The XC2S200-6FGG1087C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume applications that demand programmable logic flexibility without the steep NRE costs of mask-programmed ASICs, this device offers 200,000 system gates, a 1,176-CLB array, and a 1087-ball Fine-Pitch BGA (FGG) Pb-free package — making it a go-to solution for engineers working on communication, industrial, and consumer electronics designs. If you are sourcing or evaluating Xilinx FPGA components, the XC2S200-6FGG1087C is one of the most capable members in the Spartan-II lineup.

What Is the XC2S200-6FGG1087C?

The XC2S200-6FGG1087C is part of Xilinx’s Spartan-II 2.5V FPGA family. Breaking down the part number gives a complete picture of the device’s configuration:

This Pb-free, high-density BGA package makes it ideal for modern designs that must comply with RoHS directives while still requiring maximum I/O density.

XC2S200-6FGG1087C Key Specifications

Logic & Memory Resources

Device & Package Details

Electrical & Timing Characteristics

XC2S200-6FGG1087C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200 is built around 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains two slices, and each slice includes two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture enables efficient implementation of arithmetic, logic, and memory functions.

Input/Output Blocks (IOBs)

The device surrounds the CLB core with a perimeter of programmable Input/Output Blocks. With up to 284 user-available I/O pins (excluding global clock inputs), the XC2S200 supports a wide range of interface standards critical for multi-board designs and system integration.

Block RAM

Two columns of dedicated Block RAM sit between the CLB array and IOB columns on opposite sides of the die. The total 56Kbits of Block RAM is ideal for look-up tables, FIFOs, and local data buffering without consuming CLB resources.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops — one at each corner of the die — provide precise clock edge alignment, clock doubling/division, and phase shifting. This makes the XC2S200-6FGG1087C well-suited for synchronous designs that demand tight timing margins.

Spartan-II Family Comparison: Where Does the XC2S200 Fit?

The XC2S200 is the largest member of the Spartan-II family, offering the highest logic density and I/O count in the lineup.

For designs that need maximum gate count and I/O within the Spartan-II family, the XC2S200-6FGG1087C is the definitive choice.

XC2S200-6FGG1087C Configuration & Programming

Supported Configuration Modes

The XC2S200-6FGG1087C supports multiple configuration interfaces to accommodate different system architectures:

Configuration Memory

Spartan-II FPGAs are SRAM-based and must be reconfigured at power-up. Configuration data is typically stored in external serial or parallel Flash/PROM devices (e.g., Xilinx XCF-series PROMs).

Typical Applications for the XC2S200-6FGG1087C

The XC2S200-6FGG1087C is suited for a wide variety of commercial and industrial applications:

• Communications & Networking – Protocol conversion, line-rate processing, switch fabrics
• Industrial Automation – Motor control, sensor interfaces, custom I/O expansion
• Consumer Electronics – Video processing, display controllers, embedded control
• Test & Measurement – Data acquisition front-ends, pattern generators, logic analyzers
• Embedded Systems – Custom peripheral controllers, bus bridges, co-processing

XC2S200-6FGG1087C vs. Alternative Packages

The XC2S200 is available in multiple package options. The FGG1087 is the largest, offering maximum I/O flexibility.

Note: The FGG1087 package offers the same maximum user I/O count (284) as the FG456, but in a Pb-free, RoHS-compliant form factor with a larger ball count that may suit certain PCB layout and thermal requirements.

Ordering Information & Part Number Decoder

Understanding the full Xilinx part number syntax helps ensure you order exactly the right component:

XC2S200 - 6 - FGG - 1087 - C
  |        |    |      |    |
  |        |    |      |    └── Temperature Range: C = Commercial (0°C to +85°C)
  |        |    |      └─────── Number of Pins/Balls: 1087
  |        |    └────────────── Package: FGG = Fine-Pitch BGA, Pb-Free
  |        └─────────────────── Speed Grade: -6 (fastest, Commercial only)
  └──────────────────────────── Device: Spartan-II, 200K gates

FAQs About the XC2S200-6FGG1087C

What does the “G” in FGG mean?

The extra “G” in the package code (FGG vs. FG) indicates that the package is Pb-free (lead-free), compliant with RoHS environmental regulations.

Is the -6 speed grade available in industrial temperature range?

No. The -6 speed grade is exclusively available in the Commercial temperature range (0°C to +85°C). Industrial range (-40°C to +85°C) devices are available in slower speed grades.

Is the XC2S200 still in production?

The Spartan-II family has been available for many years and may be in end-of-life or limited availability status. It is recommended to check current stock with authorized distributors or consider Xilinx’s newer FPGA families (Spartan-6, Spartan-7, Artix-7) for new designs.

What software do I use to program the XC2S200-6FGG1087C?

Xilinx ISE Design Suite (legacy) supports the Spartan-II family. Vivado does not support Spartan-II devices; use ISE 14.7 for design implementation and programming.

Why Choose the XC2S200-6FGG1087C?

• ✅ Highest logic density in the Spartan-II family (200K gates, 5,292 logic cells)
• ✅ Pb-free/RoHS-compliant FGG1087 package
• ✅ Speed grade -6 — the fastest available for Spartan-II
• ✅ 284 user I/O — maximum I/O for XC2S200 devices
• ✅ Four DLLs for precision clock management
• ✅ 56Kbits Block RAM for embedded data buffering
• ✅ JTAG Boundary Scan for simplified board-level testing
• ✅ 2.5V core with multi-standard I/O support

Summary

The XC2S200-6FGG1087C is the flagship device of the Xilinx Spartan-II FPGA family, combining 200,000 system gates, 1,176 CLBs, 284 I/O pins, and a fast -6 speed grade in a Pb-free 1087-ball BGA package. It remains a reliable choice for legacy system maintenance, high-volume cost-sensitive designs, and applications requiring well-understood, battle-tested programmable logic. Whether you are designing a new embedded system or sustaining an existing product line, the XC2S200-6FGG1087C delivers the performance, I/O capacity, and flexibility that engineers need.