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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1092C: Xilinx Spartan-II FPGA – Full Specifications, Features & Datasheet Guide

Product Details

The XC2S200-6FGG1092C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 5,292 logic cells, and a compact 1092-ball Fine-Pitch BGA (FBGA) package — making it an ideal solution for engineers seeking a flexible, reprogrammable alternative to mask-programmed ASICs. Whether you are developing digital signal processing systems, communication hardware, or embedded control applications, the XC2S200-6FGG1092C offers the logic density, I/O flexibility, and speed performance your project demands.

For a broader overview of the Spartan-II product line and other Xilinx programmable logic devices, visit Xilinx FPGA.


What Is the XC2S200-6FGG1092C?

The XC2S200-6FGG1092C is part of Xilinx’s Spartan-II 2.5V FPGA family, a series engineered to combine the flexibility of programmable logic with the economics of high-volume production. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade 6 (fastest; Commercial range only)
FGG Fine-Pitch BGA package (Pb-free “G” variant)
1092 1092 total package pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1092C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Max User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.5V
I/O Supply Voltage (VCCO) 1.5V – 3.3V (multi-standard)
Speed Grade -6 (fastest available)
Maximum Frequency Up to 263 MHz
Technology Node 0.18 µm
Temperature Range Commercial: 0°C to +85°C

Package Information

Parameter Value
Package Type Fine-Pitch Ball Grid Array (FBGA)
Package Code FGG
Total Pins 1,092
Lead-Free (RoHS) Yes (“G” designation)
Mounting Surface Mount (SMT)

XC2S200-6FGG1092C Features & Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1092C features a 28×42 array of Configurable Logic Blocks, each containing four-input look-up tables (LUTs), flip-flops, and fast carry logic. This architecture enables efficient implementation of combinational and sequential digital circuits, arithmetic functions, and state machines.

Block RAM & Distributed RAM

The device includes 56K bits of dedicated block RAM organized in two columns on either side of the CLB array. In addition, 75,264 bits of distributed RAM can be inferred directly from LUT resources. Together, these memory resources support FIFOs, data buffers, coefficient tables, and look-up storage for DSP pipelines.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — allow the XC2S200-6FGG1092C to eliminate clock distribution skew, multiply or divide clock frequencies, and shift clock phase. This makes the device highly suitable for synchronous high-speed designs without the need for external clock conditioning circuitry.

Multi-Standard I/O Support

The Input/Output Blocks (IOBs) on the XC2S200-6FGG1092C support a wide range of I/O standards including:

I/O Standard Description
LVTTL Low-Voltage TTL (3.3V)
LVCMOS Low-Voltage CMOS (1.5V – 3.3V)
PCI 3.3V PCI bus compatible
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
SSTL Stub-Series Terminated Logic
AGP Accelerated Graphics Port

JTAG Boundary Scan

Full IEEE 1149.1 JTAG boundary scan support is integrated on-chip, allowing in-system device configuration, board-level functional testing, and configuration readback — simplifying debug and production test workflows.


Spartan-II Family Comparison: Where Does the XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and highest-density device in the Spartan-II family, making it the best choice when maximum gate count, I/O count, and memory depth are required within the Spartan-II generation.


Configuration Modes

The XC2S200-6FGG1092C supports multiple configuration methods to suit various system designs:

Configuration Mode Description
Master Serial FPGA drives configuration clock; loads bitstream from serial PROM
Slave Serial External source drives clock and data
Master Parallel (SelectMAP) High-speed 8-bit parallel mode for fast configuration
Slave Parallel (SelectMAP) Processor-controlled parallel configuration
JTAG (Boundary Scan) IEEE 1149.1 in-circuit configuration and debug

Typical Applications of the XC2S200-6FGG1092C

The XC2S200-6FGG1092C is well-suited for a broad range of industries and design challenges:

  • Digital Signal Processing (DSP): FIR/IIR filters, FFT engines, audio/video processing pipelines
  • Communications: Protocol bridging, line-rate logic for Ethernet, UART, SPI, I²C, and custom serial interfaces
  • Industrial Control: Motor control, PLC logic replacement, sensor interface aggregation
  • Medical Devices: Real-time data acquisition, waveform generation, patient monitoring signal processing
  • Consumer Electronics: Display controllers, set-top box logic, interface translation
  • Prototyping & ASIC Emulation: Pre-production hardware validation and rapid iteration before tape-out

XC2S200-6FGG1092C vs. Alternative Part Numbers

Engineers frequently encounter multiple orderable variants of the XC2S200. Here is a quick comparison of the most common alternatives:

Part Number Speed Grade Package Pins Temp Range Pb-Free
XC2S200-6FGG1092C -6 FBGA 1092 Commercial Yes
XC2S200-5FGG1092C -5 FBGA 1092 Commercial Yes
XC2S200-5FGG1092I -5 FBGA 1092 Industrial Yes
XC2S200-6FG456C -6 FBGA 456 Commercial No
XC2S200-6PQ208C -6 PQFP 208 Commercial No

The XC2S200-6FGG1092C is the premium configuration — combining the fastest (-6) speed grade, the highest pin-count package (1092 balls) for maximum I/O access, lead-free compliance, and the commercial temperature rating required for cost-sensitive commercial electronics.


Design Tool Support

The XC2S200-6FGG1092C is supported by Xilinx (AMD) design tools. Because the Spartan-II is a legacy family, the recommended tool is ISE Design Suite (Xilinx ISE 14.7), which provides:

  • HDL synthesis (VHDL / Verilog)
  • Place and route for Spartan-II devices
  • Timing analysis and static timing reports
  • iMPACT for JTAG-based programming and configuration

Note: The newer Vivado Design Suite does not support Spartan-II devices. Use ISE 14.7 for all XC2S200 development.


Ordering & Availability

When sourcing the XC2S200-6FGG1092C, buyers should verify:

  1. Authenticity – Source from authorized distributors or verified component brokers to avoid counterfeit parts.
  2. Date Code – Check that the date code aligns with your production requirements.
  3. RoHS Compliance – The “G” in FGG confirms this is the lead-free, RoHS-compliant package variant.
  4. Configuration – Confirm speed grade (-6), package (FGG1092), and temperature range (C = Commercial) match your BOM.

Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1092C used for?

The XC2S200-6FGG1092C is used in digital logic design applications including DSP, embedded processing, communications interfaces, and ASIC prototyping. It is a reprogrammable logic device that can be reconfigured to implement virtually any digital function.

What is the difference between XC2S200-6FGG1092C and XC2S200-5FGG1092C?

The only difference is the speed grade. The -6 device is the fastest available in the Spartan-II family and is rated for the Commercial temperature range only. The -5 device is slightly slower and is available in both Commercial and Industrial temperature ranges.

Is the XC2S200-6FGG1092C still in production?

The Spartan-II family has been discontinued by Xilinx (AMD). However, the XC2S200-6FGG1092C remains widely available through component distributors and specialty inventory brokers for legacy system maintenance and repair.

What programming software do I need for the XC2S200-6FGG1092C?

You need Xilinx ISE Design Suite 14.7 for synthesis, implementation, and bitstream generation. Use the iMPACT programmer within ISE to configure the device via JTAG.

What is the supply voltage for the XC2S200-6FGG1092C?

The core logic (VCCINT) operates at 2.5V. The I/O banks (VCCO) support voltages from 1.5V to 3.3V depending on the I/O standard selected.


Summary: Why Choose the XC2S200-6FGG1092C?

The XC2S200-6FGG1092C represents the pinnacle of the Spartan-II FPGA family — offering the maximum logic density (200K gates / 5,292 cells), the highest I/O count (up to 284 user I/Os), the fastest speed grade (-6), and a lead-free 1092-ball FBGA package designed for demanding PCB designs. For engineers maintaining legacy systems, developing cost-sensitive commercial products, or prototyping complex digital logic, this device delivers proven Xilinx performance and flexibility at scale.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.