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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1128C: Xilinx Spartan-II FPGA — Full Specifications, Features & Datasheet Guide

Product Details

The XC2S200-6FGG1128C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Operating on a 2.5V core supply, it delivers 200,000 system gates, 5,292 logic cells, and a maximum clock frequency of 263 MHz — all housed in a 1128-ball Fine-Pitch BGA (FGG) Pb-Free package. Designed for high-volume production environments, this device is a proven, cost-effective alternative to traditional mask-programmed ASICs and an excellent choice for embedded systems, communications hardware, and industrial control applications.

For engineers seeking a broader range of programmable logic solutions, explore the full lineup on Xilinx FPGA.


What Is the XC2S200-6FGG1128C? A Comprehensive Overview

The XC2S200-6FGG1128C is part of Xilinx’s Spartan-II 2.5V FPGA family, a series engineered to combine the flexibility of programmable logic with the low cost and high-volume suitability of mass-produced semiconductors. The “-6” in the part number denotes the fastest available speed grade in the Spartan-II lineup — exclusively available in the Commercial temperature range — making this variant ideal for performance-sensitive designs.

Decoding the Part Number: XC2S200-6FGG1128C

Field Value Meaning
XC2S XC2S Spartan-II FPGA Family
200 200 ~200,000 System Gates
-6 -6 Speed Grade (Fastest / Commercial Only)
FGG FGG Fine-Pitch Ball Grid Array, Pb-Free
1128 1128 Number of Package Pins
C C Commercial Temperature Range (0°C to +85°C)

XC2S200-6FGG1128C Key Specifications

Core Logic & Memory Resources

Parameter XC2S200 Value
System Gates (Logic + RAM) 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Total Block RAM (bits) 56K
Delay-Locked Loops (DLLs) 4

Electrical & Timing Specifications

Parameter Value
Core Supply Voltage 2.5V
I/O Voltage 3.3V (LVTTL, LVCMOS33)
Maximum Clock Frequency 263 MHz
Speed Grade -6 (Commercial)
Technology Node 0.18 µm
Operating Temperature 0°C to +85°C (Commercial)

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FGG)
Pin Count 1,128
RoHS / Pb-Free Yes (“G” suffix = Pb-Free)
Package Designator FGG1128

XC2S200-6FGG1128C Architecture & Internal Features

Configurable Logic Blocks (CLBs)

The heart of the XC2S200 architecture is its array of 1,176 Configurable Logic Blocks, arranged in a 28-column by 42-row matrix. Each CLB contains four logic cells, and each logic cell includes a four-input Look-Up Table (LUT), a storage element (flip-flop), and carry logic. This architecture supports:

  • Combinational and registered logic implementation
  • Efficient arithmetic functions using dedicated carry chains
  • Fast shift-register and distributed RAM inference

Input/Output Blocks (IOBs)

The XC2S200-6FGG1128C offers up to 284 user-configurable I/O pins (excluding the four dedicated global clock inputs). Each IOB supports multiple I/O standards, including LVTTL, LVCMOS, PCI, and SSTL, providing maximum interface flexibility with external components, buses, and peripherals.

Block RAM

Two columns of dedicated Block RAM are embedded within the device, totalling 56 Kbits of dual-port synchronous SRAM. Block RAM is ideal for implementing FIFOs, large lookup tables, data buffers, and on-chip memory without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are placed at the corners of the die. DLLs enable:

  • Zero-delay clock buffering and distribution
  • Clock frequency synthesis and multiplication
  • Clock phase shifting for timing optimization

Routing Architecture

A hierarchical routing network connects all functional blocks with minimal delay. The Spartan-II routing includes local, long-line, and global routing resources, ensuring timing closure is achievable even in complex, high-fanout designs.


XC2S200-6FGG1128C vs. Other Spartan-II Family Members

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, making it the best choice for designs that need maximum logic density, I/O count, and on-chip memory within this product line.


Top Applications for the XC2S200-6FGG1128C

The XC2S200-6FGG1128C is well suited for a wide range of commercial and industrial applications:

#### Communications & Networking

  • Protocol bridging (UART, SPI, I2C, PCIe bridging logic)
  • Line card interfaces and packet processing
  • Wireless baseband control planes

#### Industrial & Embedded Control

  • Motor control and servo loop implementations
  • Sensor fusion and real-time signal acquisition
  • Programmable PLC-style logic replacement

#### Consumer & Multimedia Electronics

  • Video processing pipelines (frame buffering, scaling)
  • Audio DSP acceleration
  • Display controller interfaces

#### Test & Measurement Equipment

  • High-speed data capture and pattern generation
  • Protocol analyzers and logic emulators
  • Automated test equipment (ATE) controller logic

#### Aerospace & Defense (Legacy Systems)

  • Ruggedized board-level replacements for legacy ASICs
  • Mission-critical embedded computing modules

Design Tools & Programming Support

The XC2S200-6FGG1128C is supported by Xilinx’s legacy ISE Design Suite, which provides:

  • XST (Xilinx Synthesis Technology) for RTL synthesis
  • ISE Project Navigator for design entry, simulation, and implementation
  • iMPACT for JTAG-based device configuration and programming
  • Support for VHDL, Verilog, and schematic-based design entry

Configuration is loaded at power-up via an external configuration PROM (such as XCF series PROMs) or via a processor using the Slave Serial or SelectMAP interfaces. The device can also be reconfigured in-system, enabling field updates without hardware replacement.


Why Choose the XC2S200-6FGG1128C Over a Custom ASIC?

Factor Spartan-II FPGA Mask-Programmed ASIC
NRE Cost None High ($500K–$5M+)
Time-to-Market Days to weeks 6–18 months
Design Changes Reprogrammable in-field New mask set required
Prototyping Immediate Not possible
Volume Pricing Cost-effective Competitive at very high volumes
Risk Low High (first-pass success not guaranteed)

For designs in the 10,000 to 100,000 unit range, or any design where flexibility and time-to-market are priorities, the XC2S200-6FGG1128C provides a compelling advantage over traditional ASIC approaches.


Ordering Information & Product Variants

XC2S200 Available Speed Grades

Speed Grade Max Frequency Temperature Range
-5 ~200 MHz Commercial & Industrial
-6 263 MHz Commercial Only (0°C to +85°C)

Note: The -6 speed grade is exclusively available in the Commercial temperature range. Engineers requiring industrial temperature operation (-40°C to +100°C) must select the -5 speed grade.

Common XC2S200 Package Variants

Part Number Package Pins Pb-Free
XC2S200-6PQ208C PQFP 208 No
XC2S200-6FG256C FBGA 256 No
XC2S200-6FGG256C FBGA 256 Yes
XC2S200-6FG456C FBGA 456 No
XC2S200-6FGG456C FBGA 456 Yes
XC2S200-6FGG1128C FGG BGA 1,128 Yes

Frequently Asked Questions (FAQ)

#### What is the XC2S200-6FGG1128C used for?

The XC2S200-6FGG1128C is used in applications requiring programmable digital logic, including communications systems, industrial controllers, consumer electronics, and test equipment. It is commonly used as a cost-effective ASIC replacement.

#### What does the “-6” speed grade mean?

The -6 speed grade is the fastest speed grade available in the Spartan-II family, supporting a maximum internal clock frequency of 263 MHz. It is only available in the Commercial temperature range (0°C to +85°C).

#### Is the XC2S200-6FGG1128C Pb-free / RoHS compliant?

Yes. The double “G” (FGG) in the part number indicates a Pb-Free packaging option, making this device suitable for RoHS-compliant production.

#### What software is used to program the XC2S200?

The XC2S200 series is programmed using Xilinx’s ISE Design Suite (Legacy). HDL design is done in VHDL or Verilog, and device programming is performed via JTAG using the iMPACT programming tool.

#### What is the maximum I/O count on the XC2S200-6FGG1128C?

The XC2S200 supports up to 284 user I/O pins (not counting the four dedicated global clock inputs). The large 1,128-ball FGG package accommodates a high number of routed I/Os for complex board-level interconnects.

#### Can the XC2S200 be reconfigured in the field?

Yes. Spartan-II FPGAs are fully reprogrammable using standard JTAG or configuration interfaces. This makes field updates possible without any hardware changes — a key advantage over ASICs.


Summary: XC2S200-6FGG1128C at a Glance

Specification Value
Manufacturer Xilinx (AMD)
Family Spartan-II
Part Number XC2S200-6FGG1128C
System Gates 200,000
Logic Cells 5,292
Max Frequency 263 MHz
Core Voltage 2.5V
Package FGG1128 (Pb-Free BGA)
Pin Count 1,128
Temperature Range 0°C to +85°C (Commercial)
Speed Grade -6 (Fastest)
User I/O Up to 284
Block RAM 56 Kbits
DLLs 4
Technology 0.18 µm

The XC2S200-6FGG1128C stands out as the top-tier member of the Xilinx Spartan-II portfolio — offering the highest logic density, the most I/O resources, and the fastest commercial speed grade available in the family. Whether you are prototyping a new product, upgrading a legacy ASIC design, or deploying a high-volume embedded solution, this device delivers the performance, flexibility, and cost-efficiency that demanding applications require.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.