Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1085C: Complete Guide to the Xilinx Spartan-II FPGA

Product Details

The XC2S200-6FGG1085C is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume, logic-intensive applications, this device delivers 200,000 system gates, 5,292 logic cells, and operates at up to 263 MHz — all in a compact 1085-ball Fine Pitch BGA package. Whether you are a hardware engineer, procurement specialist, or embedded systems designer, this guide provides everything you need to know about the XC2S200-6FGG1085C.


What Is the XC2S200-6FGG1085C?

The XC2S200-6FGG1085C is part of Xilinx’s Spartan-II 2.5V FPGA product line. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Spartan-II FPGA, 200K system gates
-6 Speed grade 6 (fastest available, commercial only)
FGG Fine Pitch Ball Grid Array (FBGA) package, Pb-free
1085 1085 total pins
C Commercial temperature range (0°C to +85°C)

This device is an excellent ASIC replacement and a superior choice for prototyping, production, and field-upgradeable digital logic designs. Explore the full range of compatible devices at Xilinx FPGA.


XC2S200-6FGG1085C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
System Gates (Logic + RAM) 200,000
Logic Cells 5,292
CLB Array (Rows × Columns) 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM (bits) 75,264
Block RAM (bits) 56K
Delay-Locked Loops (DLL) 4

Electrical & Timing Characteristics

Parameter Value
Core Supply Voltage 2.5V
Technology Node 0.18 µm
Maximum Frequency 263 MHz
Speed Grade -6 (fastest commercial)
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL

Package & Environmental Information

Parameter Value
Package Type Fine Pitch BGA (FGG) — Pb-Free
Total Pins 1085
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Pb-Free (G suffix in ordering code)

XC2S200-6FGG1085C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB structure is the heart of the XC2S200-6FGG1085C. Each CLB contains four logic cells, and with 1,176 total CLBs arranged in a 28×42 matrix, designers have significant capacity for implementing complex combinational and sequential logic. Each logic cell includes a 4-input Look-Up Table (LUT), a storage register, and carry and control logic.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1085C provides up to 284 user-configurable I/O pins. Each IOB supports programmable input delay, output slew rate control, and a wide range of single-ended and differential I/O standards, making this FPGA adaptable to virtually any digital interface requirement.

Block RAM

Two columns of dedicated Block RAM provide 56K bits of synchronous dual-port memory. This embedded memory is ideal for FIFOs, lookup tables, data buffers, and small on-chip storage without consuming CLB resources.

Delay-Locked Loops (DLL)

Four on-chip DLLs — one at each corner of the die — allow designers to eliminate clock-distribution skew, multiply or divide the system clock, and generate phase-shifted clock signals. This is critical for high-speed synchronous designs running near the 263 MHz maximum frequency.

Routing Architecture

A hierarchical routing network connects all CLBs, IOBs, Block RAMs, and DLLs. This architecture enables efficient signal distribution across the entire 28×42 CLB array while maintaining timing predictability for critical paths.


Spartan-II Family Comparison: Where Does the XC2S200 Stand?

Device Logic Cells System Gates CLB Array User I/O Block RAM
XC2S15 432 15,000 8×12 86 16K
XC2S30 972 30,000 12×18 92 24K
XC2S50 1,728 50,000 16×24 176 32K
XC2S100 2,700 100,000 20×30 176 40K
XC2S150 3,888 150,000 24×36 260 48K
XC2S200 5,292 200,000 28×42 284 56K

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the highest logic density, most I/O pins, and largest block RAM. The -6FGG1085C variant delivers the fastest speed grade in a high pin-count Pb-free BGA package.


XC2S200-6FGG1085C Configuration & Programming

Supported Configuration Modes

The XC2S200-6FGG1085C supports multiple configuration modes, providing flexibility for different system architectures:

Configuration Mode Description
Master Serial Device reads bitstream from external serial PROM
Slave Serial Bitstream loaded by an external controller
Master Parallel (SelectMAP) Byte-wide parallel configuration interface
Slave Parallel (SelectMAP) Parallel loading by external processor
JTAG (IEEE 1149.1) Boundary scan and in-system programming

Xilinx ISE Design Suite Support

The XC2S200-6FGG1085C is fully supported by the Xilinx ISE Design Suite. The typical design flow includes HDL coding (VHDL or Verilog), synthesis, implementation (map, place & route), timing analysis, and bitstream generation.


Key Features of the XC2S200-6FGG1085C

  • 200,000 system gates — highest density in the Spartan-II family
  • Speed Grade -6 — fastest available, exclusively for the commercial temperature range
  • 1085-ball Fine Pitch BGA — high pin-count package for I/O intensive designs
  • Pb-Free (FGG) package — meets RoHS environmental standards
  • 263 MHz maximum frequency — suitable for high-speed digital applications
  • Four on-chip DLLs for clock management and zero-skew distribution
  • 56K bits of Block RAM and 75,264 bits of distributed RAM
  • 284 user I/O with support for multiple I/O standards
  • IEEE 1149.1 JTAG boundary scan for in-system testing
  • ASIC replacement-ready — eliminates NRE costs and long ASIC development cycles

XC2S200-6FGG1085C Applications

The XC2S200-6FGG1085C is well-suited for a broad range of applications:

Embedded & Industrial Systems

  • Industrial control systems and motor drive controllers
  • Real-time signal processing and filtering
  • Machine vision and image processing pipelines

Communications & Networking

  • High-speed data interfaces and protocol bridges
  • Network packet processing and switching logic
  • Serial communication controllers (UART, SPI, I2C)

Consumer Electronics & Prototyping

  • ASIC prototyping and design verification
  • Custom co-processor development
  • Digital signal chain implementations

Medical & Test Equipment

  • Data acquisition systems
  • Signal analysis and waveform generation
  • Diagnostic and measurement hardware

Why Choose the XC2S200-6FGG1085C Over an ASIC?

Criterion XC2S200-6FGG1085C (FPGA) Mask-Programmed ASIC
NRE (Non-Recurring Engineering) Cost None High ($500K–$5M+)
Time to Market Days/Weeks 6–24 months
Field Upgradability Yes (re-programmable) No
Design Risk Low High
Small Volume Cost Competitive Very High per Unit
Design Changes Free (bitstream update) Costly (new mask set)

For engineers developing high-volume designs who need maximum flexibility, the XC2S200-6FGG1085C offers a compelling combination of performance, density, and cost-effectiveness that traditional ASICs simply cannot match at the prototype and mid-volume stage.


Ordering Information & Part Number Decode

Field Value Description
Device XC2S200 Spartan-II, 200K gates
Speed Grade -6 Fastest; commercial range only
Package FGG Fine Pitch BGA, Pb-Free
Pin Count 1085 Total BGA balls
Temperature C Commercial: 0°C to +85°C

Full Part Number: XC2S200-6FGG1085C


Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1085C?

The XC2S200-6FGG1085C is a Xilinx Spartan-II family FPGA with 200,000 system gates (5,292 logic cells), speed grade -6, housed in a 1085-ball Pb-free Fine Pitch BGA package for commercial temperature operation.

What is the maximum operating frequency of the XC2S200-6FGG1085C?

The XC2S200-6FGG1085C supports a maximum system frequency of up to 263 MHz, making it suitable for demanding high-speed digital design applications.

Is the XC2S200-6FGG1085C RoHS compliant?

Yes. The “G” character in the “FGG” package designation indicates a Pb-free (lead-free) package, making the XC2S200-6FGG1085C RoHS compliant.

What tools are used to program the XC2S200-6FGG1085C?

This device is programmed using the Xilinx ISE Design Suite with support for VHDL, Verilog, and schematic entry. Configuration is possible via JTAG, Master/Slave Serial, or Master/Slave Parallel (SelectMAP) modes.

What is the difference between XC2S200-6FGG1085C and XC2S200-5FGG456C?

The key differences are the speed grade (-6 is faster than -5), the package (1085-pin FGG vs. 456-pin FGG), and the available I/O count. The -6FGG1085C offers maximum I/O flexibility for high pin-count applications.


Summary

The XC2S200-6FGG1085C is the top-tier member of Xilinx’s Spartan-II 2.5V FPGA family — combining the highest available logic density (200K gates, 5,292 cells), fastest speed grade (-6, up to 263 MHz), and a large 1085-pin Pb-free BGA package into a single, re-programmable, field-upgradeable solution. It is an ideal choice for engineers who need ASIC-class performance without ASIC-class NRE costs or time-to-market risk.

For sourcing, pricing, and a broader selection of Spartan-II and other programmable logic devices, visit Xilinx FPGA.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.