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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1102C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1102C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD Xilinx), part of the industry-proven Spartan-II family. Designed for high-volume, performance-sensitive applications, this device delivers 200,000 system gates in a compact 2.5V architecture — making it an ideal programmable logic solution for embedded systems, communications, and industrial design.

Whether you’re sourcing a replacement component or integrating it into a new PCB design, this guide covers everything you need to know about the XC2S200-6FGG1102C: technical specifications, key features, package details, and typical applications.


What Is the XC2S200-6FGG1102C? – Part Number Breakdown

Understanding the Xilinx part number helps engineers quickly identify the exact component:

Part Number Segment Meaning
XC2S200 Spartan-II family, 200K system gates
-6 Speed Grade 6 (fastest available; Commercial range only)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-free (RoHS)
1102 1102-pin package
C Commercial temperature range (0°C to +85°C)

The “G” in FGG denotes a Pb-free (lead-free) package, complying with RoHS environmental standards.


XC2S200-6FGG1102C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Electrical & Performance Specifications

Parameter Value
Core Supply Voltage 2.5V
Speed Grade -6 (fastest in Spartan-II)
Maximum Clock Frequency Up to 263 MHz
Technology Node 0.18 µm
Temperature Range 0°C to +85°C (Commercial)

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG1102
Total Pins 1,102
RoHS Compliance Yes (Pb-free)

XC2S200-6FGG1102C Top Features

High-Density Programmable Logic Architecture

The XC2S200 is built around Xilinx’s Configurable Logic Block (CLB) matrix — a 28×42 array delivering 1,176 CLBs total. Each CLB contains four logic cells, each consisting of a function generator (LUT), carry logic, and a flip-flop. This architecture enables efficient implementation of complex combinational and sequential logic.

Four On-Chip Delay-Locked Loops (DLLs)

One DLL is placed at each corner of the die, providing accurate clock edge alignment, reduced clock skew, and clock frequency synthesis. These DLLs are essential for high-speed synchronous designs and multi-clock-domain applications.

Dedicated Block RAM

The XC2S200 includes 56K bits of dedicated on-chip block RAM, arranged in two columns on opposite sides of the die. Block RAM supports dual-port access, making it suitable for FIFOs, memory buffers, and lookup tables without consuming CLB resources.

Versatile I/O Standards Support

The Input/Output Blocks (IOBs) support a wide range of single-ended and differential I/O standards, including LVTTL, LVCMOS, GTL, GTL+, SSTL, CTT, and AGP. Programmable drive strength and slew rate control further optimize signal integrity.

-6 Speed Grade: Maximum Performance

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively offered in the Commercial temperature range. This makes the XC2S200-6FGG1102C optimal for timing-critical designs requiring the highest achievable logic performance.


Spartan-II Family Comparison Table

The table below shows how the XC2S200 compares to other members in the Spartan-II lineup:

Device Logic Cells System Gates CLB Array Max I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest gate count, most CLBs, greatest I/O count, and largest memory resources.


XC2S200-6FGG1102C Typical Applications

The XC2S200-6FGG1102C is well-suited for a broad range of embedded and industrial applications:

Application Area Use Case
Communications Protocol bridges, data serialization, line interfaces
Consumer Electronics Display controllers, signal processing
Industrial Automation Motor control, sensor interfaces, PLCs
Networking Packet processing, switching logic
Embedded Systems Co-processors, hardware accelerators
Test & Measurement Data acquisition, pattern generation
PCB Prototyping Rapid design verification, ASIC replacement

As a programmable alternative to mask-programmed ASICs, the XC2S200 eliminates costly NRE (Non-Recurring Engineering) charges and allows in-field design updates — making it a superior choice for both prototyping and production.


Design Tools & Support for XC2S200-6FGG1102C

Xilinx ISE Design Suite

The Spartan-II family is supported by Xilinx’s ISE Design Suite (legacy toolchain). Engineers can use ISE for synthesis, implementation, timing analysis, and bitstream generation targeting the XC2S200.

JTAG Boundary Scan Support

The device includes full IEEE 1149.1 JTAG boundary scan support, enabling in-circuit testing (ICT), programming, and debugging without additional hardware.

Configuration Modes

The XC2S200 supports multiple configuration modes: Master Serial, Slave Serial, Master Parallel (SelectMAP), Slave Parallel, and JTAG — providing flexible integration into virtually any system architecture.


XC2S200-6FGG1102C vs. Similar Parts

Engineers looking at the XC2S200-6FGG1102C may also consider these closely related variants:

Part Number Speed Grade Package Pins Pb-Free Temp Range
XC2S200-6FGG1102C -6 FBGA 1102 Yes Commercial
XC2S200-5FGG1102C -5 FBGA 1102 Yes Commercial
XC2S200-6FG456C -6 FBGA 456 No Commercial
XC2S200-6PQ208C -6 PQFP 208 No Commercial

The FGG1102 package offers the highest pin count available in this device, making it ideal for designs that require the maximum 284 user I/O pins.


Why Choose the XC2S200-6FGG1102C?

The XC2S200-6FGG1102C stands out among programmable logic devices for several reasons:

  • Highest performance in the Spartan-II family with speed grade -6
  • Maximum I/O density with 1,102-pin Pb-free FBGA package
  • Proven reliability backed by Xilinx’s mature 0.18µm process technology
  • Full RoHS compliance with Pb-free packaging
  • Cost-effective alternative to custom ASICs for medium-to-high volume production
  • Field-upgradeable logic — update your design without changing hardware

For engineers designing with Xilinx FPGA solutions, the XC2S200-6FGG1102C remains a dependable choice for legacy system support, PCB redesigns, and new projects requiring proven, stable programmable logic.


Ordering & Availability

When sourcing the XC2S200-6FGG1102C, verify the following before purchasing:

Check Detail
Manufacturer Xilinx (AMD Xilinx)
Part Number (Exact) XC2S200-6FGG1102C
Pb-Free Confirmation “G” in FGG confirms Pb-free
Temperature Grade “C” = Commercial (0°C to +85°C)
Counterfeit Avoidance Source from authorized distributors only
Datasheet Reference Xilinx DS001 (Spartan-II Family Data Sheet)

Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean in XC2S200-6FGG1102C?

The -6 speed grade represents the fastest logic performance available in the Spartan-II family. It supports the shortest propagation delays and highest clock frequencies, up to 263 MHz. Note that -6 is only available in the Commercial temperature range.

Is the XC2S200-6FGG1102C RoHS compliant?

Yes. The “G” in the package code (FGG) indicates a Pb-free, RoHS-compliant package.

What is the difference between FGG1102 and FG456 packages?

The FGG1102 is a 1,102-pin Pb-free Fine-Pitch BGA package, while FG456 is a standard 456-pin FBGA. The FGG1102 provides more I/O pin access and is used in designs requiring higher connectivity.

What software do I need to program the XC2S200-6FGG1102C?

The Xilinx ISE Design Suite is the primary toolchain for Spartan-II devices. For programming and debugging, Xilinx iMPACT software supports JTAG-based configuration.

Can the XC2S200-6FGG1102C replace an ASIC?

Yes — Xilinx specifically designed the Spartan-II family as a cost-effective, reprogrammable alternative to mask-programmed ASICs. It eliminates NRE costs and allows field updates.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.