The XC2S200-6FGG1119C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1119-ball Fine-Pitch BGA (FGG1119) package, and a -6 commercial speed grade, this device is engineered for high-volume applications that demand fast programmable logic, low power consumption, and design flexibility — without the cost and risk of custom ASICs.

Whether you are designing embedded systems, communications hardware, industrial controllers, or consumer electronics, the XC2S200-6FGG1119C delivers the logic density, I/O flexibility, and speed performance your project requires.

---

What Is the XC2S200-6FGG1119C? – Product Overview

The XC2S200-6FGG1119C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic platform built on 0.18 µm CMOS process technology. The part number breaks down as follows:

The “G” in FGG denotes the Pb-free (lead-free) packaging, making this component compliant with RoHS environmental directives — an important consideration for products sold in the European Union and other regulated markets.

For a broader look at the Spartan-II product line and related Xilinx programmable logic devices, visit Xilinx FPGA.

---

XC2S200-6FGG1119C Key Technical Specifications

Core Logic Resources

Memory Resources

Package & I/O Information

Operating Conditions

---

XC2S200-6FGG1119C Architecture – How It Works

Configurable Logic Blocks (CLBs)

The XC2S200’s logic fabric is composed of 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains:

• Two slices, each with two 4-input Look-Up Tables (LUTs) and two flip-flops
• Logic for implementing combinatorial and registered functions
• Fast carry and arithmetic logic for efficient counter and adder implementation
• Support for distributed RAM (each LUT can operate as a 16×1 RAM)

Input/Output Blocks (IOBs)

Each IOB in the XC2S200 supports multiple programmable I/O standards, including single-ended and differential signaling. Key IOB features include:

• Individually programmable drive strength and slew rate
• Optional input delay to eliminate setup time requirements
• Programmable pull-up, pull-down, and keeper circuits
• Support for 3-state (tristate) output control

Block RAM

Two columns of dedicated block RAM are placed on opposite sides of the CLB array. Each block can be configured as:

• 4K × 4-bit (16K bits per block)
• Dual-port operation for simultaneous read and write
• Configurable depth and width ratios

Delay-Locked Loops (DLLs)

Four on-chip DLLs (one per device corner) provide:

• Clock deskew and alignment
• Clock frequency synthesis (multiply/divide)
• Phase shifting for timing optimization
• Elimination of clock distribution delay

---

Spartan-II Family Comparison – Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, I/O count, and memory resources.

The XC2S200-6FGG1119C stands at the top of the Spartan-II hierarchy. Its 1,119-ball FGG package offers the highest available pin count in the family, providing up to 284 user I/O pins — ideal for complex, high-pin-count designs.

---

Speed Grade -6: What Does It Mean?

The -6 speed grade is the fastest available in the Spartan-II family. Higher speed grade numbers indicate faster device performance (lower propagation delays).

Important: The -6 speed grade is exclusively available in the Commercial temperature range. If your design requires Industrial temperature operation (-40°C to +85°C), you must select the -5 speed grade variant.

---

Package Details: FGG1119 Ball Grid Array

The FGG1119 is a Fine-Pitch Ball Grid Array (FBGA) package with 1,119 solder balls. Key package characteristics:

The FGG designation (versus standard FG) confirms Pb-free solder balls, making the XC2S200-6FGG1119C suitable for RoHS-compliant product manufacturing.

---

Supported I/O Standards

One of the key strengths of the Spartan-II IOB architecture is its support for a wide range of industry-standard I/O interfaces:

---

Typical Applications for the XC2S200-6FGG1119C

The XC2S200-6FGG1119C is designed for high-volume, cost-sensitive applications where programmable flexibility, fast time-to-market, and field upgradeability outweigh the economics of custom silicon. Common use cases include:

Embedded Systems & SoC Designs

• Custom processor implementations
• Peripheral interface controllers (SPI, I2C, UART, USB)
• Memory controllers (SDRAM, SRAM, Flash)

Communications & Networking

• Protocol bridging and conversion (Ethernet, PCIe, LVDS)
• High-speed serial data processing
• Signal routing and switching fabric

Industrial & Test Equipment

• Motor control and motion systems
• Sensor fusion and data acquisition
• Automated test equipment (ATE)

Consumer Electronics

• Display controllers and image processing pipelines
• Audio/video signal processing
• Set-top boxes and multimedia decoders

---

XC2S200-6FGG1119C vs. ASIC: Why Choose FPGA?

The Spartan-II FPGA avoids the initial cost, lengthy development cycles, and inherent risk associated with conventional ASIC design. Additionally, in-field reprogrammability allows firmware and logic updates without hardware replacement — a critical advantage in fast-evolving product environments.

---

Design Tools & Programming

Supported Design Tools

The XC2S200-6FGG1119C is supported by Xilinx’s legacy ISE Design Suite (now superseded by Vivado for newer devices). For Spartan-II designs, the recommended toolchain includes:

Configuration Modes

Spartan-II devices support multiple configuration interfaces:

• Master Serial – Single PROM-based configuration
• Slave Serial – Daisy-chain multi-device configuration
• Master Parallel (SelectMAP) – Processor-based fast configuration
• Slave Parallel (SelectMAP) – Parallel bus configuration
• Boundary Scan (JTAG) – IEEE 1149.1 in-circuit programming

---

Ordering Information & Part Number Decode

---

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1119C used for?

The XC2S200-6FGG1119C is a programmable logic device used to implement custom digital circuits in embedded systems, communications, industrial control, and consumer electronics applications.

Is the XC2S200-6FGG1119C RoHS compliant?

Yes. The “G” in the FGG package designation indicates Pb-free (lead-free) solder balls, making it RoHS compliant for use in environmentally regulated markets.

What is the maximum operating frequency of the XC2S200-6FGG1119C?

The -6 speed grade supports system operation up to approximately 263 MHz, making it the fastest variant in the Spartan-II family.

What temperature range does the XC2S200-6FGG1119C support?

The “C” suffix indicates Commercial temperature range: 0°C to +85°C. For industrial temperature range, an alternative -5I variant would be required.

What programming software is used for the XC2S200-6FGG1119C?

The Xilinx ISE Design Suite with the iMPACT programming tool is the primary software for configuring and programming Spartan-II devices.

How does the XC2S200-6FGG1119C compare to newer Xilinx FPGAs?

While the Spartan-II family is a mature product line, it remains widely available for legacy design support and cost-sensitive, low-power applications. For new designs requiring higher logic density or advanced features, Xilinx’s Spartan-6, Spartan-7, or Artix-7 families are recommended alternatives.

---

Summary

The XC2S200-6FGG1119C is a feature-rich, high-gate-count FPGA that delivers exceptional programmable logic performance in a compact, Pb-free BGA package. With 200,000 system gates, 5,292 logic cells, 284 user I/Os, 75,264 bits of distributed RAM, and 56K bits of block RAM — all clocked at up to 263 MHz — it is a versatile solution for engineers seeking a proven, cost-effective alternative to ASIC-based designs.

Its support for multiple I/O standards, four on-chip DLLs, and flexible configuration modes make the XC2S200-6FGG1119C an ideal choice for a broad spectrum of digital design applications.