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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1097C: Xilinx Spartan-II FPGA – Complete Product Guide & Specifications

Product Details

The XC2S200-6FGG1097C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and a robust 1,097-pin Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable members of the Spartan-II lineup. Whether you are developing telecommunications equipment, industrial control systems, or digital signal processing circuits, the XC2S200-6FGG1097C offers a programmable, scalable, and cost-efficient alternative to mask-programmed ASICs.


What Is the XC2S200-6FGG1097C?

The XC2S200-6FGG1097C is manufactured by Xilinx (now AMD) and belongs to the Spartan-II FPGA family, which operates at a core voltage of 2.5V. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade -6 (fastest available in commercial range)
FGG Fine-Pitch Ball Grid Array (FBGA), Pb-free package
1097 1,097 pins
C Commercial temperature range (0°C to +85°C)

This device is ideal for engineers and procurement teams looking for a programmable logic solution with a large I/O count, generous on-chip memory, and flexible configuration options.

For a broader selection of similar devices, visit our Xilinx FPGA product catalog.


XC2S200-6FGG1097C Key Specifications

Core Logic & Memory

Parameter XC2S200 Value
System Gates (Logic + RAM) 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K
Delay-Locked Loops (DLLs) 4

Package & Electrical Characteristics

Parameter Value
Package Type FBGA (Fine-Pitch Ball Grid Array)
Package Code FGG
Pin Count 1,097
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V
Speed Grade -6
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18µm CMOS
RoHS Compliance Yes (Pb-free “G” designation)

XC2S200-6FGG1097C Feature Highlights

Advanced Configurable Logic Blocks (CLBs)

The Spartan-II architecture uses a 28×42 array of CLBs, each containing four 4-input look-up tables (LUTs) and flip-flops. This structure allows designers to implement complex combinatorial and sequential logic efficiently. The XC2S200 provides 1,176 CLBs in total, giving designers ample room for sophisticated digital designs without the cost overhead of larger device families.

On-Chip Memory Resources

One of the standout features of the XC2S200-6FGG1097C is its dual-purpose memory architecture:

  • Distributed RAM — 75,264 bits of flexible, LUT-based RAM distributed throughout the CLB fabric, suitable for small, fast data buffers and shift registers.
  • Block RAM — 56K bits of dedicated synchronous dual-port block RAM arranged in two columns on opposite sides of the die, ideal for FIFOs, lookup tables, and data buffering.

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG1097C includes four on-chip DLLs, one positioned at each corner of the die. These DLLs enable precise clock management, including clock deskewing, frequency synthesis, and phase shifting — critical for high-speed synchronous designs.

Flexible I/O Standards Support

The XC2S200-6FGG1097C supports a wide range of programmable I/O standards through its Input/Output Blocks (IOBs), including:

I/O Standard Description
LVTTL Low-Voltage TTL
LVCMOS 3.3V / 2.5V / 1.8V Low-Voltage CMOS variants
PCI 3.3V and 5V tolerant
GTL / GTL+ Gunning Transceiver Logic
HSTL Class I/II High-Speed Transceiver Logic
SSTL 3 / SSTL 2 Stub Series Terminated Logic

Configuration Modes

The XC2S200-6FGG1097C supports multiple configuration modes to suit diverse system architectures:

Configuration Mode Data Width CCLK Direction Serial DOUT
Master Serial 1 Output Yes
Slave Serial 1 Input Yes
Slave Parallel 8 Input No
Boundary-Scan (JTAG) 1 N/A No

XC2S200 vs. Other Spartan-II Family Members

To help engineers select the right device for their application, the table below compares the full Spartan-II family:

Device Logic Cells System Gates CLB Array Total CLBs Max User I/O Dist. RAM (bits) Block RAM (bits)
XC2S15 432 15,000 8×12 96 86 6,144 16K
XC2S30 972 30,000 12×18 216 92 13,824 24K
XC2S50 1,728 50,000 16×24 384 176 24,576 32K
XC2S100 2,700 100,000 20×30 600 176 38,400 40K
XC2S150 3,888 150,000 24×36 864 260 55,296 48K
XC2S200 5,292 200,000 28×42 1,176 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, delivering the maximum logic density, I/O count, and memory resources.


Typical Applications for XC2S200-6FGG1097C

The XC2S200-6FGG1097C is well-suited for a broad range of embedded and industrial applications where programmable logic, high I/O bandwidth, and low cost are important:

  • Telecommunications & Networking — line card controllers, protocol bridging, framing logic
  • Industrial Automation — motor control, programmable I/O interfaces, sensor fusion
  • Digital Signal Processing (DSP) — filtering, FFT acceleration, data conversion interfaces
  • Embedded Systems — soft processor implementations (MicroBlaze), peripheral controllers
  • Test & Measurement Equipment — signal capture, pattern generation, data logging
  • Consumer Electronics — display controllers, image processing pipelines
  • Prototyping & ASIC Emulation — pre-silicon hardware validation

Why Choose the XC2S200-6FGG1097C Over an ASIC?

The Xilinx Spartan-II family was specifically designed as a cost-effective alternative to mask-programmed ASICs. Here is why the XC2S200-6FGG1097C stands out:

Factor XC2S200-6FGG1097C (FPGA) Mask-Programmed ASIC
Upfront NRE Cost None Very High ($100K–$1M+)
Time-to-Market Days to weeks 6–18 months
Design Iteration In-field reprogrammable Requires new tape-out
Risk Low High
Volume Flexibility Any volume Economical only at high volume

Development Tools & Software Support

The XC2S200-6FGG1097C is supported by Xilinx’s legacy ISE Design Suite, which provides:

  • Project Navigator — integrated design environment
  • XST (Xilinx Synthesis Technology) — HDL synthesis engine
  • ISim — functional and timing simulation
  • iMPACT — device programming and configuration

Designers working with VHDL or Verilog can target the XC2S200-6FGG1097C directly using ISE, with full support for constraint-based timing closure and place-and-route optimization.


Ordering Information & Part Number Decoder

Xilinx uses a structured naming convention for Spartan-II devices. Here is how to read the XC2S200-6FGG1097C part number:

Field Code Description
Family XC2S Spartan-II FPGA
Gate Count 200 200,000 system gates
Speed Grade -6 Fastest commercial speed grade
Package Type FGG Fine-Pitch BGA, Pb-free
Pin Count 1097 1,097 ball count
Temperature Range C Commercial (0°C to +85°C)

Note: The “G” in “FGG” indicates that this is a RoHS-compliant, Pb-free package variant, meeting EU and international environmental standards for lead-free manufacturing.


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1097C used for?

The XC2S200-6FGG1097C is used in applications requiring high I/O density, programmable logic, and on-chip memory — including telecom line cards, industrial controllers, DSP pipelines, and embedded systems prototyping.

What is the speed grade -6 in the XC2S200-6FGG1097C?

Speed grade -6 is the fastest speed grade available for commercial-range Spartan-II devices. It is exclusively available in the Commercial temperature range (0°C to +85°C) and provides the lowest propagation delays across the device.

Is the XC2S200-6FGG1097C RoHS compliant?

Yes. The “G” in the FGG package designation confirms this is a Pb-free, RoHS-compliant part suitable for environmentally conscious manufacturing.

What is the core voltage of the XC2S200-6FGG1097C?

The device operates with a 2.5V core supply voltage (VCCINT) and supports I/O voltages ranging from 1.5V to 3.3V depending on the I/O standard selected.

Can the XC2S200-6FGG1097C be reprogrammed in the field?

Yes. As an FPGA, the XC2S200-6FGG1097C supports in-system reconfiguration without hardware replacement — a key advantage over ASICs. New configuration bitstreams can be loaded at any time via JTAG or one of the supported serial/parallel configuration modes.


Summary

The XC2S200-6FGG1097C is the flagship device of the Xilinx Spartan-II FPGA family, combining 200K system gates, 5,292 logic cells, 75,264 bits of distributed RAM, 56K bits of block RAM, and a 284-pin user I/O count in a 1,097-pin Pb-free FBGA package. With its -6 speed grade, four on-chip DLLs, multi-standard I/O support, and flexible configuration options, it remains a reliable and proven programmable logic device for commercial-grade applications.

Its ability to replace mask-programmed ASICs at a fraction of the cost and development time, combined with full reprogrammability, makes the XC2S200-6FGG1097C an outstanding choice for engineers working across telecommunications, industrial automation, embedded systems, and digital signal processing.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.