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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
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XC2S200-6FGG1101C: Xilinx Spartan-II FPGA – Full Specifications, Features & Buying Guide

Product Details

The XC2S200-6FGG1101C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at up to 263 MHz — all in a compact Fine-Pitch Ball Grid Array (FBGA) package. Whether you’re designing embedded systems, digital signal processing boards, or industrial control hardware, the XC2S200-6FGG1101C offers the flexibility and performance engineers demand.


What Is the XC2S200-6FGG1101C? A Complete Overview

The XC2S200-6FGG1101C is part of Xilinx’s Spartan-II FPGA series — a 2.5V programmable logic family built on 0.18µm CMOS technology. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device, 200K system gates
-6 Speed grade 6 (fastest in the family)
FGG Fine-Pitch Ball Grid Array, Pb-free (G = green/lead-free)
1101 1,101-ball package
C Commercial temperature range (0°C to +85°C)

This device is an excellent choice for engineers looking for a reliable, reprogrammable alternative to mask-programmed ASICs, with the added advantage of in-field design updates without hardware replacement.


XC2S200-6FGG1101C Key Specifications at a Glance

Core Logic Resources

Parameter XC2S200-6FGG1101C Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Electrical & Physical Specifications

Parameter Value
Supply Voltage (VCC) 2.5V
Technology Node 0.18µm CMOS
Speed Grade -6 (Fastest)
Max Frequency 263 MHz
Package Type FGG (Fine-Pitch BGA, Pb-free)
Package Pin Count 1,101 balls
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Pb-free (G suffix)

XC2S200-6FGG1101C Architecture and Internal Structure

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1101C contains 1,176 CLBs arranged in a 28×42 array. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs), two flip-flops, and carry/control logic. This structure gives designers immense flexibility for implementing combinational and sequential logic circuits.

Block RAM

The device includes 56K bits of block RAM, organized as two columns of dedicated Block RAM elements. These are dual-port memories ideal for FIFOs, data buffers, lookup tables, and on-chip data storage. The distributed RAM totals an additional 75,264 bits spread across the CLB fabric.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are integrated — one at each corner of the die. DLLs enable zero-delay clock buffering, frequency synthesis, and phase shifting, which are critical for high-speed system synchronization and skew elimination in complex PCB designs.

Input/Output Blocks (IOBs)

With up to 284 user I/Os plus four global clock/user input pins, the XC2S200-6FGG1101C supports a wide range of interface standards. IOBs include programmable pull-up/pull-down resistors, slew rate control, and input delay elements.


Spartan-II Family Comparison: Where Does XC2S200 Stand?

The XC2S200 is the largest and most capable device in the Spartan-II family. Here is how it compares against other family members:

Device Logic Cells System Gates CLB Array Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8×12 86 6,144 16K
XC2S30 972 30,000 12×18 92 13,824 24K
XC2S50 1,728 50,000 16×24 176 24,576 32K
XC2S100 2,700 100,000 20×30 176 38,400 40K
XC2S150 3,888 150,000 24×36 260 55,296 48K
XC2S200 5,292 200,000 28×42 284 75,264 56K

The XC2S200 offers the highest gate count, most CLBs, most I/Os, and largest RAM capacity in the family — making it the ideal choice for the most demanding Spartan-II designs.


Speed Grade -6: Why It Matters for the XC2S200-6FGG1101C

The -6 speed grade is the fastest available in the Spartan-II family and is exclusively available in the Commercial temperature range (0°C to +85°C). It provides:

  • Maximum system frequency up to 263 MHz
  • Faster setup and hold times compared to -5 speed grade
  • Shorter propagation delays through CLBs and routing
  • Reduced clock-to-output (Tco) times for IOBs

If your design requires maximum timing margin or high clock frequencies, the -6 speed grade on the XC2S200-6FGG1101C is the optimal selection.


Package Details: FGG1101 Fine-Pitch BGA

Why Choose the FGG1101 Package?

The FGG1101 (Fine-Pitch Ball Grid Array, 1,101 balls, Pb-free) package offers several advantages for modern PCB designs:

Feature Benefit
Fine-pitch BGA Reduced PCB footprint vs. QFP packages
Lead-free (Pb-free) RoHS compliant; suitable for eco-conscious designs
1,101 ball count Maximum I/O accessibility for complex designs
BGA thermal profile Better heat dissipation than leaded QFP packages

The “G” in FGG indicates the Pb-free (green) packaging option — an important consideration for products sold in EU markets and other regions with strict RoHS regulations.


XC2S200-6FGG1101C Applications and Use Cases

#### Embedded Systems and SoC Designs

The XC2S200-6FGG1101C’s large logic fabric and abundant I/Os make it ideal for embedding custom processor cores (such as PicoBlaze or MicroBlaze-lite) alongside hardware accelerators in a single reprogrammable device.

#### Digital Signal Processing (DSP)

With fast clock speeds, distributed arithmetic via LUTs, and ample block RAM, the XC2S200-6FGG1101C is well-suited for DSP applications including digital filters, FFT engines, and data converters.

#### Industrial Control and Automation

The FPGA’s deterministic timing and reprogrammable logic make it valuable for motor control, PLC replacement, industrial communication interfaces (UART, SPI, I2C), and real-time machine monitoring systems.

#### Communications and Networking

Designers use the XC2S200-6FGG1101C for protocol bridging, packet processing, framing logic, and interface conversion in telecommunications and networking equipment.

#### Prototyping and ASIC Replacement

As Xilinx designed the Spartan-II family as a superior alternative to mask-programmed ASICs, the XC2S200-6FGG1101C allows design teams to prototype, validate, and even deploy final hardware without the high NRE costs and long lead times of custom silicon.


Ordering Information and Part Number Decoder

When sourcing the XC2S200-6FGG1101C, understanding the full ordering code ensures you receive the correct variant:

Field Value Description
Device XC2S200 Spartan-II, 200K gates
Speed Grade -6 Fastest speed; Commercial only
Package FGG Fine-Pitch BGA, Pb-free
Pin Count 1101 1,101 solder balls
Temperature C Commercial (0°C to +85°C)

Note: The -6 speed grade is not available for Industrial temperature range devices. If your application requires extended temperature operation (-40°C to +85°C), consider the -5 speed grade variants.


XC2S200-6FGG1101C vs. Common Alternatives

Part Number Gates Package Speed Temp Range Lead-Free
XC2S200-6FGG1101C 200K FGG1101 -6 Commercial Yes
XC2S200-5FGG456C 200K FGG456 -5 Commercial Yes
XC2S200-6FG456C 200K FG456 -6 Commercial No
XC2S200-5FGG456I 200K FGG456 -5 Industrial Yes
XC2S150-6FGG456C 150K FGG456 -6 Commercial Yes

The XC2S200-6FGG1101C stands out with its 1,101-ball package, which offers more I/O pins and routing options compared to the 456-ball variants, making it optimal for high pin-count system designs.


Programming and Configuration

The XC2S200-6FGG1101C supports SRAM-based configuration, meaning the device is reprogrammed each time power is applied. Configuration data is typically stored in an external Xilinx Platform Flash PROM or SPI/BPI flash memory device and loaded at startup via one of several configuration modes:

  • Master Serial – FPGA controls a serial PROM
  • Slave Serial – External controller streams bitstream
  • Master Parallel – Parallel PROM interface
  • Slave Parallel – Processor-controlled loading
  • JTAG (Boundary Scan) – In-system programming and debugging

This flexibility allows designers to select the configuration method that best suits their system architecture and BOM constraints.


Development Tools for XC2S200-6FGG1101C

Xilinx (now AMD) provides a complete design toolchain for the Spartan-II family:

Tool Purpose
Xilinx ISE Design Suite RTL design, synthesis, place & route
VHDL / Verilog Hardware description languages for design entry
ModelSim / Vivado Simulator Functional and timing simulation
ChipScope Pro In-system logic analyzer
iMPACT Configuration and programming tool

Note: The XC2S200 is supported in Xilinx ISE 14.7 (the final ISE release). It is not supported in Vivado, which targets newer device families.


Why Choose the XC2S200-6FGG1101C? Key Advantages

  • Largest Spartan-II device — 200K gates, 5,292 logic cells
  • Fastest speed grade (-6) — Up to 263 MHz operation
  • Lead-free FGG package — RoHS compliant for global markets
  • 1,101-ball BGA — Maximum I/O flexibility
  • Cost-effective ASIC alternative — No NRE costs, field upgradeable
  • Four DLLs — Superior clock management
  • 56K bits Block RAM — On-chip data storage without external memory

Frequently Asked Questions (FAQ)

Q: Is the XC2S200-6FGG1101C RoHS compliant?
Yes. The “G” in the package code (FGG) denotes Pb-free/lead-free packaging, making the XC2S200-6FGG1101C fully RoHS compliant.

Q: What is the maximum operating temperature of XC2S200-6FGG1101C?
The “C” suffix indicates Commercial temperature range: 0°C to +85°C ambient operating temperature.

Q: Can I use XC2S200-6FGG1101C in a new design?
While the Spartan-II family is a mature product, it remains available for production and legacy support. For new designs, Xilinx recommends evaluating newer families such as Spartan-7 or Artix-7. However, for replacement or continuity needs, the XC2S200-6FGG1101C remains a viable choice.

Q: What configuration PROM is compatible with the XC2S200-6FGG1101C?
Xilinx XCF Platform Flash PROMs and XC18V series PROMs are compatible. The bitstream size for XC2S200 is approximately 1.2 Mb.

Q: Where can I find more Xilinx FPGA products?
You can browse the full range of Xilinx FPGA products including Spartan, Artix, Kintex, and Virtex families from authorized distributors.


Conclusion

The XC2S200-6FGG1101C is a proven, high-gate-count Xilinx Spartan-II FPGA offering exceptional logic density, high-speed operation, and flexible I/O in a lead-free BGA package. Its 200,000 system gates, 284 user I/Os, four DLLs, and -6 speed grade make it the top-performing member of the Spartan-II family. Whether you need it for legacy system support, ASIC prototyping, DSP, communications, or embedded control applications, the XC2S200-6FGG1101C delivers reliable, reprogrammable logic performance that engineers can count on.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.