The XC2S200-6FGG1126C is a field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. It delivers 200,000 system gates, 5,292 logic cells, and a maximum clock speed of 263 MHz — all housed in a 1,126-ball Fine-Pitch Ball Grid Array (FGG1126) Pb-free package. If you are looking for a cost-effective, high-density programmable logic solution for commercial applications, the XC2S200-6FGG1126C is a strong candidate worth evaluating in detail.

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What Is the XC2S200-6FGG1126C?

The XC2S200-6FGG1126C belongs to the Xilinx Spartan-II product line — a family of 2.5V FPGAs built on 0.18 µm CMOS process technology. The part number breaks down as follows:

This device is manufactured by Xilinx (now AMD). It is positioned as a cost-optimized alternative to mask-programmed ASICs. Because it is fully reprogrammable, it eliminates the high NRE (non-recurring engineering) costs associated with traditional ASIC development. For a broader overview of Xilinx’s programmable device portfolio, visit Xilinx FPGA.

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XC2S200-6FGG1126C Key Specifications

Core Logic Resources

The XC2S200 is the largest device in the Spartan-II family, featuring 5,292 logic cells and 200,000 system gates arranged in a 28 × 42 CLB array with 1,176 total configurable logic blocks (CLBs).

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Package & Physical Specifications

Note: The “G” in FGG1126 denotes Pb-free packaging, which meets RoHS compliance requirements — a critical factor for designs targeting European and global markets.

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Memory Architecture

The XC2S200-6FGG1126C provides two distinct types of on-chip memory, both useful for different design scenarios.

Block RAM columns are placed on opposite sides of the die, between the CLB core and the IOB perimeter, for optimized routing access.

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Spartan-II Family Comparison: Where Does the XC2S200 Stand?

The table below shows the full Spartan-II device lineup to help you understand where the XC2S200-6FGG1126C fits within the family hierarchy.

The XC2S200-6FGG1126C is clearly the most capable device in the Spartan-II lineup, offering maximum logic density, the highest I/O count, and the largest memory resources available in this family.

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Speed Grade -6: What Does It Mean?

The -6 speed grade is exclusively available in the commercial temperature range for Spartan-II devices. This means the XC2S200-6FGG1126C is optimized for designs that operate within a 0°C to +85°C ambient temperature range and demand the fastest possible timing performance. Key benefits of speed grade -6 include:

• Shorter propagation delays across all logic paths
• Higher maximum clock frequency (up to 263 MHz)
• Better setup and hold time margins for synchronous designs
• Ideal for high-speed data interfaces and signal processing pipelines

If your application requires operation in industrial (−40°C to +85°C) or automotive temperature ranges, you should evaluate alternative speed grades and device variants accordingly.

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XC2S200-6FGG1126C Internal Architecture

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200 contains look-up tables (LUTs), flip-flops, and multiplexers. These building blocks allow engineers to implement virtually any digital logic function — from simple combinatorial gates to complex state machines and arithmetic units. The 1,176-CLB array in the XC2S200 provides substantial capacity for mid-to-large FPGA designs.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1126C supports up to 284 user I/O pins. Each IOB supports multiple I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and AGP. This versatility makes the device compatible with a wide variety of bus architectures and peripheral interfaces commonly found in embedded and communication systems.

Delay-Locked Loops (DLLs)

Four on-chip DLLs — one positioned at each corner of the die — enable precise clock management. DLLs can be used to eliminate clock distribution skew, multiply or divide clock frequencies, and introduce fine-grained phase shifts. This feature is essential for synchronizing data interfaces and optimizing timing closure in high-speed designs.

Hierarchical Routing Architecture

The XC2S200-6FGG1126C features a multi-level routing hierarchy. Local routes connect neighboring CLBs with minimal delay, while long-line resources span the full width or height of the device for global signal distribution. This architecture allows designers to achieve predictable timing closure across the full device.

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Top Applications for the XC2S200-6FGG1126C

The XC2S200-6FGG1126C is well-suited for a diverse range of embedded and signal-processing applications. Below is a summary of its most common use cases.

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XC2S200-6FGG1126C vs. Other XC2S200 Package Variants

The XC2S200 core silicon is available in several package options. The FGG1126 variant is the Pb-free (RoHS-compliant) version of the 1126-ball BGA.

The FGG1126 package offers a larger ball pitch array, which can simplify PCB fanout routing and improve manufacturability for high-density board layouts.

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Programming & Design Tool Support

Supported Design Suites

The XC2S200-6FGG1126C is supported by Xilinx’s legacy ISE Design Suite. While Vivado is the preferred tool for newer Xilinx devices (UltraScale, 7-Series), ISE remains the correct toolchain for Spartan-II targeting.

HDL Support

Designs targeting the XC2S200-6FGG1126C can be written in:

• VHDL — industry-standard hardware description language
• Verilog — widely used in ASIC and FPGA development
• ABEL / schematic entry — for legacy and educational designs

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Why Choose the XC2S200-6FGG1126C?

There are several compelling reasons to select this specific Xilinx Spartan-II FPGA for your next design:

• Highest logic density in the Spartan-II family — 200K gates and 5,292 logic cells give you maximum design headroom
• Pb-free packaging — the FGG1126 package satisfies RoHS requirements for global product compliance
• Fastest commercial speed grade — the -6 grade delivers the lowest propagation delays available for this device
• Proven 0.18 µm technology — mature, reliable process with extensive production history
• Field reprogrammability — design updates can be deployed in the field without hardware replacement, unlike ASICs
• Strong I/O flexibility — 284 user I/O pins with multi-standard support simplifies board-level integration

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1126C used for?

The XC2S200-6FGG1126C is used in digital logic applications including communications, industrial control, medical imaging, embedded processing, and security systems where a reprogrammable, mid-density FPGA is required.

What does the -6 speed grade mean on the XC2S200-6FGG1126C?

The -6 speed grade is the fastest available for the Spartan-II family in the commercial temperature range. It indicates the device’s shortest guaranteed propagation delays and supports clock frequencies up to 263 MHz.

Is the XC2S200-6FGG1126C RoHS compliant?

Yes. The second “G” in the FGG1126 package suffix indicates Pb-free, RoHS-compliant packaging.

What package does the XC2S200-6FGG1126C use?

It uses a Fine-Pitch Ball Grid Array (FBGA) with 1,126 solder balls, designated as the FGG1126 package.

What design tools support the XC2S200-6FGG1126C?

The Xilinx ISE Design Suite (version 14.x) is the primary supported toolchain for Spartan-II devices, including the XC2S200-6FGG1126C.

Can the XC2S200-6FGG1126C be used in industrial temperature applications?

No. The “C” suffix designates commercial temperature range (0°C to +85°C). For industrial-range operation, a different speed grade or device variant with an “I” suffix would be required.

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Summary

The XC2S200-6FGG1126C is the top-of-the-line member of Xilinx’s Spartan-II FPGA family. It combines 200,000 system gates, 5,292 logic cells, 284 I/O pins, and a 263 MHz maximum clock frequency in a Pb-free, 1,126-ball FBGA package. The -6 speed grade ensures the best available timing performance for commercial-range designs. Whether you are building communications infrastructure, industrial control systems, or embedded processing platforms, the XC2S200-6FGG1126C delivers the logic density, I/O flexibility, and design reprogrammability required for a wide range of demanding applications.