The XC2S200-6FGG1110C is a high-density, 2.5V Field Programmable Gate Array from Xilinx’s Spartan-II family, housed in a 1110-pin Fine-Pitch Ball Grid Array (FBGA) Pb-free package. Designed for cost-sensitive, high-volume applications, this FPGA delivers 200,000 system gates, 5,292 logic cells, and a speed grade of -6 — making it one of the most capable devices in the Spartan-II lineup for commercial-temperature designs.

Whether you’re an engineer sourcing a replacement part or evaluating the XC2S200-6FGG1110C for a new design, this guide covers everything: specifications, pinout, configuration modes, block RAM, I/O standards, and application use cases.

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What Is the XC2S200-6FGG1110C? — Spartan-II FPGA Overview

The XC2S200-6FGG1110C belongs to Xilinx’s Spartan-II 2.5V FPGA family. The Spartan-II series was engineered as a cost-effective yet powerful alternative to mask-programmed ASICs. Unlike ASICs, this FPGA allows field reprogrammability — meaning designs can be updated after deployment without hardware replacement.

Part Number Decode

Understanding the part number is essential for procurement and design verification:

Note: The “G” suffix in “FGG” denotes a Pb-free (RoHS-compliant) package, differentiating it from the standard FG package variant.

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XC2S200-6FGG1110C Key Specifications at a Glance

The table below summarizes the critical electrical and physical specifications of the XC2S200-6FGG1110C:

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XC2S200-6FGG1110C Architecture — Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1110C contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains:

• Two 4-input Look-Up Tables (LUTs)
• Two storage elements (flip-flops or latches)
• Fast carry and arithmetic logic
• Wide function multiplexers

This architecture enables the implementation of complex combinatorial and sequential logic at high speed.

Block RAM — Embedded Dual-Port Memory

Each block RAM is a fully synchronous, dual-ported 4,096-bit RAM, ideal for FIFOs, data buffers, lookup tables, and on-chip memory applications.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG1110C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. DLLs provide:

• Zero clock skew across the device
• Clock phase shifting and frequency synthesis
• Board-level clock deskewing when used as a clock mirror
• Elimination of clock distribution delays

Input/Output Blocks (IOBs)

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XC2S200-6FGG1110C Package & Pinout Information

FGG1110 Package Details

The large 1110-pin FBGA package provides maximum I/O flexibility, making the XC2S200-6FGG1110C the ideal choice when your design demands extensive connectivity alongside the Spartan-II’s core logic resources. For full pinout diagrams and ball assignment tables, refer to the official Xilinx DS001 datasheet.

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Configuration Modes — XC2S200-6FGG1110C

The XC2S200-6FGG1110C supports four distinct configuration modes, selected via mode pins (M0, M1, M2):

Design Tip: During power-on and throughout configuration, all I/O drivers are held in a high-impedance state, protecting connected devices during startup.

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Speed Grade -6: What It Means for Your Design

The -6 speed grade is the fastest commercially available speed grade in the Spartan-II family and is exclusively available in the commercial temperature range (0°C to +85°C). This makes the XC2S200-6FGG1110C ideal for high-throughput, timing-critical applications where maximum operating frequency is a priority.

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Supported I/O Standards

The XC2S200-6FGG1110C supports 16 selectable I/O standards, enabling seamless interfacing with a broad range of external devices:

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Applications of the XC2S200-6FGG1110C

The XC2S200-6FGG1110C is widely used across industries requiring programmable, high-density logic at 2.5V:

#### Communications & Networking

• Protocol bridging (UART, SPI, I2C, PCIe glue logic)
• Data framing and packet processing
• Line card control logic in telecom infrastructure

#### Industrial Automation

• Motor control and servo drive interfaces
• Real-time sensor data acquisition
• PLC (Programmable Logic Controller) co-processing

#### Consumer Electronics

• Set-top box video processing
• Display controller interfaces
• Audio/video signal routing

#### Defense & Aerospace (Commercial-Grade Designs)

• Signal processing boards
• Radar data pre-processing (commercial temperature environments)
• Avionics test equipment

#### Embedded Systems & Prototyping

• ASIC prototyping and functional verification
• University research platforms
• Custom SoC development

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XC2S200-6FGG1110C vs. Other Spartan-II Variants

The XC2S200-6FGG1110C stands out for its combination of the fastest speed grade (-6), the largest pin count (1110), and full RoHS/Pb-free compliance — making it the premium choice within the XC2S200 product line.

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Design Tools & Software Support

The XC2S200-6FGG1110C is supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II). Note that newer tools like Vivado do not support Spartan-II devices.

Recommended design flow:

1. RTL design in VHDL or Verilog
2. Synthesis using XST (within ISE)
3. Implementation (Translate → Map → Place & Route)
4. Bitstream generation
5. Configuration via JTAG, Master Serial, or Slave Parallel mode

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Ordering Information & Procurement

When sourcing the XC2S200-6FGG1110C, verify the following to ensure you receive an authentic, RoHS-compliant component:

• ✅ Manufacturer: Xilinx (now AMD Xilinx)
• ✅ Package marking: XC2S200-6FGG1110C
• ✅ Date code within acceptable range for your application
• ✅ Country of origin documentation available
• ✅ Anti-counterfeit testing for excess/surplus market purchases

For a wide selection of Spartan-II and other programmable logic devices, visit our catalog of Xilinx FPGA parts including the latest available stock and competitive pricing.

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Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1110C used for? It is a Xilinx Spartan-II FPGA used for digital logic implementation in communications, industrial, consumer electronics, and embedded system design — anywhere a cost-effective, reprogrammable 200K-gate logic device is required.

Q: Is the XC2S200-6FGG1110C RoHS compliant? Yes. The “G” in the FGG package designation indicates a Pb-free, RoHS-compliant part.

Q: What is the maximum clock frequency of the XC2S200-6FGG1110C? The XC2S200 family supports system clocks up to 263 MHz. The -6 speed grade represents the fastest performance tier in the Spartan-II family.

Q: Can the XC2S200-6FGG1110C be reprogrammed? Yes. Like all FPGAs, it is infinitely reprogrammable. Configuration data is loaded at power-on from an external PROM or via JTAG, and can be updated at any time.

Q: What design tool do I need for the XC2S200-6FGG1110C? Xilinx ISE Design Suite (version 14.7 or earlier) is required, as Vivado does not support Spartan-II devices.

Q: What is the operating temperature of the XC2S200-6FGG1110C? The “C” suffix indicates commercial temperature range: 0°C to +85°C.

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Summary

The XC2S200-6FGG1110C is a proven, field-reprogrammable solution delivering 200,000 system gates, 5,292 logic cells, 57,344 bits of block RAM, four DLLs, and support for 16 I/O standards — all in a Pb-free 1110-pin FBGA package. With the fastest commercial speed grade (-6) and decades of deployment history, this Spartan-II FPGA remains a reliable choice for legacy designs, ASIC prototyping, and high-density logic applications requiring broad I/O connectivity.