in commercial environments
  • Reduced propagation delays across CLB-to-CLB and CLB-to-IOB paths
  • High-throughput data processing applications

Spartan-II Speed Grade Comparison

Speed Grade Available Temperature Ranges Relative Performance
-5 Commercial, Industrial Standard
-6 Commercial Only Fastest

For applications where raw clock speed and logic performance are paramount — such as high-speed communication interfaces or real-time signal processing — the -6 speed grade provides the maximum headroom within the Spartan-II lineup.


XC2S200 Spartan-II Family Comparison Table

Understanding where the XC2S200 sits within the Spartan-II family helps engineers select the right device for their design:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8 × 12 96 86 6,144 16K
XC2S30 972 30,000 12 × 18 216 92 13,824 24K
XC2S50 1,728 50,000 16 × 24 384 176 24,576 32K
XC2S100 2,700 100,000 20 × 30 600 176 38,400 40K
XC2S150 3,888 150,000 24 × 36 864 260 55,296 48K
XC2S200 5,292 200,000 28 × 42 1,176 284 75,264 56K

The XC2S200 is the top-of-range device in the Spartan-II family, offering the highest logic cell count, the most CLBs, the largest distributed and block RAM, and the greatest I/O count.


Typical Applications for the XC2S200-6FGG1131C

The XC2S200-6FGG1131C is well-suited for a broad range of high-volume and performance-sensitive application segments:

Digital Communications & Networking

  • Protocol bridging and conversion (UART, SPI, I²C, Ethernet MAC)
  • High-speed data serialization/deserialization
  • Forward error correction (FEC) logic

Industrial Automation & Control

  • Real-time motor control and servo drive logic
  • Programmable machine vision preprocessing
  • Industrial fieldbus interface controllers (CAN, Profibus)

Consumer Electronics & Multimedia

  • Display controller interfaces
  • Audio DSP and codec integration
  • Set-top box logic glue

Embedded Computing & SoC Prototyping

  • Co-processor acceleration for embedded microcontrollers
  • ASIC prototyping and emulation
  • Custom bus arbitration and DMA logic

Configuration and Programming: How to Program the XC2S200-6FGG1131C

Supported Configuration Modes

The Spartan-II devices, including the XC2S200-6FGG1131C, support multiple configuration modes to suit different system architectures:

Configuration Mode Description
Master Serial FPGA loads bitstream from serial PROM
Slave Serial External host controls serial configuration
Master Parallel (SelectMAP) Parallel byte-wide configuration from host
Slave Parallel (SelectMAP) Byte-wide parallel from processor/controller
JTAG (Boundary Scan) IEEE 1149.1 JTAG interface for in-system programming

Recommended Design Tools

Xilinx Spartan-II devices are supported by ISE Design Suite (the legacy toolchain) for synthesis, implementation, and bitstream generation. While the newer Vivado Design Suite does not support Spartan-II, ISE remains fully capable for this device family and is freely available for download.


Ordering Information & Part Marking Guide

How to Read the XC2S200-6FGG1131C Order Code

XC2S200  -  6  -  FGG  -  1131  -  C
  |           |     |        |       |
Device     Speed  Package  Pins   Temp
 Type      Grade   Type    Count  Range

Available Packages for XC2S200

Package Code Package Description Pin Count
PQ(G)208 Plastic Quad Flat Pack, Pb-Free option 208
FG(G)256 Fine Pitch BGA, Pb-Free option 256
FG(G)456 Fine Pitch BGA, Pb-Free option 456
FGG1131 Fine Pitch BGA, Pb-Free 1,131

Note: The “G” in FGG denotes a Pb-free (RoHS-compliant) package. The XC2S200-6FGG1131C is the lead-free variant of this configuration.


XC2S200-6FGG1131C vs Competing FPGA Devices

How Does It Compare to Other Xilinx FPGAs?

Feature XC2S200-6FGG1131C (Spartan-II) XC3S200 (Spartan-3) XC6SLX9 (Spartan-6)
System Gates 200K 200K ~9K LUTs equiv.
Technology Node 0.18µm 90nm 45nm
Core Voltage 2.5V 1.2V 1.2V
Block RAM 56K bits 216K bits 576K bits
Max User I/O 284 173 102
DSP Slices None 12 16
Status Legacy / End-of-Life Legacy Active

While the XC2S200-6FGG1131C is a legacy device, it remains widely used in maintenance, repair, and replacement applications for existing deployed systems, and continues to be sourced through authorized distributors and component brokers.


Why Choose the XC2S200-6FGG1131C for Your Design

Key Advantages

  • Highest gate density in the Spartan-II family — 200,000 system gates and 5,292 logic cells
  • Maximum I/O count — 284 user I/Os support complex multi-bus system integration
  • Fastest commercial speed grade — -6 speed grade enables maximum operating frequency
  • Pb-Free, RoHS-compliant packaging — FGG suffix ensures compliance with environmental directives
  • Large 1,131-ball BGA package — ideal for high pin-count PCB designs requiring dense I/O connectivity
  • Proven 0.18µm technology — mature, well-characterized process node with predictable behavior
  • Four on-chip DLLs — simplify clocking architecture and reduce external clock conditioning

Limitations to Consider

  • Legacy device — not recommended for new designs (NRND status)
  • No dedicated DSP slices or hard-core processor blocks
  • Limited block RAM compared to later Spartan generations
  • Only commercial temperature range available for -6 speed grade

Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for the XC2S200-6FGG1131C?

The -6 speed grade is the fastest speed grade in the Spartan-II family. It indicates lower propagation delays compared to the -5 grade, enabling the device to operate at higher clock frequencies. This grade is available only in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1131C RoHS compliant?

Yes. The “G” in the FGG package designation confirms this is a Pb-free, RoHS-compliant package variant.

What configuration tools are compatible with the XC2S200-6FGG1131C?

The Xilinx ISE Design Suite is the recommended toolchain. It supports synthesis via XST or third-party tools (Synopsys, Mentor), place-and-route, and bitstream generation for all Spartan-II devices. JTAG-based programming is supported via Xilinx’s iMPACT programmer or third-party JTAG tools.

Can the XC2S200-6FGG1131C replace other Spartan-II devices?

The XC2S200 is the largest device in the Spartan-II family and can serve as a pin-compatible replacement for smaller Spartan-II devices when used within the same package type. Cross-package replacement requires PCB redesign due to different ball-out patterns.

Where can I buy the XC2S200-6FGG1131C?

The XC2S200-6FGG1131C can be sourced through authorized electronics distributors, independent component distributors, and specialist FPGA brokers. Always verify authenticity and request traceability documentation when sourcing legacy components.


Conclusion: Is the XC2S200-6FGG1131C Right for Your Application?

The XC2S200-6FGG1131C remains a capable and highly specified device within the Xilinx Spartan-II FPGA family. Its combination of 200,000 system gates, 284 user I/Os, four DLLs, and the fastest -6 commercial speed grade in a large 1,131-ball Pb-free BGA package makes it the premier choice within its product family. While it carries a legacy designation and is not recommended for new designs, it continues to serve critical roles in system maintenance, field replacement, and legacy product support.

For engineers working on new designs requiring programmable logic solutions, exploring the broader portfolio of available Xilinx FPGA devices — including modern Spartan-6, Spartan-7, and UltraScale families — may offer superior performance, lower power consumption, and extended product lifecycles.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.