Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1118C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1118C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates and 5,292 logic cells in a large Fine-Pitch Ball Grid Array (FBGA) package. Whether you are building embedded systems, telecommunications equipment, or industrial automation controllers, the XC2S200-6FGG1118C offers a proven, reliable solution backed by Xilinx’s robust FPGA ecosystem.

For engineers sourcing Xilinx FPGA components, this device stands out as one of the most versatile members of the XC2S200 series.


What Is the XC2S200-6FGG1118C?

The XC2S200-6FGG1118C is a member of the Xilinx Spartan-II FPGA family, manufactured on a cost-effective 0.18-micron CMOS process. The part number can be decoded as follows:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest in the Spartan-II family, commercial range only)
FGG Fine-Pitch Ball Grid Array, Pb-Free (Green) package
1118 1,118-pin package
C Commercial temperature range (0°C to +85°C)

The “-6” speed grade designates the highest performance tier available in the Spartan-II lineup and is exclusively offered in the Commercial temperature range, making this part ideal for controlled-environment deployments.


XC2S200-6FGG1118C Key Specifications

Core Logic & Architecture

Parameter Value
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Process Technology 0.18 µm CMOS
Core Supply Voltage 2.5V
Max System Clock Up to 263 MHz

Memory Resources

Memory Type Capacity
Distributed RAM (SelectRAM™) 75,264 bits
Block RAM 56K bits (14 × 4K-bit blocks)
Configuration File Size 1,335,840 bits

Package & I/O

Parameter Value
Package Type FGG (Fine-Pitch BGA, Pb-Free)
Pin Count 1,118
Maximum User I/O 284 (up to 284 depending on configuration)
Selectable I/O Standards 16
Temperature Range Commercial: 0°C to +85°C

Clock Management

Parameter Value
Delay-Locked Loops (DLLs) 4 (one at each corner of the die)
Global Clock Inputs 4 (dedicated, usable as user I/O if unused)

XC2S200-6FGG1118C Top Features

#### Second-Generation ASIC Replacement Technology

The Spartan-II family was engineered as a cost-effective replacement for mask-programmed ASICs. Unlike traditional ASICs, the XC2S200-6FGG1118C eliminates expensive tooling costs and lengthy development cycles. It also supports unlimited reprogrammability, allowing design updates in the field without any hardware replacement — a critical advantage in iterative product development.

#### Virtex-Derived Architecture

The XC2S200 is based on a streamlined version of Xilinx’s Virtex FPGA architecture. This includes:

  • Configurable Logic Blocks (CLBs) arranged in a regular, flexible grid
  • Input/Output Blocks (IOBs) around the perimeter with support for 16 selectable I/O standards
  • SelectRAM™ hierarchical memory combining 16 bits/LUT distributed RAM with configurable 4K-bit block RAM
  • Delay-Locked Loops (DLLs) for precise clock management and zero-skew distribution

#### High-Speed Performance at Speed Grade -6

The -6 speed grade is the fastest available in the Spartan-II family. With system clock frequencies reaching up to 263 MHz, the XC2S200-6FGG1118C can handle demanding real-time signal processing and high-bandwidth data path applications.

#### Pb-Free (Green) FBGA Package

The “FGG” designation in the part number indicates a Pb-free (lead-free) Fine-Pitch Ball Grid Array package, compliant with RoHS environmental directives. This makes it suitable for manufacturers operating under strict environmental regulations.

#### Multiple Configuration Modes

The XC2S200-6FGG1118C supports five standard JTAG/serial configuration modes:

Configuration Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary-Scan (JTAG) 1-bit N/A
Express Mode 8-bit Input

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II product line, offering the maximum available logic density and I/O count in the family.

Device Logic Cells System Gates Total CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 96 86 6,144 bits 16K bits
XC2S30 972 30,000 216 92 13,824 bits 24K bits
XC2S50 1,728 50,000 384 176 24,576 bits 32K bits
XC2S100 2,700 100,000 600 176 38,400 bits 40K bits
XC2S150 3,888 150,000 864 260 55,296 bits 48K bits
XC2S200 5,292 200,000 1,176 284 75,264 bits 56K bits

XC2S200-6FGG1118C Applications

The XC2S200-6FGG1118C’s combination of high logic density, generous I/O count, and high-speed -6 performance makes it suitable for a wide range of applications:

#### Telecommunications & Signal Processing

With up to 263 MHz clock capability and a wide distributed RAM, this FPGA handles real-time DSP tasks, filter banks, and baseband processing for 4G/LTE infrastructure and satellite modems.

#### Industrial Automation

The 284 user I/O pins and support for 16 I/O standards allow direct interfacing with sensors, actuators, motor controllers, and industrial buses (like RS-485 and LVDS) in programmable logic controllers (PLCs) and motion control systems.

#### Embedded Vision & Image Processing

The 56K bits of block RAM combined with 75,264 bits of distributed RAM supports buffering and processing pipelines for machine vision, barcode scanning, and surveillance systems.

#### High-Speed Data Acquisition

The -6 speed grade and DLL-based clock management make this device well-suited for analog-to-digital converter (ADC) interfaces and multi-channel data loggers operating at high sample rates.

#### Prototyping & ASIC Emulation

Engineers use the XC2S200-6FGG1118C as a rapid prototyping platform before committing to custom silicon, dramatically cutting time-to-market and NRE (Non-Recurring Engineering) costs.


Design Tool Support: Programming the XC2S200-6FGG1118C

The XC2S200-6FGG1118C is supported by Xilinx ISE Design Suite (Integrated Software Environment). Note that the newer Vivado Design Suite does not support Spartan-II generation devices. Key ISE features for this part include:

  • HDL Synthesis: VHDL and Verilog support
  • Place-and-Route: Optimized for Spartan-II architecture
  • Timing Analysis: Static timing for -6 speed grade validation
  • JTAG Programming: Via iMPACT programmer or compatible third-party tools
  • Simulation: Integration with ModelSim and ISIM

XC2S200-6FGG1118C vs. Similar Variants

Part Number Speed Grade Package Pins Temp Range
XC2S200-5FG456C -5 FG (standard) 456 Commercial
XC2S200-5FG456I -5 FG (standard) 456 Industrial
XC2S200-6FG256C -6 FG (standard) 256 Commercial
XC2S200-6FGG256C -6 FGG (Pb-free) 256 Commercial
XC2S200-6FGG1118C -6 FGG (Pb-free) 1,118 Commercial

The XC2S200-6FGG1118C provides the highest pin count option with the fastest speed grade in a lead-free package, making it the preferred choice for pin-intensive, high-performance, and environmentally compliant designs.


Ordering Information & Availability

When sourcing the XC2S200-6FGG1118C, verify the following parameters with your distributor:

Attribute Detail
Manufacturer Xilinx (AMD)
Part Number XC2S200-6FGG1118C
Package 1,118-pin FGG (Fine-Pitch BGA, Pb-Free)
Speed Grade -6 (Commercial range only)
Operating Temperature 0°C to +85°C
Core Voltage 2.5V
RoHS Compliance Yes (Pb-Free “G” designation)
Programming Tool Xilinx ISE Design Suite

Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1118C?
A: The XC2S200 at speed grade -6 supports system clock frequencies up to 263 MHz, depending on the specific logic path and design implementation.

Q: Is the XC2S200-6FGG1118C still in production?
A: The Spartan-II family has been subject to product discontinuation notices (PDN) from Xilinx/AMD for certain package variants. Always verify current availability with an authorized distributor before placing production orders.

Q: Can I program the XC2S200-6FGG1118C with Vivado?
A: No. Vivado does not support Spartan-II devices. Use Xilinx ISE Design Suite for synthesis, implementation, and device programming.

Q: What I/O standards does the XC2S200-6FGG1118C support?
A: The device supports 16 selectable I/O standards, including LVCMOS, LVTTL, LVDS, PCI, GTL, and SSTL variants.

Q: What is the difference between FG and FGG packages?
A: “FGG” denotes a Pb-Free (lead-free) Fine-Pitch Ball Grid Array package, whereas “FG” is the standard (non-Pb-free) equivalent. The electrical and pin characteristics are identical.


Conclusion

The XC2S200-6FGG1118C represents the pinnacle of the Xilinx Spartan-II FPGA series — combining the maximum gate count (200,000 gates), the highest speed grade (-6), the largest pin count (1,118 pins), and a lead-free package in a single device. It is an excellent choice for engineers seeking a proven, cost-effective FPGA solution for telecommunications, industrial automation, embedded vision, and high-speed data acquisition applications.

With 5,292 logic cells, 75,264 bits of distributed RAM, 56K bits of block RAM, and 284 user I/O pins, this device delivers the logic resources and I/O flexibility required for demanding real-world designs — all while supporting field reprogrammability and eliminating the cost and risk of ASIC development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.