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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1088C: Complete Product Guide to the Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1088C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device delivers 200,000 system gates, 284 user I/Os, and a -6 speed grade — all in a robust 1088-ball Fine Pitch BGA (FGG) package. Whether you’re building embedded systems, industrial controllers, or communication hardware, the XC2S200-6FGG1088C offers an ideal balance of logic density, I/O flexibility, and speed.


What Is the XC2S200-6FGG1088C?

The XC2S200-6FGG1088C is a member of the Xilinx Spartan-II 2.5V FPGA family — a product line engineered as a programmable alternative to mask-programmed ASICs. It eliminates the high NRE (non-recurring engineering) costs associated with ASICs while offering comparable performance and logic density for production-scale designs.

The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Speed grade (fastest available; commercial range only)
FGG Fine Pitch Ball Grid Array (Pb-free package)
1088 Number of package pins
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1088C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
System Gates (Logic + RAM) 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits

Device & Package Details

Parameter Value
Part Number XC2S200-6FGG1088C
Manufacturer Xilinx (AMD)
FPGA Family Spartan-II
Package Type FGG (Fine Pitch BGA, Pb-Free)
Pin Count 1088
Speed Grade -6 (fastest)
Supply Voltage (VCC) 2.5V
I/O Voltage 3.3V tolerant
Operating Temperature 0°C to +85°C (Commercial)
Configuration Interface Master/Slave Serial, SelectMAP, JTAG

On-Chip Clock Management

Feature Details
Delay-Locked Loops (DLLs) 4 (one at each die corner)
Global Clock Inputs 4 dedicated global clock/user input pins
Clock Skew Elimination Yes (via DLL)
Frequency Synthesis Yes

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

Device Logic Cells System Gates CLB Array Max User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and highest-density device in the Spartan-II family, making it the go-to choice for applications requiring the maximum logic resources this product line can offer.


XC2S200-6FGG1088C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 features a 28×42 array of CLBs, giving designers 1,176 total configurable logic blocks. Each CLB contains two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables flexible, high-density logic implementation for everything from state machines to DSP pipelines.

Input/Output Blocks (IOBs)

The device provides 284 user-configurable I/O pins, supporting multiple I/O standards including LVCMOS, LVTTL, PCI, and SSTL. The IOBs surround the CLB array in a perimeter ring, offering registered inputs and outputs with optional slew rate control for signal integrity.

Block RAM

With 56K bits of dedicated block RAM organized in two columns flanking the CLB array, the XC2S200-6FGG1088C supports on-chip data buffering, FIFO implementation, and lookup table storage — without consuming valuable CLB resources.

Delay-Locked Loops (DLLs)

Four on-chip DLLs (one at each corner of the die) eliminate clock skew across the device, support frequency synthesis, and enable precise phase control. This makes the -6 speed grade version particularly suited to timing-critical, high-speed digital designs.


## Why Choose the -6 Speed Grade?

The -6 speed grade is the fastest available within the Spartan-II family and is exclusively offered for the commercial temperature range (0°C to +85°C). Choosing the -6 speed grade ensures:

  • Shorter propagation delays through combinational logic paths
  • Higher maximum clock frequencies for synchronous designs
  • Better setup and hold time margins for interfacing with fast external components
  • Improved performance in signal processing, communication, and control applications

Supported Configuration Modes

The XC2S200-6FGG1088C supports multiple configuration methods, giving designers flexibility in production programming and in-field updates:

Configuration Mode Description
Master Serial FPGA drives configuration clock; reads from serial PROM
Slave Serial External device drives clock and data
Master Parallel (SelectMAP) Faster parallel configuration via 8-bit bus
Slave Parallel (SelectMAP) Parallel mode driven by external controller
JTAG (Boundary Scan) IEEE 1149.1 compliant; supports in-system programming

Typical Applications of the XC2S200-6FGG1088C

The XC2S200-6FGG1088C is widely deployed across a range of industries and application domains:

  • Industrial Automation — Motor control, PLC interfaces, sensor fusion
  • Telecommunications — Protocol bridging, line card logic, framer/mapper implementations
  • Embedded Processing — Soft-core processor integration (e.g., PicoBlaze, MicroBlaze lite)
  • Test & Measurement Equipment — Data capture, pattern generation, timing analysis
  • Consumer Electronics — Display controllers, image processing pipelines
  • Automotive Electronics (non-safety-critical) — Gateway modules, HMI controllers
  • Military / Aerospace Prototyping — Pre-production logic validation

Pb-Free (RoHS Compliant) Packaging

The FGG suffix in the XC2S200-6FGG1088C part number indicates a Pb-free (lead-free), RoHS-compliant Fine Pitch Ball Grid Array package. Pb-free versions were introduced by Xilinx to comply with environmental regulations and are identifiable by the “G” character inserted into the ordering code. This makes the component suitable for use in modern electronics manufacturing environments with strict environmental compliance requirements.


Ordering Information Decoder

Understanding the full part number is essential for procurement and design documentation:

XC  2S  200  -  6  FGG  1088  C
│   │   │      │   │    │     └─ Temperature: C = Commercial (0°C to +85°C)
│   │   │      │   │    └─────── Pin Count: 1088
│   │   │      │   └──────────── Package: FGG = Fine Pitch BGA, Pb-Free
│   │   │      └──────────────── Speed Grade: -6 (fastest, commercial only)
│   │   └─────────────────────── Device Density: 200K gates
│   └─────────────────────────── Family: 2S = Spartan-II
└─────────────────────────────── Xilinx FPGA prefix

XC2S200-6FGG1088C vs. Alternative Devices

Feature XC2S200-6FGG1088C XC2S150-6FGG456C XC3S200-5FGG320C
Family Spartan-II Spartan-II Spartan-3
System Gates 200,000 150,000 200,000
Max User I/O 284 260 141
Block RAM 56K bits 48K bits 216K bits
Speed Grade -6 -6 -5
Voltage 2.5V 2.5V 1.2V core
Package Pins 1088 456 320

The XC2S200-6FGG1088C offers the highest I/O count of any Spartan-II device, making it ideal when pin-count and I/O flexibility are critical design constraints.


Design Tools & Software Support

Xilinx (now AMD) supported the Spartan-II family through its ISE Design Suite toolchain. Designers working with the XC2S200-6FGG1088C can use:

  • ISE Design Suite — Synthesis, implementation, place-and-route, and bitstream generation
  • ModelSim / ISim — Functional and timing simulation
  • ChipScope Pro — In-system logic analysis via JTAG
  • CORE Generator — IP core integration (FIFOs, memories, arithmetic blocks)
  • iMPACT — Device programming and configuration file management

Frequently Asked Questions (FAQ)

What does the “G” in FGG mean?

The “G” in FGG indicates a Pb-free (lead-free) package, compliant with RoHS environmental directives. It distinguishes the Pb-free variant from older standard (leaded) packaging options.

Is the XC2S200-6FGG1088C still in production?

The Spartan-II family has reached end-of-life status. However, the XC2S200-6FGG1088C remains available through authorized distributors and component brokers for legacy design support and board repair.

What is the maximum operating frequency of the XC2S200-6FGG1088C?

The -6 speed grade is the fastest in the Spartan-II family. Maximum toggle frequency and system clock speeds depend on the specific design implementation, but the -6 grade provides the best timing margins and shortest propagation delays available in this family.

Can I replace an XC2S200-6FGG1088C with a Spartan-3 device?

A direct drop-in replacement is not possible due to different core voltages, package footprints, and architectural differences. However, the Xilinx Spartan-3 family is the functional successor and may be used in new designs.


Summary: XC2S200-6FGG1088C at a Glance

Attribute Detail
Part Number XC2S200-6FGG1088C
Family Xilinx Spartan-II
System Gates 200,000
Logic Cells 5,292
User I/O 284
Block RAM 56K bits
DLLs 4
Package 1088-pin FGG (Pb-Free FBGA)
Speed Grade -6 (fastest)
Operating Temperature 0°C to +85°C (Commercial)
Core Voltage 2.5V
RoHS Compliant Yes

For a broader selection of programmable logic devices including the full Spartan and Virtex product lines, visit Xilinx FPGA to explore compatible components and procurement options.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.