The XC2S200-6FGG1104C is a high-performance, cost-effective programmable logic device from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a 1104-pin Pb-free Fine Pitch BGA (FGG) package, this FPGA is engineered for high-volume commercial applications that demand speed, flexibility, and low-cost reprogrammability. Whether you are designing digital signal processing systems, communications hardware, or industrial control equipment, the XC2S200-6FGG1104C delivers a proven, field-upgradeable alternative to mask-programmed ASICs.
What Is the XC2S200-6FGG1104C?
The XC2S200-6FGG1104C is a member of Xilinx’s Spartan-II 2.5V FPGA family. The part number breaks down as follows:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II device with ~200,000 system gates |
| -6 |
Speed Grade 6 (fastest available for Spartan-II) |
| FGG |
Fine Pitch Ball Grid Array, Pb-Free (RoHS-compatible) |
| 1104 |
1104 total package pins |
| C |
Commercial temperature range (0°C to +85°C) |
As part of the Xilinx FPGA product lineup, the XC2S200 represents the largest device in the Spartan-II family, making it the go-to choice when maximum logic density is required within this series.
XC2S200-6FGG1104C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates (Logic + RAM) |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total Configurable Logic Blocks (CLBs) |
1,176 |
| Maximum Available User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
Electrical & Physical Characteristics
| Parameter |
Specification |
| Core Supply Voltage |
2.5V |
| Technology Node |
0.18 µm CMOS |
| Maximum System Clock |
263 MHz |
| Package Type |
Fine Pitch BGA (FGG) |
| Total Pins |
1,104 |
| Lead-Free (Pb-Free) |
Yes — “G” suffix confirms RoHS compliance |
| Temperature Range |
Commercial: 0°C to +85°C |
| Speed Grade |
-6 (fastest; exclusive to commercial range) |
Delay-Locked Loops (DLLs)
| Feature |
Detail |
| Number of DLLs |
4 (one at each corner of the die) |
| DLL Function |
Clock deskew, frequency synthesis, phase shifting |
XC2S200-6FGG1104C Features & Architecture
High-Density Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1104C contains 1,176 CLBs arranged in a 28×42 array. Each CLB includes four lookup tables (LUTs), flip-flops, and dedicated carry logic. This architecture enables complex combinational and sequential functions to be implemented efficiently, making the device well-suited for data-path-intensive designs.
Abundant On-Chip Memory
With 75,264 bits of distributed RAM embedded within the CLB fabric and 56K bits of dedicated block RAM, the XC2S200-6FGG1104C provides designers with flexible, dual-port memory resources. Block RAM supports synchronous read and write operations, ideal for FIFOs, data buffers, and lookup tables in communications applications.
Four Delay-Locked Loops (DLLs)
The four on-chip DLLs provide precise clock management capabilities — including clock deskew, phase shifting, and frequency multiplication/division — enabling system designers to meet strict timing requirements without external clock conditioning circuitry.
284 Flexible User I/Os
The XC2S200-6FGG1104C supports up to 284 user-configurable I/O pins (not counting the four dedicated global clock inputs). Each I/O block (IOB) supports multiple voltage standards and programmable drive strength, offering broad interface compatibility.
Speed Grade -6: Maximum Performance
The -6 speed grade is the fastest speed grade available in the Spartan-II family and is exclusively offered in the commercial temperature range. With a maximum operational frequency of 263 MHz, this part is designed for timing-critical applications where every nanosecond counts.
Pb-Free FGG Package
The “G” in FGG denotes a Pb-free (lead-free) packaging option, making the XC2S200-6FGG1104C fully compliant with RoHS environmental directives. This is essential for products sold in the EU and other markets with strict environmental regulations.
XC2S200-6FGG1104C vs. Other Spartan-II Devices
| Device |
Logic Cells |
System Gates |
CLB Array |
Max I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the greatest logic density, I/O count, and memory resources.
Ordering Information & Part Number Decoder
Understanding the XC2S200-6FGG1104C part number is essential for procurement and design planning:
| Field |
Code |
Description |
| Device Family |
XC2S |
Xilinx Spartan-II |
| Gate Count |
200 |
~200,000 system gates |
| Speed Grade |
-6 |
Fastest; commercial temperature only |
| Package |
FGG |
Fine Pitch BGA, Pb-Free |
| Pin Count |
1104 |
1,104 ball package |
| Temperature |
C |
Commercial (0°C to +85°C) |
Note: The standard (non-Pb-free) equivalent would use “FG” instead of “FGG”. Always verify the “G” suffix when RoHS compliance is required for your end product.
Typical Applications of the XC2S200-6FGG1104C
The XC2S200-6FGG1104C is ideal for a wide range of industries and use cases:
- Telecommunications & Networking — Line cards, protocol bridging, packet processing
- Digital Signal Processing (DSP) — Video processing, audio encoding, sensor data pipelines
- Industrial Automation — Motor control, PLC co-processors, machine vision
- Consumer Electronics — Set-top boxes, display controllers, home automation hubs
- Embedded Systems — Soft-core processor implementations (MicroBlaze soft CPU)
- Defense & Aerospace (commercial grade only) — Signal intelligence, data acquisition
- Test & Measurement — Logic analyzers, pattern generators, data capture systems
Why Choose the XC2S200-6FGG1104C Over an ASIC?
The Spartan-II FPGA family was specifically engineered as a cost-effective alternative to mask-programmed ASICs. The XC2S200-6FGG1104C offers three critical advantages over traditional ASIC solutions:
- No NRE (Non-Recurring Engineering) costs — There are no mask-set charges or lengthy fabrication cycles.
- Field upgradability — The design can be reprogrammed in-system, allowing bug fixes and feature additions after deployment — something that is impossible with an ASIC.
- Faster time-to-market — Prototype and iterate within days, not months.
Programming & Design Tools
The XC2S200-6FGG1104C is supported by Xilinx’s legacy ISE Design Suite, which provides:
- HDL synthesis (VHDL, Verilog)
- Place-and-route for the Spartan-II architecture
- Timing simulation and static timing analysis
- JTAG-based configuration and boundary scan (IEEE 1149.1 compliant)
- iMPACT programming software for device configuration
For newer designs, Xilinx’s Vivado Design Suite provides a more modern environment. However, Spartan-II is a legacy family and ISE remains the primary supported toolchain for this device.
Configuration & Programming Modes
| Mode |
Description |
| Master Serial |
FPGA drives the configuration clock; reads from serial PROM |
| Slave Serial |
External controller drives clock and data |
| Master Parallel (SelectMAP) |
Fast parallel configuration via 8-bit data bus |
| JTAG (Boundary Scan) |
IEEE 1149.1 compliant in-system programming |
XC2S200-6FGG1104C Compliance & Certifications
| Standard |
Status |
| RoHS (EU Directive 2011/65/EU) |
Compliant (Pb-Free “G” package) |
| IEEE 1149.1 JTAG Boundary Scan |
Supported |
| JEDEC Package Standards |
FGG1104 compliant |
| Commercial Temperature Range |
0°C to +85°C (Junction) |
Frequently Asked Questions (FAQ)
What does the “-6” speed grade mean in XC2S200-6FGG1104C?
The -6 speed grade denotes the fastest performance tier available in the Spartan-II family. It is exclusively available in the commercial temperature range (0°C to +85°C). A lower number (e.g., -5) would indicate a slower speed grade.
Is the XC2S200-6FGG1104C RoHS compliant?
Yes. The double “G” in FGG confirms this is a Pb-free, RoHS-compliant package. The single “G” variants (e.g., FG456) indicate standard tin-lead packaging.
What is the maximum operating frequency of the XC2S200-6FGG1104C?
The device supports a maximum system clock of 263 MHz at the -6 speed grade.
How many I/O pins are available on the XC2S200-6FGG1104C?
Up to 284 user-configurable I/O pins are available, plus four dedicated global clock/user input pins.
What design software should I use for the XC2S200-6FGG1104C?
The Xilinx ISE Design Suite is the primary tool for Spartan-II devices. ISE supports HDL design entry, synthesis, implementation, and device programming.
Can the XC2S200-6FGG1104C replace an ASIC?
Yes. The Spartan-II family was designed specifically as a programmable alternative to mask-programmed ASICs, offering field upgradability and zero NRE cost.
Summary
The XC2S200-6FGG1104C is the flagship device of Xilinx’s Spartan-II FPGA family, combining 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and a high-performance -6 speed grade within a 1104-pin Pb-free BGA package. It is a proven, cost-efficient solution for engineers seeking a reprogrammable alternative to ASICs across telecommunications, industrial, DSP, and embedded system applications. Its RoHS-compliant packaging, commercial-grade temperature rating, and 263 MHz maximum operating frequency make it a versatile and reliable choice for both prototype and high-volume production designs.
