Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1084C: Xilinx Spartan-II FPGA – Full Specifications & Buying Guide

Product Details

The XC2S200-6FGG1084C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family, offering 200,000 system gates in a robust 1084-ball Fine-Pitch BGA (FBGA) package. Designed for cost-sensitive, high-volume applications, this device delivers the programmable flexibility engineers need without the long lead times or NRE costs associated with mask-programmed ASICs. Whether you’re designing communication systems, embedded control platforms, or digital signal processing circuits, the XC2S200-6FGG1084C is a proven and reliable solution.

For a broader selection of compatible devices, explore our full range of Xilinx FPGA products.


What Is the XC2S200-6FGG1084C?

The XC2S200-6FGG1084C is part of Xilinx’s Spartan-II FPGA family, fabricated using advanced 0.18µm CMOS process technology and operating on a 2.5V core supply. The part number breaks down as follows:

Part Number Segment Meaning
XC2S200 Xilinx Spartan-II, 200K system gates
-6 Speed Grade 6 (fastest, Commercial only)
FGG Fine-Pitch Ball Grid Array (Pb-Free, “GG” suffix)
1084 1084 pins/balls
C Commercial temperature range (0°C to +85°C)

XC2S200-6FGG1084C Key Specifications

General Electrical Characteristics

Parameter Value
Manufacturer Xilinx (AMD)
Series Spartan-II
Part Number XC2S200-6FGG1084C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 2.5V / 3.3V
Speed Grade -6 (fastest available)
Operating Temperature 0°C to +85°C (Commercial)
Package 1084-Ball Fine-Pitch BGA
Package Code FGG1084 (Pb-Free)
Process Technology 0.18µm CMOS

XC2S200 Logic Architecture

The XC2S200’s programmable logic is built around a matrix of Configurable Logic Blocks (CLBs), each containing:

  • Four 4-input Look-Up Tables (LUTs)
  • Four storage elements (flip-flops or latches)
  • Dedicated carry and arithmetic logic
  • Wide-function multiplexers

This architecture enables the XC2S200-6FGG1084C to implement a wide variety of combinatorial and sequential logic functions efficiently.


Memory Resources

Memory Type Total Capacity
Distributed RAM (LUT-based) 75,264 bits
Block RAM 56,000 bits (56K)
Block RAM Modules 14 × 4K-bit blocks

Block RAM in the XC2S200 supports dual-port configurations, allowing simultaneous read and write operations — a critical feature for high-speed data buffering and FIFO implementations.


Clock Management – Delay-Locked Loops (DLLs)

The XC2S200-6FGG1084C includes four Delay-Locked Loops (DLLs), one placed at each corner of the silicon die. DLLs provide:

  • Zero clock skew across the device
  • Clock frequency multiplication and division
  • Phase shifting for precise timing control
  • Improved setup and hold margin in synchronous designs

I/O Block (IOB) Features

I/O Feature Detail
Maximum User I/Os 284
I/O Standards Supported LVTTL, LVCMOS, GTL, SSTL, HSTL, CTT, AGP
Input Register Available (with optional clock enable)
Output Register Available
3-State Control Per I/O pin
Pull-up / Pull-down Programmable
Slew Rate Control Fast / Slow selectable
Global Clock Inputs 4 dedicated (not included in 284 user I/Os)

XC2S200-6FGG1084C Package Information

The FGG1084 package is a 1084-ball Fine-Pitch Ball Grid Array with the “GG” suffix indicating Pb-Free (RoHS-compliant) construction. This makes the XC2S200-6FGG1084C suitable for modern manufacturing environments with strict environmental compliance requirements.

Package Parameter Value
Package Type Fine-Pitch BGA (FBGA)
Total Balls 1,084
Pb-Free Yes (GG suffix)
PCB Footprint Style BGA land pattern
Recommended Reflow Lead-free reflow profile

Spartan-II Family Comparison: Where Does XC2S200 Fit?

The XC2S200 is the largest device in the Spartan-II product family, offering the highest logic capacity and I/O count in the lineup.

Device Logic Cells System Gates CLBs Max User I/O Distributed RAM Block RAM
XC2S15 432 15,000 96 86 6,144 bits 16K
XC2S30 972 30,000 216 92 13,824 bits 24K
XC2S50 1,728 50,000 384 176 24,576 bits 32K
XC2S100 2,700 100,000 600 176 38,400 bits 40K
XC2S150 3,888 150,000 864 260 55,296 bits 48K
XC2S200 5,292 200,000 1,176 284 75,264 bits 56K

Speed Grade Comparison for XC2S200

Xilinx offers the XC2S200 in multiple speed grades. The -6 speed grade is the fastest and is exclusively available in the Commercial temperature range.

Speed Grade Performance Level Temperature Range
-5 Standard Commercial (C) / Industrial (I)
-6 Fastest Commercial (C) only

The XC2S200**-6**FGG1084C uses the -6 speed grade, making it the optimal choice for timing-critical, high-frequency designs operating in controlled environments.


XC2S200-6FGG1084C Applications

The XC2S200-6FGG1084C is widely used across industries and applications that require programmable, high-density logic in a cost-effective form factor:

Telecommunications & Networking

  • Line card processing
  • Protocol bridging (UART, SPI, I2C, etc.)
  • Framing and data aggregation logic

Industrial Control Systems

  • Motor drive control
  • PLC (Programmable Logic Controller) emulation
  • Sensor interface and signal conditioning

Consumer & Embedded Electronics

  • Embedded processor support logic
  • Display controllers
  • High-speed data capture systems

Digital Signal Processing (DSP)

  • FIR/IIR filter implementation
  • FFT engines
  • Real-time waveform generation

Prototyping & ASIC Replacement

  • Rapid prototype development
  • ASIC functionality emulation
  • Test and measurement equipment

Design Tools & Programming Support

The XC2S200-6FGG1084C is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, which provides:

  • HDL synthesis (VHDL, Verilog)
  • Place & Route tools optimized for Spartan-II architecture
  • Timing analysis and simulation
  • JTAG-based in-circuit programming support (IEEE 1149.1 Boundary Scan)

The device supports multiple configuration modes including Master Serial, Slave Serial, Slave Parallel, and JTAG, offering flexible system integration options.


Why Choose the XC2S200-6FGG1084C Over a Custom ASIC?

Criterion XC2S200-6FGG1084C (FPGA) Mask-Programmed ASIC
Non-Recurring Engineering Cost None High (often $500K+)
Time to Market Fast (days to weeks) Slow (months to years)
Design Changes Reprogrammable anytime Fixed after tape-out
Volume Flexibility Any quantity Best for very high volume
Risk Low High (one-time mask cost)
Prototype Feasibility Immediate Expensive prototype runs

The XC2S200-6FGG1084C eliminates NRE costs entirely and allows field-upgradeable designs — a decisive advantage for product iterations and long-term design support.


Ordering Information & Part Number Decode

Field XC2S200-6FGG1084C
Device Family Spartan-II
Gate Count 200,000
Speed Grade -6
Package FGG (Fine-Pitch BGA, Pb-Free)
Pin Count 1084
Temperature Grade C (Commercial: 0°C to +85°C)

Frequently Asked Questions (FAQ)

Is the XC2S200-6FGG1084C RoHS compliant?

Yes. The “GG” suffix in the package code (FGG1084) indicates this is a Pb-Free, RoHS-compliant package.

What is the maximum operating frequency of the XC2S200-6?

The -6 speed grade is the fastest Spartan-II grade available, with internal logic speeds capable of supporting designs up to 263 MHz depending on design complexity and placement.

Can the XC2S200-6FGG1084C be reprogrammed in-system?

Yes. Spartan-II FPGAs support in-system reconfiguration via JTAG or configuration PROM, allowing design updates without board replacement.

What software do I need to program the XC2S200-6FGG1084C?

Xilinx ISE Design Suite (legacy support) is the primary development tool. HDL (VHDL or Verilog) is used to describe logic, and iMPACT or equivalent programming software handles device configuration.

What are common alternative part numbers?

The XC2S200-6FGG1084C may be interchangeable with other XC2S200 variants depending on package and speed grade requirements, such as the XC2S200-5FGG1084C (slower speed grade) or XC2S200-6PQ208C (different package).


Conclusion

The XC2S200-6FGG1084C stands out as the highest-capacity, fastest-speed-grade device in the Xilinx Spartan-II family, offering 200,000 system gates, 5,292 logic cells, 284 user I/Os, and 56K bits of block RAM — all in a Pb-Free 1084-ball Fine-Pitch BGA package. Its combination of performance, logic density, and reprogrammability makes it an excellent choice for engineers who need a flexible, reliable, and cost-effective alternative to custom ASICs.

Whether you’re building embedded systems, communication hardware, or industrial controllers, the XC2S200-6FGG1084C delivers the density and speed your project demands. Browse our complete collection of Xilinx FPGA solutions to find the right part for your design.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.