The XC2S200-6FGG1111C is a high-performance, cost-effective field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device offers 200,000 system gates, 5,292 logic cells, and a robust 1,111-ball Fine Pitch BGA (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are developing embedded systems, digital signal processing (DSP) circuits, or custom logic controllers, the XC2S200-6FGG1111C delivers the flexibility and performance engineers demand.

For a broader selection of compatible devices, explore our range of Xilinx FPGA products.

What Is the XC2S200-6FGG1111C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1111C belongs to Xilinx’s Spartan-II 2.5V FPGA family, a series engineered as a programmable alternative to costly mask-programmed ASICs. Unlike ASICs, the XC2S200-6FGG1111C allows field programmability, meaning designs can be updated after deployment without hardware replacement — a critical advantage in fast-moving product development environments.

Part Number Breakdown: Decoding XC2S200-6FGG1111C

XC2S200-6FGG1111C Key Specifications at a Glance

XC2S200-6FGG1111C Core Architecture and Logic Resources

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs arranged in a 28-column by 42-row array. Each CLB consists of two slices, and each slice includes two 4-input look-up tables (LUTs) and two flip-flops, enabling efficient implementation of combinational and sequential logic. The large CLB array makes the XC2S200-6FGG1111C ideal for complex state machines, arithmetic pipelines, and bus interface logic.

Distributed RAM and Block RAM

One of the key strengths of the Spartan-II architecture is its dual-memory structure:

Block RAM columns are positioned on opposite sides of the die, between the CLBs and the IOB columns, ensuring short routing paths for memory-intensive applications such as FIFO buffers, data queues, and lookup tables.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1111C incorporates four Delay-Locked Loops (DLLs), one placed at each corner of the die. DLLs enable precise clock management, including clock de-skewing, frequency synthesis, and phase shifting. This makes the device well-suited for synchronous high-speed designs requiring deterministic timing.

Input/Output and Package Details for XC2S200-6FGG1111C

I/O Capabilities

The XC2S200-6FGG1111C supports up to 284 user-configurable I/O pins in the 1,111-ball package, along with four dedicated global clock/user input pins (not included in the 284 count). The Input/Output Blocks (IOBs) support multiple I/O standards, providing broad compatibility with external peripherals, memory devices, and communication interfaces.

Supported I/O Standards

Package Comparison: XC2S200 Available Packages

The FGG1111 package is the Pb-free variant of the 1,111-pin FBGA, indicated by the double “G” in the part number suffix — a Xilinx convention for lead-free, RoHS-compliant packaging.

Speed Grade and Timing Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C). Engineers choosing the XC2S200-6FGG1111C benefit from the lowest propagation delays and highest clock frequencies achievable within the Spartan-II platform.

Xilinx Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, the most I/O, and the largest memory resources.

Programming and Configuration

The XC2S200-6FGG1111C uses SRAM-based configuration, which means the device must be configured at power-up. Configuration data can be loaded from an external Xilinx PROM (Platform ROM), a microprocessor, or a dedicated configuration controller via the following modes:

• Master Serial Mode – FPGA drives SCK, reads from serial PROM
• Slave Serial Mode – External controller drives configuration
• SelectMAP (Parallel) Mode – Fast 8-bit parallel configuration bus
• Boundary Scan (JTAG) Mode – IEEE 1149.1-compliant in-system programming and debug

Design Tools

The XC2S200-6FGG1111C is supported by Xilinx’s legacy ISE Design Suite (Foundation and WebPACK editions). Engineers may also migrate to Vivado Design Suite for modern simulation and synthesis flows, though Vivado’s FPGA implementation targets are focused on newer families.

Typical Applications for XC2S200-6FGG1111C

The XC2S200-6FGG1111C is widely deployed in applications that require flexible, high-density programmable logic in a commercial-grade environment:

Why Choose the XC2S200-6FGG1111C Over an ASIC?

For engineering teams evaluating programmable solutions versus custom silicon, the XC2S200-6FGG1111C offers several compelling advantages:

• Zero NRE (Non-Recurring Engineering) Cost – No mask charges, unlike ASICs
• Shorter Development Cycles – Designs go from concept to prototype in weeks, not months
• Field Upgradability – Reprogram the device in-system without PCB changes
• Reduced Risk – Functional changes are software, not silicon
• High-Volume Economics – Spartan-II pricing is optimized for production runs

XC2S200-6FGG1111C Ordering and Compliance Information

Part Marking Convention

Xilinx part marking follows this structure:

XC2S200 – 6 – FGG – 1111 – C
  |        |    |      |    |
Device   Speed Pkg.  Pins  Temp

The double “G” in FGG confirms this is a Pb-free (RoHS-compliant) package — suitable for designs subject to European RoHS directives and other environmental regulations.

Compliance

Frequently Asked Questions (FAQ) About XC2S200-6FGG1111C

Q: What does the “-6” speed grade mean on the XC2S200-6FGG1111C? A: The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range (0°C to +85°C), providing the lowest propagation delays for timing-critical designs.

Q: Is the XC2S200-6FGG1111C RoHS compliant? A: Yes. The double “G” in the package code (FGG) indicates a Pb-free, lead-free package that complies with RoHS environmental standards.

Q: What is the difference between XC2S200-6FGG1111C and XC2S200-6FG456C? A: The primary difference is the package. The FGG1111 variant uses a 1,111-ball Pb-free FBGA, while the FG456 uses a 456-ball FBGA. The larger package provides access to more I/O pins.

Q: What design software is compatible with the XC2S200-6FGG1111C? A: The device is supported by Xilinx ISE Design Suite. ISE WebPACK (free) covers the Spartan-II family for synthesis, simulation, and configuration file generation.

Q: Can the XC2S200-6FGG1111C be used in industrial temperature applications? A: The -6 speed grade is Commercial only (0°C to +85°C). For industrial temperature range (-40°C to +85°C), users should select the -5 speed grade variants.

Summary: XC2S200-6FGG1111C at a Glance

The XC2S200-6FGG1111C is Xilinx’s top-of-the-line Spartan-II FPGA, delivering 200,000 system gates, 5,292 logic cells, 284 user I/O, and over 131K bits of total on-chip memory in a Pb-free, 1,111-ball FBGA package. With the -6 commercial speed grade, four on-die DLLs, multi-standard I/O support, and JTAG programmability, it is a proven solution for high-volume embedded, industrial, and telecommunications applications. Its SRAM-based architecture and full ISE toolchain support ensure rapid prototyping and flexible field upgrades, making it an enduring choice for cost-sensitive, performance-driven FPGA design.