The XC2S200-6FGG1094C is a high-performance, cost-efficient Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at up to 263 MHz — all housed in a 1094-pin Fine-Pitch Ball Grid Array (FBGA) package. Whether you are designing embedded systems, DSP pipelines, or communications hardware, the XC2S200-6FGG1094C provides the flexibility and performance required to get the job done efficiently.

This guide covers everything engineers and procurement professionals need to know: full specifications, pin configuration, ordering information, key features, and common applications.

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What Is the XC2S200-6FGG1094C? – Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1094C belongs to the Xilinx Spartan-II FPGA family, a series of 2.5V programmable logic devices built on 0.18µm process technology. The Spartan-II series was introduced as a superior, low-cost alternative to mask-programmed ASICs, offering the key advantage of field reprogrammability — meaning designs can be updated without hardware replacement.

The part number breaks down as follows:

Note: The “G” in “FGG” designates a Pb-free (lead-free) package, making this part compliant with RoHS environmental directives where applicable.

For a broader look at the full Xilinx programmable logic portfolio, visit Xilinx FPGA.

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XC2S200-6FGG1094C Key Specifications

Core Logic Specifications

Electrical & Physical Specifications

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XC2S200-6FGG1094C Architecture and Internal Features

Configurable Logic Blocks (CLBs)

The XC2S200 organizes its logic fabric into a 28 x 42 array of Configurable Logic Blocks (CLBs). Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs), flip-flops, carry logic, and arithmetic support. This architecture allows the device to efficiently implement combinational logic, sequential circuits, and arithmetic operations simultaneously.

Block RAM and Distributed RAM

The device provides 56K bits of block RAM across 14 dedicated Block RAM modules. Each block RAM can be configured as synchronous single-port or dual-port memory, making it ideal for FIFOs, buffers, and lookup tables in data-intensive designs. Additionally, 75,264 bits of distributed RAM are available within the CLB fabric, usable as small, fast memory elements embedded directly in logic.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops are placed at the four corners of the die. These DLLs provide clock skew elimination, frequency synthesis, and clock phase shifting — critical for meeting strict timing requirements in synchronous digital designs.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200 supports a wide range of I/O standards, including LVTTL, LVCMOS2, PCI, GTL, HSTL, SSTL2, and SSTL3. Each IOB includes programmable slew rate control, optional pull-up/pull-down resistors, and input delay elements to simplify signal integrity management.

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Spartan-II Family Comparison – Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II family, offering the maximum system gates and logic resources available within this product line.

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XC2S200-6FGG1094C Ordering and Package Information

Understanding the Part Number

Xilinx uses a structured part number system for the Spartan-II family. Here is a complete breakdown for the XC2S200-6FGG1094C:

Available Packages for XC2S200

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Key Features and Benefits of the XC2S200-6FGG1094C

Feature Highlights

• 200,000 System Gates — Sufficient logic capacity for complex, production-grade digital designs
• 5,292 Logic Cells — Fine-grained logic fabric with efficient CLB structure
• -6 Speed Grade — The fastest commercially available speed grade in the Spartan-II family
• Four DLLs — Advanced clock management with zero-skew distribution
• 56K Bits of Block RAM — Dedicated synchronous memory for data buffering
• 284 Flexible I/O Pins — Multi-standard I/O with LVTTL, PCI, HSTL, SSTL support
• Pb-Free (FGG) Package — Environmentally compliant, RoHS-ready packaging
• Field Reprogrammability — Eliminates the need for hardware replacement during design updates
• 0.18µm Process Technology — Low power consumption relative to performance
• 2.5V Core Voltage — Optimized for modern low-voltage logic systems

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XC2S200-6FGG1094C Applications

The XC2S200-6FGG1094C is well-suited for a wide range of commercial and industrial applications:

Embedded Systems and SoC Prototyping

The device’s large logic capacity and flexible I/O make it an excellent choice for embedded processor implementations, including soft-core processors such as Xilinx’s PicoBlaze. Engineers use it to prototype full system-on-chip designs before committing to ASIC fabrication.

Digital Signal Processing (DSP)

With its fast CLBs, distributed RAM, and high operating frequency, the XC2S200 excels at real-time DSP applications such as FIR/IIR filters, FFT engines, digital modulators, and audio/video processing pipelines.

Communications and Networking Hardware

The device’s support for high-speed I/O standards including HSTL and SSTL makes it ideal for networking interfaces, serializer/deserializer (SERDES) wrappers, and protocol bridges in telecom and datacom equipment.

Industrial Control and Automation

The field-programmable nature of the XC2S200-6FGG1094C enables rapid design iteration in industrial control systems, motor control applications, and programmable logic controllers (PLCs) where design flexibility is critical.

Test and Measurement Equipment

Engineers deploying high-speed data acquisition systems and logic analyzers benefit from the device’s ample I/O count, fast clock speeds, and deep memory resources.

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Configuration and Programming

Configuration Modes

The XC2S200-6FGG1094C supports multiple configuration modes to suit different system architectures:

Supported Configuration PROMs

The device is compatible with Xilinx XCF-series Platform Flash PROMs and standard 3.3V serial EEPROMs for non-volatile configuration storage.

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XC2S200-6FGG1094C vs. Common Alternatives

Key Insight: The FGG1094 package variant provides the highest pin density and is typically selected when maximum board-level I/O connectivity is required, such as in memory interface designs or high-channel-count data buses.

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Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean for XC2S200?

The -6 speed grade is the fastest available speed grade in the Spartan-II commercial range, supporting clock frequencies up to 263 MHz. It is exclusively available in the commercial temperature range (0°C to +85°C) and is not offered in the industrial temperature range.

Is the XC2S200-6FGG1094C RoHS compliant?

Yes. The “G” in the FGG package designation indicates a Pb-free (lead-free) package, making the XC2S200-6FGG1094C compliant with RoHS environmental directives for restriction of hazardous substances.

What software tools support the XC2S200-6FGG1094C?

This device is supported by Xilinx ISE Design Suite (the legacy design environment for Spartan-II). It supports VHDL, Verilog, and schematic-based design entry, along with simulation, synthesis, and bitstream generation tools.

Is the XC2S200 still recommended for new designs?

The Spartan-II family has been classified as Not Recommended for New Designs (NRND) by AMD/Xilinx. For new projects, Xilinx recommends migrating to the Spartan-6, Artix-7, or newer families. However, the XC2S200-6FGG1094C remains widely available for maintenance, repair, and legacy production applications.

What is the difference between FGG1094 and FG456 packages?

The primary difference is pin count and board footprint. The FGG1094 has 1,094 BGA balls compared to 456 for the FG456 package. The higher pin count provides more I/O connectivity and power/ground distribution but requires more complex PCB routing. Both packages expose the same 284 maximum user I/Os.

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Summary

The XC2S200-6FGG1094C is the flagship device of Xilinx’s Spartan-II FPGA family — combining 200,000 system gates, 5,292 logic cells, 263 MHz operation, and a Pb-free 1094-pin BGA package. It remains a trusted solution for legacy system support, high-volume production, and applications where its proven architecture delivers reliable results. With robust I/O flexibility, dedicated block RAM, and four clock management DLLs, the XC2S200-6FGG1094C continues to serve as a capable FPGA platform for engineers worldwide.

For procurement needs or to explore the full range of Xilinx programmable devices, visit Xilinx FPGA.