The XC2S200-6FGG1100C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates in a fine-pitch BGA package — making it a go-to solution for engineers seeking programmable logic at scale. Whether you’re building embedded systems, consumer electronics, or industrial controllers, the XC2S200-6FGG1100C offers the versatility and performance your design demands.
For a broader look at available Xilinx programmable logic devices, explore the full lineup of Xilinx FPGA solutions.
What Is the XC2S200-6FGG1100C? Part Number Breakdown
Understanding the part number helps you quickly identify the exact variant you need:
| Segment |
Value |
Meaning |
| XC |
XC |
Xilinx Commercial Product |
| 2S |
2S |
Spartan-II Family |
| 200 |
200 |
200,000 System Gates |
| -6 |
-6 |
Speed Grade (Fastest in Spartan-II) |
| FGG |
FGG |
Fine-Pitch Ball Grid Array, Pb-Free Package |
| 1100 |
1100 |
1,100-pin Package |
| C |
C |
Commercial Temperature Range (0°C to +85°C) |
The -6 speed grade is the fastest available in the Spartan-II lineup and is exclusively offered in the Commercial temperature range, making this part ideal for demanding commercial and industrial product applications.
XC2S200-6FGG1100C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Delay-Locked Loops (DLLs) |
4 |
Package & Electrical Characteristics
| Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FGG) — Pb-Free |
| Pin Count |
1,100 |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V |
| Speed Grade |
-6 (Fastest) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Configuration Bits |
1,335,840 |
XC2S200-6FGG1100C Features and Architecture
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1100C is built around 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains look-up tables (LUTs), flip-flops, and fast carry logic — the building blocks for implementing any digital function. This dense architecture allows complex combinational and sequential logic to be synthesized efficiently within a single chip.
Block RAM and Distributed RAM
Memory flexibility is a standout feature of this device:
- 75,264 bits of distributed RAM embedded within the CLB array for fast, single-cycle access to small data sets.
- 56K bits of dedicated block RAM organized in two columns on opposite sides of the die, providing larger storage for FIFOs, buffers, and lookup tables.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops — one in each corner of the die — provide clock management capabilities including clock deskewing, frequency synthesis, and phase shifting. This eliminates the need for external clock conditioning components and simplifies board design.
Input/Output Blocks (IOBs)
With up to 284 user-configurable I/O pins, the XC2S200-6FGG1100C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. This flexibility allows the FPGA to interface directly with a wide range of external devices without level-shifting circuitry.
Configuration Modes
The XC2S200-6FGG1100C supports multiple configuration modes to fit various system architectures:
| Configuration Mode |
M[2:0] |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
000 |
Output |
1-bit |
Yes |
| Slave Serial |
110 |
Input |
1-bit |
Yes |
| Slave Parallel |
010 |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
101 |
N/A |
1-bit |
No |
During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, ensuring safe board-level initialization.
Spartan-II Family Comparison: Where Does XC2S200 Fit?
The XC2S200 is the largest device in the Spartan-II family, offering the most resources for complex designs:
| Device |
Logic Cells |
System Gates |
Total CLBs |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
96 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
216 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
384 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
600 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
864 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
1,176 |
284 |
56K |
For designs that push the boundaries of the Spartan-II family in terms of logic density, I/O count, and memory, the XC2S200-6FGG1100C is the clear top-tier choice.
XC2S200-6FGG1100C Applications
The combination of 200K system gates, 284 I/Os, and the -6 speed grade makes this FPGA suitable for a wide range of real-world applications:
#### Communications and Networking
- Protocol bridging (UART, SPI, I2C, Ethernet MAC)
- Data framing and error correction
- Line-rate packet processing in embedded systems
#### Industrial Automation and Control
- Motor control with PWM generation
- Real-time sensor data acquisition and processing
- Machine vision pre-processing pipelines
#### Consumer Electronics
- Video signal processing and format conversion
- Audio DSP and filtering
- Display controller interfaces
#### Embedded Computing
- Custom CPU/co-processor implementation
- Memory controllers for SRAM, SDRAM, Flash
- Glue logic replacement for multi-chip designs
#### Test and Measurement
- High-speed data capture and buffering
- Pattern generation for device testing
- Boundary-scan-based board diagnostics
Why Choose the -6 Speed Grade?
The -6 speed grade is the fastest available in the Spartan-II family. It offers shorter propagation delays through the interconnect and logic elements compared to the -5 grade. Key advantages include:
- Higher maximum clock frequencies for time-critical designs
- Shorter I/O setup and hold times, enabling faster interfaces
- Better timing margins when interfacing with high-speed external components
Note: The -6 speed grade is exclusively offered in the Commercial temperature range (0°C to +85°C). For industrial temperature requirements, the -5 speed grade in the industrial range (-40°C to +100°C) should be considered instead.
Pb-Free (FGG) Package: Environmental Compliance
The “G” suffix in FGG denotes that this is a Pb-free (lead-free) package, compliant with RoHS (Restriction of Hazardous Substances) directives. This is increasingly important for:
- EU and global market compliance
- End-of-life recycling regulations
- Green electronics certification requirements
The Pb-free BGA package retains the same electrical performance and footprint as the standard variant, ensuring a seamless drop-in upgrade for compliant designs.
Ordering Information and Related Part Numbers
| Part Number |
Package |
Speed Grade |
Temperature |
Pb-Free |
| XC2S200-6FGG1100C |
1100-ball FGG |
-6 |
Commercial |
Yes |
| XC2S200-6FGG456C |
456-ball FGG |
-6 |
Commercial |
Yes |
| XC2S200-6FGG256C |
256-ball FGG |
-6 |
Commercial |
Yes |
| XC2S200-5FGG456C |
456-ball FGG |
-5 |
Commercial |
Yes |
| XC2S200-5FGG456I |
456-ball FGG |
-5 |
Industrial |
Yes |
| XC2S200-6PQG208C |
208-pin PQFP |
-6 |
Commercial |
Yes |
Design Tools and Support
The XC2S200-6FGG1100C is fully supported by Xilinx ISE Design Suite (now archived but fully functional for Spartan-II targets). Key tool support includes:
- ISE Project Navigator — RTL synthesis and place-and-route
- ModelSim / ISim — Functional and timing simulation
- IMPACT / iMPACT — Device configuration and programming
- ChipScope Pro — In-system logic analysis via JTAG
- Synplify / XST — Synthesis optimization for area and timing
VHDL and Verilog design flows are both fully supported, with comprehensive constraint-based timing closure available through the UCF (User Constraints File) flow.
Frequently Asked Questions (FAQ)
Q: What is the XC2S200-6FGG1100C used for?
A: It is used in communications, industrial control, embedded systems, consumer electronics, and test equipment requiring up to 200,000 programmable logic gates in a high-pin-count BGA package.
Q: What does the -6 speed grade mean?
A: The -6 speed grade indicates the fastest performance tier in the Spartan-II family, with the shortest propagation delays and highest achievable clock frequencies.
Q: Is the XC2S200-6FGG1100C RoHS compliant?
A: Yes. The “G” in the FGG package code confirms this is a Pb-free, RoHS-compliant package.
Q: What is the core operating voltage?
A: The core voltage (VCCINT) is 2.5V, while I/O voltage (VCCO) is flexible from 1.5V to 3.3V depending on the I/O standard used.
Q: Can this FPGA be configured via JTAG?
A: Yes. Boundary-Scan (JTAG) configuration mode is fully supported.
Summary: XC2S200-6FGG1100C at a Glance
| Feature |
Detail |
| Family |
Xilinx Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| I/O Pins (Max) |
284 User I/O |
| Block RAM |
56K bits |
| Distributed RAM |
75,264 bits |
| DLLs |
4 |
| Speed Grade |
-6 (Fastest) |
| Package |
1100-ball FGG (Pb-Free BGA) |
| Core Voltage |
2.5V |
| Temperature Range |
0°C to +85°C (Commercial) |
| Configuration Modes |
Master Serial, Slave Serial, Slave Parallel, JTAG |
| RoHS Compliant |
Yes |
The XC2S200-6FGG1100C remains a reliable and capable programmable logic solution for engineers who need proven Spartan-II architecture in the largest gate-count configuration available. Its combination of dense logic resources, flexible I/O, integrated clock management, and RoHS-compliant packaging makes it a dependable choice across a broad spectrum of commercial applications.