Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1100C: Complete Guide to Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1100C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, cost-sensitive applications, this device delivers up to 200,000 system gates in a fine-pitch BGA package — making it a go-to solution for engineers seeking programmable logic at scale. Whether you’re building embedded systems, consumer electronics, or industrial controllers, the XC2S200-6FGG1100C offers the versatility and performance your design demands.

For a broader look at available Xilinx programmable logic devices, explore the full lineup of Xilinx FPGA solutions.


What Is the XC2S200-6FGG1100C? Part Number Breakdown

Understanding the part number helps you quickly identify the exact variant you need:

Segment Value Meaning
XC XC Xilinx Commercial Product
2S 2S Spartan-II Family
200 200 200,000 System Gates
-6 -6 Speed Grade (Fastest in Spartan-II)
FGG FGG Fine-Pitch Ball Grid Array, Pb-Free Package
1100 1100 1,100-pin Package
C C Commercial Temperature Range (0°C to +85°C)

The -6 speed grade is the fastest available in the Spartan-II lineup and is exclusively offered in the Commercial temperature range, making this part ideal for demanding commercial and industrial product applications.


XC2S200-6FGG1100C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Delay-Locked Loops (DLLs) 4

Package & Electrical Characteristics

Parameter Value
Package Type Fine-Pitch BGA (FGG) — Pb-Free
Pin Count 1,100
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6 (Fastest)
Operating Temperature 0°C to +85°C (Commercial)
Configuration Bits 1,335,840

XC2S200-6FGG1100C Features and Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1100C is built around 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains look-up tables (LUTs), flip-flops, and fast carry logic — the building blocks for implementing any digital function. This dense architecture allows complex combinational and sequential logic to be synthesized efficiently within a single chip.

Block RAM and Distributed RAM

Memory flexibility is a standout feature of this device:

  • 75,264 bits of distributed RAM embedded within the CLB array for fast, single-cycle access to small data sets.
  • 56K bits of dedicated block RAM organized in two columns on opposite sides of the die, providing larger storage for FIFOs, buffers, and lookup tables.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops — one in each corner of the die — provide clock management capabilities including clock deskewing, frequency synthesis, and phase shifting. This eliminates the need for external clock conditioning components and simplifies board design.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG1100C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL. This flexibility allows the FPGA to interface directly with a wide range of external devices without level-shifting circuitry.


Configuration Modes

The XC2S200-6FGG1100C supports multiple configuration modes to fit various system architectures:

Configuration Mode M[2:0] CCLK Direction Data Width Serial DOUT
Master Serial 000 Output 1-bit Yes
Slave Serial 110 Input 1-bit Yes
Slave Parallel 010 Input 8-bit No
Boundary-Scan (JTAG) 101 N/A 1-bit No

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, ensuring safe board-level initialization.


Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the most resources for complex designs:

Device Logic Cells System Gates Total CLBs Max User I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

For designs that push the boundaries of the Spartan-II family in terms of logic density, I/O count, and memory, the XC2S200-6FGG1100C is the clear top-tier choice.


XC2S200-6FGG1100C Applications

The combination of 200K system gates, 284 I/Os, and the -6 speed grade makes this FPGA suitable for a wide range of real-world applications:

#### Communications and Networking

  • Protocol bridging (UART, SPI, I2C, Ethernet MAC)
  • Data framing and error correction
  • Line-rate packet processing in embedded systems

#### Industrial Automation and Control

  • Motor control with PWM generation
  • Real-time sensor data acquisition and processing
  • Machine vision pre-processing pipelines

#### Consumer Electronics

  • Video signal processing and format conversion
  • Audio DSP and filtering
  • Display controller interfaces

#### Embedded Computing

  • Custom CPU/co-processor implementation
  • Memory controllers for SRAM, SDRAM, Flash
  • Glue logic replacement for multi-chip designs

#### Test and Measurement

  • High-speed data capture and buffering
  • Pattern generation for device testing
  • Boundary-scan-based board diagnostics

Why Choose the -6 Speed Grade?

The -6 speed grade is the fastest available in the Spartan-II family. It offers shorter propagation delays through the interconnect and logic elements compared to the -5 grade. Key advantages include:

  • Higher maximum clock frequencies for time-critical designs
  • Shorter I/O setup and hold times, enabling faster interfaces
  • Better timing margins when interfacing with high-speed external components

Note: The -6 speed grade is exclusively offered in the Commercial temperature range (0°C to +85°C). For industrial temperature requirements, the -5 speed grade in the industrial range (-40°C to +100°C) should be considered instead.


Pb-Free (FGG) Package: Environmental Compliance

The “G” suffix in FGG denotes that this is a Pb-free (lead-free) package, compliant with RoHS (Restriction of Hazardous Substances) directives. This is increasingly important for:

  • EU and global market compliance
  • End-of-life recycling regulations
  • Green electronics certification requirements

The Pb-free BGA package retains the same electrical performance and footprint as the standard variant, ensuring a seamless drop-in upgrade for compliant designs.


Ordering Information and Related Part Numbers

Part Number Package Speed Grade Temperature Pb-Free
XC2S200-6FGG1100C 1100-ball FGG -6 Commercial Yes
XC2S200-6FGG456C 456-ball FGG -6 Commercial Yes
XC2S200-6FGG256C 256-ball FGG -6 Commercial Yes
XC2S200-5FGG456C 456-ball FGG -5 Commercial Yes
XC2S200-5FGG456I 456-ball FGG -5 Industrial Yes
XC2S200-6PQG208C 208-pin PQFP -6 Commercial Yes

Design Tools and Support

The XC2S200-6FGG1100C is fully supported by Xilinx ISE Design Suite (now archived but fully functional for Spartan-II targets). Key tool support includes:

  • ISE Project Navigator — RTL synthesis and place-and-route
  • ModelSim / ISim — Functional and timing simulation
  • IMPACT / iMPACT — Device configuration and programming
  • ChipScope Pro — In-system logic analysis via JTAG
  • Synplify / XST — Synthesis optimization for area and timing

VHDL and Verilog design flows are both fully supported, with comprehensive constraint-based timing closure available through the UCF (User Constraints File) flow.


Frequently Asked Questions (FAQ)

Q: What is the XC2S200-6FGG1100C used for?
A: It is used in communications, industrial control, embedded systems, consumer electronics, and test equipment requiring up to 200,000 programmable logic gates in a high-pin-count BGA package.

Q: What does the -6 speed grade mean?
A: The -6 speed grade indicates the fastest performance tier in the Spartan-II family, with the shortest propagation delays and highest achievable clock frequencies.

Q: Is the XC2S200-6FGG1100C RoHS compliant?
A: Yes. The “G” in the FGG package code confirms this is a Pb-free, RoHS-compliant package.

Q: What is the core operating voltage?
A: The core voltage (VCCINT) is 2.5V, while I/O voltage (VCCO) is flexible from 1.5V to 3.3V depending on the I/O standard used.

Q: Can this FPGA be configured via JTAG?
A: Yes. Boundary-Scan (JTAG) configuration mode is fully supported.


Summary: XC2S200-6FGG1100C at a Glance

Feature Detail
Family Xilinx Spartan-II
System Gates 200,000
Logic Cells 5,292
I/O Pins (Max) 284 User I/O
Block RAM 56K bits
Distributed RAM 75,264 bits
DLLs 4
Speed Grade -6 (Fastest)
Package 1100-ball FGG (Pb-Free BGA)
Core Voltage 2.5V
Temperature Range 0°C to +85°C (Commercial)
Configuration Modes Master Serial, Slave Serial, Slave Parallel, JTAG
RoHS Compliant Yes

The XC2S200-6FGG1100C remains a reliable and capable programmable logic solution for engineers who need proven Spartan-II architecture in the largest gate-count configuration available. Its combination of dense logic resources, flexible I/O, integrated clock management, and RoHS-compliant packaging makes it a dependable choice across a broad spectrum of commercial applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.