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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG1095C: Complete Guide to the Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1095C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this 2.5V FPGA delivers 200,000 system gates, 284 user I/O pins, and a 1,095-ball Fine-Pitch BGA package — making it one of the most capable devices in the Spartan-II lineup. Whether you are designing embedded systems, communications hardware, or industrial controllers, the XC2S200-6FGG1095C offers a powerful and programmable alternative to mask-programmed ASICs.


What Is the XC2S200-6FGG1095C?

The XC2S200-6FGG1095C is part of the Xilinx Spartan-II FPGA family. Breaking down the part number:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200,000 system gates
-6 Speed grade -6 (fastest, Commercial range only)
FGG Fine-Pitch Ball Grid Array, Pb-Free packaging
1095 1,095-ball package
C Commercial temperature range (0°C to +85°C)

This device is a Pb-free (RoHS-compliant) variant, indicated by the double “G” in “FGG.” It targets commercial-grade environments and benefits from the fastest available speed grade in the Spartan-II family.


XC2S200-6FGG1095C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Package & Electrical Specifications

Parameter Specification
Package Type Fine-Pitch BGA (FGG) — Pb-Free
Pin Count 1,095 balls
Supply Voltage (VCC) 2.5V core
I/O Voltage Support 3.3V, 2.5V, 1.8V, 1.5V
Speed Grade -6 (fastest)
Temperature Range 0°C to +85°C (Commercial)
Configuration Interface Master/Slave Serial, SelectMAP, JTAG

Clock Management

Feature Details
Delay-Locked Loops (DLLs) 4 (one at each corner of die)
Global Clock Inputs 4 dedicated pins
DLL Functions Clock deskew, frequency synthesis, phase shifting

XC2S200-6FGG1095C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features 1,176 CLBs arranged in a 28×42 array. Each CLB contains:

  • Two slices, each with two 4-input Look-Up Tables (LUTs)
  • Dedicated fast carry logic for arithmetic operations
  • Wide function multiplexers
  • Storage elements (flip-flops or latches)

The CLB architecture enables efficient implementation of complex combinational and sequential logic, DSP functions, and state machines.

Input/Output Blocks (IOBs)

The 284 programmable IOBs support a wide range of single-ended and differential I/O standards:

I/O Standard Support
LVCMOS 3.3V / 2.5V / 1.8V / 1.5V
LVTTL
PCI (33 MHz, 3.3V)
GTL / GTL+
HSTL (Class I, III, IV)
SSTL2 / SSTL3
AGP

Block RAM

The XC2S200 includes 56K bits of dedicated Block RAM, organized in two columns on opposite sides of the die. Block RAM supports:

  • Synchronous read and write operations
  • Dual-port access
  • Configurable as 16K×1, 8K×2, 4K×4, 2K×9, 1K×18
  • Cascadable for larger memory structures

Delay-Locked Loops (DLLs)

Four on-chip DLLs provide advanced clock management with zero skew distribution, frequency synthesis (multiply and divide), and fine-grained phase shifting — essential for high-speed synchronous designs.


XC2S200 Spartan-II Family Comparison

Device Logic Cells System Gates Total CLBs Max User I/O Dist. RAM (bits) Block RAM
XC2S15 432 15,000 96 86 6,144 16K
XC2S30 972 30,000 216 92 13,824 24K
XC2S50 1,728 50,000 384 176 24,576 32K
XC2S100 2,700 100,000 600 176 38,400 40K
XC2S150 3,888 150,000 864 260 55,296 48K
XC2S200 5,292 200,000 1,176 284 75,264 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the most logic resources, the highest I/O count, and the largest memory capacity.


Why Choose the XC2S200-6FGG1095C?

✅ Fastest Speed Grade Available

The -6 speed grade is the fastest offered in the Spartan-II family and is exclusively available in the commercial temperature range. This makes the XC2S200-6FGG1095C ideal for timing-critical designs requiring maximum performance.

✅ Pb-Free (RoHS-Compliant) Packaging

The “FGG” suffix confirms this is a lead-free package, suitable for designs that must comply with RoHS directives and modern environmental regulations.

✅ Large I/O Count for Interface-Heavy Designs

With 284 user I/Os, the XC2S200-6FGG1095C supports complex multi-bus architectures, high pin-count memory interfaces, and parallel communication protocols.

✅ Cost-Effective ASIC Replacement

The Spartan-II family was designed as a superior alternative to mask-programmed ASICs — eliminating NRE costs, shortening development cycles, and enabling field updates.

✅ Rich Clock Management

Four on-chip DLLs eliminate clock skew and enable advanced clocking strategies without external components.


Typical Applications of the XC2S200-6FGG1095C

The XC2S200-6FGG1095C FPGA is commonly used in the following application areas:

Application Domain Use Cases
Communications Packet processing, protocol bridging, line cards
Industrial Automation Motor control, PLCs, sensor interfaces
Consumer Electronics Video processing, display control
Embedded Systems Soft-core processors, custom peripherals
Test & Measurement Data acquisition, signal analysis
Networking Switching fabrics, traffic management
Automotive Infotainment, ADAS prototyping

XC2S200-6FGG1095C Ordering and Availability

When sourcing the XC2S200-6FGG1095C, it is important to verify authenticity and buy from trusted distributors. For a broad selection of Spartan-II and other programmable logic devices, visit Xilinx FPGA for sourcing options and technical support.

Part Number Decode Summary

Field Value Description
Family XC2S Spartan-II
Gate Count 200 200,000 system gates
Speed Grade -6 Fastest / Commercial only
Package FGG Fine-Pitch BGA, Pb-Free
Pin Count 1095 1,095 solder balls
Temp Range C Commercial (0°C to +85°C)

Configuration Modes

The XC2S200-6FGG1095C supports multiple configuration options for flexible system integration:

Configuration Mode Description
Master Serial Xilinx PROM drives configuration serially
Slave Serial External controller provides bitstream
Master Parallel (SelectMAP) High-speed parallel configuration
Slave Parallel (SelectMAP) Parallel mode driven by host processor
JTAG (IEEE 1149.1) Boundary scan and in-system programming

JTAG support enables in-circuit testing and full boundary-scan compliance, simplifying board-level debug and manufacturing test.


XC2S200-6FGG1095C vs. Modern FPGAs

Feature XC2S200-6FGG1095C Spartan-6 (XC6SLX9) Artix-7 (XC7A35T)
Process Node 0.15µm 45nm 28nm
Core Voltage 2.5V 1.2V 1.0V
Logic Cells 5,292 9,112 33,280
Block RAM 56Kb 576Kb 1,800Kb
Max User I/O 284 102 250
Speed Grade -6 -3 -3
DSP Slices None 16 90

While newer families offer higher density and lower power, the XC2S200-6FGG1095C remains relevant for legacy system maintenance, high-I/O applications, and cost-sensitive 2.5V designs.


Frequently Asked Questions (FAQ)

What does the “-6” in XC2S200-6FGG1095C mean?

The -6 speed grade indicates the fastest timing performance available in the Spartan-II family. It is exclusively offered in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1095C RoHS compliant?

Yes. The “FGG” double-G suffix in the part number confirms that this device uses Pb-free (lead-free) packaging, making it RoHS compliant.

What software is used to program the XC2S200-6FGG1095C?

The XC2S200-6FGG1095C is supported by Xilinx ISE Design Suite (the appropriate legacy toolchain for Spartan-II devices). Hardware description languages such as VHDL and Verilog are used for design entry.

What is the maximum operating frequency of the XC2S200-6FGG1095C?

With the -6 speed grade, the device achieves internal clock frequencies typically exceeding 200 MHz depending on the logic configuration and routing complexity.

Can the XC2S200-6FGG1095C replace an ASIC?

Yes. The Spartan-II family was specifically designed as a programmable, cost-effective alternative to mask-programmed ASICs, offering re-programmability and faster time-to-market.


Summary

The XC2S200-6FGG1095C is the top-of-the-line device in the Xilinx Spartan-II FPGA family, combining 200,000 system gates, 284 user I/Os, 56K bits of block RAM, four on-chip DLLs, and the fastest -6 speed grade in a Pb-free 1,095-ball FGG package. It is ideal for communications, industrial, embedded, and consumer applications requiring a high-I/O, cost-effective, and reprogrammable logic solution.

For procurement, technical datasheets, and compatible accessories, consult a trusted distributor with experience in Xilinx programmable logic devices.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.