The XC2S200-6FGG1127C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device delivers 200,000 system gates, a -6 speed grade (the fastest available in the Spartan-II lineup), and a 1127-ball Fine Pitch BGA (FBGA) Pb-free package — making it one of the most capable members in the Spartan-II series. Whether you are designing industrial control systems, communications equipment, or consumer electronics, the XC2S200-6FGG1127C offers a powerful and cost-effective alternative to mask-programmed ASICs.

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What Is the XC2S200-6FGG1127C?

The XC2S200-6FGG1127C is part of Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic device built on 0.18µm process technology. The part number breaks down as follows:

The “FGG” vs “FG” distinction is important: the extra G indicates a Pb-free (RoHS-compliant lead-free) package, making the XC2S200-6FGG1127C compliant with environmental regulations in many markets.

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XC2S200-6FGG1127C Key Specifications

The table below summarizes the core technical specifications of the XC2S200-6FGG1127C:

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XC2S200-6FGG1127C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1127C contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, with each slice containing two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture gives the device outstanding flexibility for implementing complex combinational and sequential logic.

Block RAM and Distributed RAM

Memory resources are a key strength of this device. The XC2S200-6FGG1127C provides:

• 75,264 bits of distributed RAM — embedded directly within the CLB LUTs for fast, flexible local storage.
• 56K bits of dedicated block RAM — organized in dual-port 4K × 1 to 512 × 8 configurations, suitable for FIFOs, lookup tables, and data buffers.

Delay-Locked Loops (DLLs)

The device incorporates four Delay-Locked Loops (DLLs), one at each corner of the die. The DLLs allow designers to eliminate clock distribution delays, multiply or divide clock frequencies, and shift clock phases — critical capabilities for high-speed synchronous designs.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1127C supports a wide range of I/O standards including LVTTL, LVCMOS, PCI, GTL, SSTL, HSTL, and CTT. Each IOB includes programmable pull-up/pull-down resistors and supports 3-state output control.

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Speed Grade -6: Performance Advantage

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1127C an ideal choice for applications that demand maximum throughput and minimal propagation delay.

If your design requires maximum operating frequency and operates within 0°C to +85°C, the XC2S200-6FGG1127C with its -6 speed grade is the optimal choice.

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Spartan-II Family Comparison

To put the XC2S200 in context, here is how it compares against other Spartan-II family members:

The XC2S200 sits at the top of the Spartan-II family, offering the highest gate count, the most CLBs, the most I/O, and the largest memory resources of any device in the series.

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Key Features of the XC2S200-6FGG1127C

#### Reconfigurable Programmability

Unlike traditional ASICs, the XC2S200-6FGG1127C can be reconfigured in the field without any hardware replacement. This dramatically reduces development risk and allows last-minute design changes after deployment.

#### Cost-Effective ASIC Alternative

The Spartan-II family was engineered specifically as a cost-effective replacement for mask-programmed ASICs. The XC2S200-6FGG1127C eliminates up-front NRE (Non-Recurring Engineering) costs, reduces time-to-market, and allows iterative design improvements.

#### Advanced Routing Architecture

Spartan-II devices use a hierarchical routing matrix that provides fast, predictable interconnect performance across the full device — essential for meeting tight timing constraints in complex designs.

#### Boundary Scan Support (JTAG)

The XC2S200-6FGG1127C fully supports IEEE 1149.1 JTAG boundary scan, enabling easy board-level testing, debugging, and in-system programming.

#### SelectRAM+ Memory Technology

Xilinx’s proprietary SelectRAM+ architecture enables the on-chip LUTs to function as distributed 16×1 synchronous RAM or 16-bit shift registers, maximizing silicon efficiency.

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Typical Applications for the XC2S200-6FGG1127C

The combination of high gate count, fast speed grade, abundant I/O, and Pb-free packaging makes the XC2S200-6FGG1127C well-suited for a broad range of applications:

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Design Tools & Programming Support

#### Xilinx ISE Design Suite

The XC2S200-6FGG1127C is supported by the Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices). ISE includes synthesis, implementation, timing analysis, and bitstream generation tools. It supports design entry via VHDL, Verilog, or schematic capture.

#### Configuration Options

Spartan-II FPGAs support multiple configuration modes:

• Master Serial (via Xilinx Platform Flash PROM)
• Slave Serial
• Master Parallel (SelectMAP)
• Boundary Scan (JTAG)

#### Third-Party Tool Support

The device is compatible with popular third-party EDA tools including Synopsys Synplify, Mentor Precision RTL, and ModelSim for simulation.

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Ordering Information & Part Number Decoder

When ordering the XC2S200-6FGG1127C, it is important to understand the full part number structure to ensure you receive the correct variant:

Note: The “FGG” package (with double G) indicates Pb-free (lead-free) construction, distinguishing it from the standard “FG” package. Always confirm the “FGG” suffix when RoHS compliance is required for your end product.

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Why Choose the XC2S200-6FGG1127C?

If you are evaluating programmable logic for a new or legacy design, the XC2S200-6FGG1127C offers a compelling combination of:

• The highest gate density in the Spartan-II family (200K system gates)
• The fastest speed grade (-6, up to 263 MHz)
• A high pin-count Pb-free BGA (1,127 balls) for dense PCB integration
• Generous on-chip memory (75K distributed + 56K block RAM)
• Full JTAG support for easy debugging and in-system programming
• A mature, well-documented ecosystem backed by Xilinx (AMD)

For engineers and procurement teams looking for reliable, field-proven programmable logic, the XC2S200-6FGG1127C continues to serve legacy system maintenance and new cost-sensitive designs alike. Explore the full range of compatible products through our Xilinx FPGA catalog.

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Frequently Asked Questions (FAQ)

What is the difference between XC2S200-6FGG1127C and XC2S200-6FG1127C?

The only difference is the package type. The FGG variant uses a Pb-free (lead-free) BGA package, while the FG variant uses a standard tin-lead solder ball BGA. All electrical and logic specifications are identical.

Is the XC2S200-6FGG1127C still in production?

The Spartan-II family has reached end-of-life status with Xilinx (now AMD). However, the XC2S200-6FGG1127C remains available through authorized distributors and franchised component suppliers for legacy system support and maintenance.

What programming software do I need for the XC2S200-6FGG1127C?

The XC2S200-6FGG1127C is programmed using the Xilinx ISE Design Suite. Vivado does not support Spartan-II devices. ISE version 14.7 is the final release and remains available as a free download from the AMD/Xilinx website.

Can I replace the XC2S200-6FGG1127C with a newer Xilinx device?

Yes. For new designs, Xilinx recommends migrating to the Spartan-6 or Spartan-7 families, which offer significantly higher performance, lower power consumption, and more advanced features. However, migration requires re-implementation of the design in the new device family.

What is the operating voltage of the XC2S200-6FGG1127C?

The device operates from a 2.5V core supply. I/O banks can support multiple voltage standards depending on the VCCO supply applied to each bank.