The XC2S200-6FGG1093C is a high-density, 2.5V Field-Programmable Gate Array from Xilinx’s legendary Spartan-II family. Designed for cost-sensitive, high-volume applications, this FPGA delivers 200,000 system gates, 5,292 logic cells, and a 1,093-ball Fine-Pitch Ball Grid Array (FBGA) package — making it one of the most capable parts in the Spartan-II lineup. Whether you are designing communication systems, embedded control boards, or digital signal processing pipelines, the XC2S200-6FGG1093C offers the performance and flexibility needed to bring complex designs to life.
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What Is the XC2S200-6FGG1093C?
The XC2S200-6FGG1093C is part of Xilinx’s Spartan-II FPGA family, a product line built on a 0.18 µm process technology using a six-layer metal stack. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200K system gates |
| -6 |
Speed grade 6 (fastest, commercial range only) |
| FGG |
Fine-Pitch Ball Grid Array (Pb-free package) |
| 1093 |
1,093 total ball count |
| C |
Commercial temperature range (0°C to +85°C) |
This device is ideal for engineers who need a large I/O count in a compact BGA footprint with the highest available speed grade in the Spartan-II family.
XC2S200-6FGG1093C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K (56,000) |
Electrical & Timing Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
2.5V (adjustable per bank) |
| Speed Grade |
-6 (fastest in Spartan-II family) |
| Max Toggle Frequency |
Up to 263 MHz |
| Process Technology |
0.18 µm, 6-layer metal |
| Temperature Range |
Commercial: 0°C to +85°C |
Package Information
| Parameter |
Value |
| Package Type |
FGG (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
1,093 balls |
| RoHS Compliant |
Yes (Pb-Free “G” suffix) |
| Package Style |
Fine-Pitch Ball Grid Array (FBGA) |
XC2S200-6FGG1093C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG1093C features a 28 × 42 array of CLBs, each containing four logic cells. Each logic cell includes a 4-input Look-Up Table (LUT), carry logic, and a flip-flop. This architecture enables efficient implementation of arithmetic functions, state machines, and complex combinational logic.
Block RAM
The device integrates 56Kbits of dedicated block RAM, organized in dual-port blocks. This on-chip memory supports true dual-port access with independent read/write widths, making it ideal for FIFOs, data buffers, and embedded lookup tables.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) are placed at each corner of the die. These DLLs enable precise clock edge alignment, frequency synthesis, and phase shifting — critical for synchronous system designs operating at high frequencies.
Input/Output Blocks (IOBs)
With up to 284 user I/O pins, the XC2S200-6FGG1093C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL. Each IOB includes programmable slew rate control, pull-up/pull-down resistors, and optional output inversion.
Spartan-II Family Comparison Table
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, offering the maximum available logic, I/O, and memory resources.
XC2S200-6FGG1093C Applications
The XC2S200-6FGG1093C is well-suited for a wide range of industries and use cases:
#### Communications & Networking
High I/O count and DLL-enabled clocking make this device ideal for line cards, protocol bridging, and packet-processing engines in telecommunications equipment.
#### Industrial Control & Automation
Its robust CLB architecture supports state-machine-intensive designs used in motor controllers, PLCs, and real-time sensor interfaces.
#### Digital Signal Processing (DSP)
Distributed RAM and Block RAM resources make the XC2S200-6FGG1093C an effective platform for FIR/IIR filters, FFT engines, and audio/video processing pipelines.
#### Embedded Systems & Prototyping
As an alternative to mask-programmed ASICs, this FPGA shortens development cycles and allows in-field design updates without hardware replacement.
#### Test & Measurement Equipment
The speed-6 grade ensures timing margins for high-frequency test logic, pattern generation, and data capture applications.
XC2S200-6FGG1093C vs. Similar Devices
| Feature |
XC2S200-6FGG1093C |
XC2S150-6FGG456C |
XC2S200-5FGG456C |
| System Gates |
200,000 |
150,000 |
200,000 |
| Logic Cells |
5,292 |
3,888 |
5,292 |
| Speed Grade |
-6 (fastest) |
-6 |
-5 |
| Package Balls |
1,093 |
456 |
456 |
| Max User I/O |
284 |
260 |
284 |
| Pb-Free |
Yes |
Yes |
Yes |
The 1,093-ball FGG package offers significantly more routing flexibility and I/O access compared to smaller package variants, making it the preferred choice for dense PCB designs requiring maximum connectivity.
Configuration & Programming
The XC2S200-6FGG1093C supports several configuration modes:
| Configuration Mode |
Description |
| Master Serial |
FPGA loads bitstream from external serial PROM |
| Slave Serial |
Bitstream provided by an external controller |
| Master Parallel (SelectMAP) |
High-speed byte-wide configuration interface |
| Boundary Scan (JTAG) |
IEEE 1149.1-compliant in-circuit testing |
Bitstream generation is supported through Xilinx ISE Design Suite, which provides synthesis, implementation, and device programming tools compatible with the Spartan-II architecture.
Ordering Information
| Field |
Detail |
| Manufacturer |
Xilinx (now AMD) |
| Part Number |
XC2S200-6FGG1093C |
| Series |
Spartan-II |
| Package |
1093-Ball FBGA (Pb-Free) |
| Speed Grade |
-6 |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Status |
Compliant |
Note: The -6 speed grade is exclusively available in the Commercial temperature range. Industrial temperature variants of the XC2S200 use the -5 or -4 speed grades.
Frequently Asked Questions (FAQ)
Q: Is the XC2S200-6FGG1093C still in production? The Spartan-II family has been marked as not recommended for new designs (NRND). For legacy system support and replacement procurement, stock is still available through authorized distributors.
Q: What software do I use to program the XC2S200-6FGG1093C? This device is supported by the Xilinx ISE Design Suite. Note that the newer Vivado Design Suite does not support Spartan-II devices.
Q: Can the XC2S200-6FGG1093C be reconfigured in the field? Yes. Like all FPGAs, this device is fully reconfigurable. Design updates can be deployed without any hardware changes — a key advantage over fixed-function ASICs.
Q: What is the difference between FGG and FG package suffix? The FGG suffix indicates a Pb-free (lead-free) Ball Grid Array package. The standard FG suffix uses a conventional tin-lead solder ball finish. Both share the same pinout.
Conclusion
The XC2S200-6FGG1093C is a mature, proven FPGA solution offering the maximum logic density and I/O capacity in the Xilinx Spartan-II family. With 200,000 system gates, 284 user I/Os, 56K of block RAM, and the fastest -6 speed grade in a large 1,093-ball Pb-free BGA package, it remains a reliable choice for legacy system maintenance, industrial control, DSP, and communications applications. Its ASIC-alternative value proposition — combining low NRE cost, fast design cycles, and field reconfigurability — continues to make it relevant across many embedded design contexts.
To explore more programmable logic solutions from Xilinx, visit Xilinx FPGA for inventory, datasheets, and technical guidance.
