The XC2S200-6FGG1083C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates in a compact 1083-ball Fine-Pitch BGA (FBGA) Pb-free package. Whether you are an embedded systems engineer, a PCB designer, or a procurement specialist, this guide covers everything you need to know about the XC2S200-6FGG1083C — from core specifications to ordering information and application use cases.

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What Is the XC2S200-6FGG1083C? — Xilinx Spartan-II FPGA Overview

The XC2S200-6FGG1083C is part of the Xilinx Spartan-II 2.5V FPGA family, a series of programmable logic devices built on a 0.18µm, 6-layer metal CMOS process. The Spartan-II family was engineered as a low-cost alternative to mask-programmed ASICs, eliminating the high NRE (Non-Recurring Engineering) costs and long development cycles associated with traditional ASICs.

The part number breaks down as follows:

For engineers sourcing programmable logic components, the XC2S200-6FGG1083C represents the top-density device in the Spartan-II lineup, offering the maximum gate count and I/O availability within the family. Explore the full range of options in our Xilinx FPGA catalog.

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XC2S200-6FGG1083C Key Specifications at a Glance

The table below summarizes the most critical specifications for the XC2S200-6FGG1083C:

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XC2S200-6FGG1083C Architecture and Internal Structure

## Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1083C contains 1,176 Configurable Logic Blocks arranged in a 28-column by 42-row array. Each CLB includes four logic cells, with each cell containing a 4-input Look-Up Table (LUT), a carry chain, and a storage element (flip-flop or latch). This flexible architecture enables the implementation of complex combinational and sequential logic designs.

## Block RAM Architecture

The device integrates 56K bits of block RAM, organized in two columns on opposite sides of the die. Each block RAM is a true dual-port memory that can be independently configured for different aspect ratios, making it ideal for FIFOs, data buffers, and on-chip memory applications.

## Distributed RAM

In addition to block RAM, the XC2S200-6FGG1083C offers 75,264 bits of distributed RAM implemented within the CLB LUTs. This allows designers to create small, fast, embedded memory structures directly within the fabric without consuming dedicated block RAM resources.

## Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide advanced clock management capabilities including clock deskewing, frequency synthesis, and phase shifting. DLLs are critical for high-speed synchronous designs where precise clock alignment is required.

## Input/Output Blocks (IOBs)

The XC2S200-6FGG1083C supports up to 284 user I/O pins, each implemented as a programmable Input/Output Block. Key I/O features include:

• Programmable pull-up and pull-down resistors
• 3-state (high-Z) output capability
• Slew rate control (fast/slow)
• Support for multiple I/O standards (LVCMOS, LVTTL, SSTL, AGP, GTL, CTT, PCI)
• Input delay for zero hold-time designs

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Spartan-II Family Comparison Table

The XC2S200 is the largest device in the Spartan-II family. Here is how it compares to other members:

The XC2S200-6FGG1083C is the top choice when maximum logic density, I/O count, and memory capacity are required within the Spartan-II family.

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XC2S200-6FGG1083C Package Options and Ordering Information

Xilinx offers the XC2S200 in several package variants. The FGG1083 Pb-free FBGA package is one of the highest pin-count options, providing abundant I/O connectivity for complex board-level integration.

### XC2S200 Available Packages

### Understanding the -6 Speed Grade

The -6 speed grade is the fastest available for the XC2S200 and is exclusively offered in the Commercial temperature range (0°C to +85°C). It is not available in the Industrial temperature range. Engineers requiring the highest operating frequencies in a commercial environment should specify the -6 speed grade.

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XC2S200-6FGG1083C Configuration and Programming

The XC2S200-6FGG1083C supports multiple configuration modes, giving system designers flexibility in how the FPGA is programmed at power-up:

The device is fully compatible with Xilinx Platform Flash PROMs for persistent configuration storage, enabling reliable power-on programming in production systems.

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Key Features and Benefits of the XC2S200-6FGG1083C

• 200,000 system gates — highest logic density in the Spartan-II family
• 284 user I/O pins — maximizes board-level connectivity
• -6 speed grade — fastest commercial performance, up to 263 MHz
• 1083-ball Pb-free FBGA package — RoHS-compliant and environmentally responsible
• 4 on-chip DLLs — advanced clock management without external components
• 56K block RAM + 75K distributed RAM — flexible on-chip memory architecture
• 2.5V core voltage — lower power consumption versus 5V or 3.3V devices
• JTAG boundary-scan — simplifies board-level testing and debugging
• Field re-programmability — design updates in the field without hardware replacement
• ASIC replacement — eliminates NRE costs and long ASIC development cycles

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XC2S200-6FGG1083C Applications

The XC2S200-6FGG1083C is widely used across multiple industries and application domains:

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XC2S200-6FGG1083C vs. Alternative FPGA Devices

When selecting an FPGA, it is important to compare the XC2S200-6FGG1083C against competing options:

The XC2S200-6FGG1083C offers the highest I/O count (284) and maximum Spartan-II gate density, making it the preferred choice when I/O-intensive designs are a priority.

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Design Tools and Software Support

The XC2S200-6FGG1083C is fully supported by Xilinx ISE Design Suite (ISE 14.7 being the final version supporting Spartan-II). Key tools include:

• ISE Project Navigator — RTL design, synthesis, and implementation
• CORE Generator — IP core instantiation for memory, DSP, and interface cores
• ChipScope Pro — On-chip logic analyzer for in-system debugging
• iMPACT — JTAG-based configuration and programming tool
• ModelSim / ISIM — Functional and timing simulation

Note: The Spartan-II family is a mature product line. Designers starting new projects may consider migrating to the Spartan-6 or Artix-7 families for longer-term support and improved performance.

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Frequently Asked Questions (FAQ) About the XC2S200-6FGG1083C

What does the “G” in FGG1083 mean?

The “G” in the package code indicates a Pb-free (lead-free) package, compliant with RoHS environmental regulations. The “FGG” designation means Fine-pitch Ball Grid Array, Pb-free.

Is the XC2S200-6FGG1083C RoHS compliant?

Yes. The FGG suffix confirms that this part uses Pb-free solder balls, making it RoHS compliant for use in environmentally regulated markets.

What is the operating temperature range of the XC2S200-6FGG1083C?

The “C” suffix denotes Commercial temperature range: 0°C to +85°C. For industrial applications requiring –40°C to +85°C operation, the -5 or -4 speed grade variants with an “I” suffix should be specified.

Can I use the XC2S200-6FGG1083C in a new design today?

The Spartan-II family is a mature, end-of-life product line. While existing inventory is available from distributors, new designs should consider the Artix-7 or Spartan-7 families for long-term supply chain support and improved performance.

What FPGA programming software supports the XC2S200-6FGG1083C?

Xilinx ISE Design Suite (version 14.7) is the last version to support Spartan-II devices. It is available as a free download from the AMD/Xilinx website.

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Summary: Why Choose the XC2S200-6FGG1083C?

The XC2S200-6FGG1083C is the highest-performance, highest-density device in the Xilinx Spartan-II family, offering 200K system gates, 284 user I/Os, and the fastest -6 speed grade in a modern, RoHS-compliant 1083-ball FBGA package. It remains a reliable choice for legacy system maintenance, high-volume production of proven designs, and applications where its specific combination of gate density, I/O count, and package footprint is a perfect fit. For a complete range of programmable logic solutions from Xilinx, visit our Xilinx FPGA product page.