The XC2S200-6FGG1091C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a rich set of programmable resources in a 1091-ball Pb-free Fine-Pitch Ball Grid Array (FGG) package. With a commercial temperature rating (-6C speed grade), the XC2S200-6FGG1091C strikes an outstanding balance between performance, flexibility, and value — making it a preferred choice for engineers designing telecommunications systems, industrial control equipment, consumer electronics, and embedded processing platforms.
What Is the XC2S200-6FGG1091C?
The XC2S200-6FGG1091C belongs to the Xilinx Spartan-II FPGA family, a 2.5V, 0.18-micron CMOS process device optimized as a cost-effective programmable logic solution. Unlike mask-programmed ASICs, the XC2S200-6FGG1091C allows engineers to reprogram the device in the field without any hardware replacement — dramatically shortening product development cycles and reducing time-to-market.
For a broader look at the full range of programmable logic devices, explore Xilinx FPGA options available today.
XC2S200-6FGG1091C Key Specifications at a Glance
Part Number Breakdown
Understanding the ordering code helps you select exactly the right variant for your design:
| Code Segment |
Meaning |
| XC2S200 |
Spartan-II device with 200,000 system gates |
| -6 |
Speed grade (fastest commercial grade; -6 exclusive to commercial range) |
| FGG |
Fine-Pitch Ball Grid Array, Pb-free (RoHS-compliant) package |
| 1091 |
1,091 total ball count |
| C |
Commercial temperature range (0°C to +85°C) |
Core Logic & Memory Specifications
| Parameter |
XC2S200-6FGG1091C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Max User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| Block RAM Columns |
2 |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Timing Characteristics
| Parameter |
Value |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.5V – 3.3V (multi-standard) |
| Speed Grade |
-6 (fastest available) |
| Max System Clock |
Up to 200 MHz |
| Process Technology |
0.18 µm CMOS |
| Temperature Range |
0°C to +85°C (Commercial) |
Package Information
| Parameter |
Value |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG (Pb-Free / RoHS Compliant) |
| Pin / Ball Count |
1,091 |
| Mounting Style |
Surface Mount (SMT) |
| RoHS Status |
Compliant (Pb-Free) |
XC2S200-6FGG1091C Architecture Overview
Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG1091C is its array of 1,176 Configurable Logic Blocks arranged in a 28×42 grid. Each CLB contains multiple Look-Up Tables (LUTs), flip-flops, and carry logic, enabling the implementation of complex combinatorial and sequential circuits. The CLB architecture supports a wide range of functions including arithmetic operations, counters, state machines, and custom logic.
Input/Output Blocks (IOBs)
The device offers up to 284 user I/O pins (excluding the four dedicated global clock inputs). Each IOB supports 16 selectable I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and more. This extensive multi-standard I/O capability ensures seamless interfacing with a wide variety of peripherals, memory devices, and communication buses.
Block RAM
Two columns of dedicated block RAM sit on opposite sides of the die, providing 56K bits of embedded memory. Block RAM operates independently of the logic fabric, delivering high-bandwidth data storage for FIFOs, buffers, look-up tables, and co-processor memory.
Distributed RAM
In addition to block RAM, the XC2S200-6FGG1091C provides 75,264 bits of distributed RAM implemented within the CLB fabric. Distributed RAM is ideal for small, fast storage elements close to the logic they serve.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide robust clock management. DLLs eliminate clock distribution skew, multiply or divide clock frequencies, and shift clock phases, enabling deterministic, high-speed synchronous designs.
Routing Architecture
A hierarchical, versatile routing matrix interconnects all functional blocks. The routing resources include local interconnects within CLBs, long lines that span the full device, and dedicated carry chains — all contributing to predictable timing closure and high performance.
XC2S200-6FGG1091C vs. Other Spartan-II Family Members
The Spartan-II family spans a range of gate densities. The table below contextualizes the XC2S200 within the full family:
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
The XC2S200 is the largest and most capable device in the Spartan-II family, making the XC2S200-6FGG1091C the go-to choice when maximum logic density and I/O count are required.
Speed Grade Comparison: -4, -5, and -6
Spartan-II devices are offered in multiple speed grades. The -6 speed grade is the fastest and is exclusively available in the commercial temperature range, making the XC2S200-6FGG1091C ideal for designs that demand maximum operating frequency.
| Speed Grade |
Performance |
Temperature Range |
| -4 |
Standard |
Commercial / Industrial |
| -5 |
Fast |
Commercial / Industrial |
| -6 |
Fastest |
Commercial only (0°C to +85°C) |
Supported I/O Standards
The XC2S200-6FGG1091C supports 16 selectable I/O voltage standards for maximum design flexibility:
| I/O Standard |
Description |
| LVTTL |
Low Voltage TTL |
| LVCMOS2 |
Low Voltage CMOS 2.5V |
| PCI |
Peripheral Component Interconnect |
| GTL / GTL+ |
Gunning Transceiver Logic |
| HSTL Class I / II / III / IV |
High Speed Transceiver Logic |
| SSTL2 Class I / II |
Stub Series Terminated Logic 2.5V |
| SSTL3 Class I / II |
Stub Series Terminated Logic 3.3V |
| CTT |
Center-Tap Terminated |
| AGP |
Accelerated Graphics Port |
Key Features and Benefits of the XC2S200-6FGG1091C
High Logic Density
With 200,000 system gates and 5,292 CLBs, the XC2S200-6FGG1091C accommodates complex digital subsystems — including multi-channel signal processing pipelines, custom CPU cores, communication protocol engines, and data path accelerators — all within a single chip.
Maximum I/O Flexibility
284 user-configurable I/O pins with support for 16 I/O standards give designers the freedom to interface with legacy and modern systems alike, supporting everything from 3.3V LVTTL peripherals to high-speed GTL+ buses.
Pb-Free (RoHS Compliant) Packaging
The “G” in FGG denotes Pb-free packaging, ensuring compliance with RoHS environmental regulations. This is essential for products sold in the European Union and other regions with lead-free mandates.
In-System Programmability
Like all Xilinx FPGAs, the XC2S200-6FGG1091C is fully reprogrammable. This enables firmware upgrades in the field, rapid prototyping iterations, and multi-function device configurations — advantages that no ASIC can match.
IEEE 1149.1 Boundary Scan (JTAG)
Full JTAG boundary scan support simplifies board-level testing, debugging, and in-system configuration without requiring physical access to individual pins.
ASIC Replacement Capability
The Spartan-II family was explicitly designed as a superior alternative to mask-programmed ASICs. The XC2S200-6FGG1091C eliminates ASIC NRE (Non-Recurring Engineering) costs, eliminates lengthy tape-out cycles, and removes the risk of silicon re-spins — offering faster time-to-market at substantially lower upfront investment.
Typical Applications of the XC2S200-6FGG1091C
The XC2S200-6FGG1091C is suited for a broad range of application domains:
| Industry |
Typical Use Cases |
| Telecommunications |
Protocol bridging, line-card logic, FEC engines |
| Industrial Automation |
Motor control, PLC replacement, sensor fusion |
| Consumer Electronics |
Display controllers, video processing, set-top boxes |
| Embedded Computing |
Soft-core processors (e.g., MicroBlaze), co-processing |
| Medical Devices |
Signal acquisition, patient monitoring logic |
| Automotive |
ADAS sensor interfaces, gateway modules |
| Test & Measurement |
Data capture, pattern generation, protocol analysis |
Development Tools for XC2S200-6FGG1091C
Because the XC2S200-6FGG1091C is a legacy Spartan-II device, it is supported by Xilinx ISE Design Suite (not Vivado, which targets newer architectures). ISE provides:
- HDL synthesis (VHDL / Verilog)
- Place-and-route (PAR) for Spartan-II
- Timing analysis and simulation
- JTAG-based configuration and debugging via iMPACT programmer
Designers can also use third-party synthesis tools such as Synopsys Synplify or Mentor Graphics Precision for more advanced optimization flows targeting ISE back-end tools.
Ordering and Availability
The XC2S200-6FGG1091C can be sourced from authorized distributors and on the secondary market. When purchasing, always verify:
- Exact part number: XC2S200-6FGG1091C (not FG or FGG variants with different pin counts)
- RoHS compliance: The “G” suffix confirms Pb-free packaging
- Speed grade: -6 is the fastest commercial grade; ensure it matches your timing budget
- Package condition: Request anti-static ESD-safe packaging and check moisture sensitivity level (MSL) compliance
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1091C?
The XC2S200-6FGG1091C is a Xilinx Spartan-II FPGA featuring 200,000 system gates, 5,292 logic cells, and a 1091-ball Pb-free BGA package with a commercial temperature rating and -6 (fastest) speed grade.
What is the difference between FGG and FG packages?
The FGG package designation indicates Pb-free (lead-free) construction, compliant with RoHS regulations. The standard FG package uses conventional tin-lead solder. Both share the same physical footprint and pinout for a given ball count.
Is the XC2S200-6FGG1091C still in production?
The Spartan-II family has reached end-of-life for new production, but the XC2S200-6FGG1091C remains widely available through authorized distributors and specialty electronics suppliers serving legacy and long-life product programs.
What design software supports the XC2S200-6FGG1091C?
Xilinx ISE Design Suite is the primary tool. Vivado does not support Spartan-II devices. ISE supports full HDL design entry, synthesis, implementation, and JTAG-based programming.
Can the XC2S200-6FGG1091C replace an ASIC?
Yes. The Spartan-II family was specifically architected to serve as a cost-effective, reprogrammable alternative to mask-programmed ASICs, eliminating NRE costs and enabling field updates.
Summary
The XC2S200-6FGG1091C delivers the highest logic density in the Spartan-II family — 200,000 system gates, 5,292 logic cells, 284 user I/Os, 56K bits of block RAM, and four DLLs — all in a large-format, RoHS-compliant 1091-ball FBGA package optimized for the commercial temperature range. Its -6 speed grade ensures maximum system performance up to 200 MHz, making it the definitive choice for demanding embedded, communications, and industrial applications requiring proven, field-reprogrammable programmable logic.
