The XC2S200-6FGG1122C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1122-ball Fine Pitch BGA (Pb-free) package, and a -6 commercial speed grade, this device is engineered for high-volume embedded applications that demand fast logic density, flexible I/O, and low power consumption at 2.5V. Whether you’re designing communications equipment, industrial control systems, or consumer electronics, the XC2S200-6FGG1122C delivers reliable programmable logic performance backed by Xilinx’s proven 0.18µm process technology.

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What Is the XC2S200-6FGG1122C? A Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1122C belongs to Xilinx’s Spartan-II FPGA family — a series purpose-built as a superior, cost-effective alternative to mask-programmed ASICs. Unlike traditional ASICs, this FPGA eliminates non-recurring engineering (NRE) costs, shortens design cycles, and allows in-field programmability, meaning hardware updates can be deployed without physical board replacement.

For engineers sourcing a reliable Xilinx FPGA for production or replacement needs, the XC2S200-6FGG1122C represents a top-tier option in the 200K-gate class with one of the largest available BGA pin counts in the Spartan-II lineup.

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XC2S200-6FGG1122C Key Specifications at a Glance

Part Number Decoder

Understanding the part number helps engineers quickly verify device compatibility:

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Core Logic Specifications

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Speed & Electrical Characteristics

Note: The -6 speed grade is exclusively available in the Commercial temperature range.

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Package Information

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Spartan-II FPGA Family Comparison: Where Does XC2S200 Rank?

The XC2S200 sits at the top of the Spartan-II product family, offering the highest gate count, logic cells, and I/O resources in the lineup.

The XC2S200-6FGG1122C is the flagship device of the Spartan-II family, making it ideal for applications that require maximum logic capacity within this product generation.

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XC2S200-6FGG1122C Key Features & Architecture

#### Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB contains four slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops — enabling efficient implementation of combinatorial logic, registered logic, and shift registers.

#### Distributed RAM

With 75,264 bits of distributed RAM, the XC2S200 supports fast on-chip data storage directly embedded within the CLB fabric. This allows high-speed, low-latency memory access without routing penalties.

#### Block RAM

Two columns of dedicated block RAM (56K bits total) provide large, synchronous dual-port memory resources ideal for FIFOs, lookup tables, and frame buffers — completely independent of the CLB logic fabric.

#### Delay-Locked Loops (DLL)

Four on-chip Delay-Locked Loops — one at each corner of the die — provide zero-delay clock distribution, clock frequency synthesis, and phase shifting, making the XC2S200 well-suited for high-frequency synchronous designs.

#### Input/Output Blocks (IOBs)

Up to 284 user-configurable I/O pins support a wide range of single-ended and differential signaling standards, including LVTTL, LVCMOS2, PCI 3.3V, GTL, GTL+, HSTL, and SSTL. Each IOB features programmable slew rate control, pull-up/pull-down resistors, and optional output drive strength.

#### JTAG Boundary Scan

Full IEEE 1149.1 JTAG Boundary Scan support enables in-system programming (ISP) and board-level testing, reducing manufacturing test complexity.

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Typical Applications for the XC2S200-6FGG1122C

The XC2S200-6FGG1122C is ideally suited for a wide range of commercial and industrial applications:

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Why Choose the XC2S200-6FGG1122C Over Competing FPGAs?

#### Cost-Effective Programmability

The Spartan-II family was engineered to offer the flexibility of FPGAs at cost points approaching ASICs — making the XC2S200-6FGG1122C an excellent choice for high-volume designs where BOM cost is critical.

#### In-Field Upgradability

Unlike mask-programmed ASICs, the XC2S200-6FGG1122C can be reconfigured in the field. Firmware updates, bug fixes, and feature additions can be deployed without board-level hardware changes, dramatically reducing lifecycle maintenance costs.

#### Fastest Available Speed Grade

The -6 speed grade is the highest performance option in the Spartan-II lineup, exclusively available in the commercial temperature range. This makes it the right choice for timing-sensitive designs requiring maximum operating frequency.

#### Large 1122-Ball BGA for Dense I/O Routing

The FGG1122 package provides exceptional pin density in a compact footprint, making PCB routing cleaner compared to large QFP alternatives — especially valuable in multi-layer high-density PCB designs.

#### Proven Xilinx Ecosystem

The XC2S200-6FGG1122C is fully supported by Xilinx’s ISE Design Suite (WebPACK edition available free of charge), including synthesis, place-and-route, timing analysis, and JTAG programming tools.

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XC2S200-6FGG1122C vs. Similar Xilinx Spartan-II Variants

The XC2S200-6FGG1122C uniquely combines the fastest speed grade (-6), the largest pin count (1122 balls), and Pb-free compliance — making it the most capable and environmentally compliant variant in this device family.

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Configuration & Programming the XC2S200-6FGG1122C

The XC2S200-6FGG1122C supports multiple configuration modes to suit different system architectures:

Configuration data is stored in an external serial PROM (e.g., Xilinx XCF family) or loaded via a microcontroller/processor at power-up. The FPGA retains its configuration as long as power is applied — SRAM-based architecture means it must be reconfigured on every power cycle.

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Design Tools & Software Support

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Ordering & Availability Information

Important: The XC2S200 series carries an NRND (Not Recommended for New Designs) status. For new designs, Xilinx recommends migrating to current-generation devices such as the Spartan-7 or Artix-7 families. However, the XC2S200-6FGG1122C remains widely available through authorized distributors for legacy system maintenance, repair, and long-life production runs.

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Frequently Asked Questions (FAQ)

What does the “G” in FGG1122 mean?

The extra “G” in the package code (FGG vs. FG) indicates that the device uses Pb-free (lead-free) packaging, compliant with RoHS environmental directives.

Is the XC2S200-6FGG1122C compatible with 3.3V systems?

Yes. The I/O banks on the XC2S200 support LVTTL and LVCMOS33 standards, allowing direct interfacing with 3.3V logic systems, provided the VCCO supply for the relevant I/O bank is set to 3.3V.

What FPGA programming software is required?

The XC2S200-6FGG1122C is programmed using Xilinx ISE Design Suite and the iMPACT tool. Note that Xilinx Vivado does not support Spartan-II devices.

Can I use this device for new product designs?

Xilinx classifies the Spartan-II family as NRND. For new designs, migration to Spartan-7 (XC7S) or Artix-7 (XC7A) is recommended. The XC2S200-6FGG1122C is best suited for legacy support and repair applications.

 What is the maximum I/O count for XC2S200-6FGG1122C?

The XC2S200 supports up to 284 user I/O pins, not counting the four dedicated global clock/user input pins.

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Summary: Is the XC2S200-6FGG1122C Right for Your Design?

The XC2S200-6FGG1122C is the highest-performance, largest-package, and most I/O-rich device in the Xilinx Spartan-II FPGA family. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 75K bits of distributed RAM, and a Pb-free 1122-ball BGA package in the fastest -6 speed grade, it is a robust solution for legacy design maintenance, production continuity, and high-volume embedded applications requiring proven programmable logic.

For engineers working on Spartan-II based systems, this device represents the peak of what the Spartan-II family offers — and remains available through global electronics distributors to support long-lifecycle production and repair programs.