The XC2S200-6FGG1080C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Designed for commercial-grade applications that demand reliable programmable logic at an accessible price point, this device combines 200,000 system gates, a 1080-ball Fine-Pitch BGA (FGG) package, and a -6 speed grade — making it an exceptional choice for engineers targeting high-volume embedded systems, communications hardware, and digital signal processing designs.
Whether you are replacing an ASIC, prototyping a new design, or sourcing a drop-in replacement for an existing board, the XC2S200-6FGG1080C delivers the logic density, I/O flexibility, and design security your project demands. Explore the full range of programmable logic solutions on Xilinx FPGA.
What Is the XC2S200-6FGG1080C?
The XC2S200-6FGG1080C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V FPGA platform engineered as a cost-effective alternative to mask-programmed ASICs. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II device with ~200,000 system gates |
| -6 |
Speed grade (-6 is the fastest available for commercial range) |
| FGG |
Fine-Pitch Ball Grid Array package (Pb-Free variant, “G” suffix) |
| 1080 |
1080 total package pins |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1080C Key Specifications
Core Logic Resources
| Parameter |
XC2S200 Specification |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM (bits) |
75,264 |
| Block RAM (bits) |
56K |
| Delay-Locked Loops (DLLs) |
4 |
Electrical & Package Specifications
| Parameter |
Value |
| Supply Voltage (VCC) |
2.5V |
| I/O Voltage Support |
2.5V, 3.3V (LVTTL, LVCMOS) |
| Speed Grade |
-6 (fastest commercial grade) |
| Package Type |
FGG – Fine Pitch Ball Grid Array (Pb-Free) |
| Package Pins |
1080 |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Configuration Modes |
Master Serial, Slave Serial, Slave Parallel, JTAG |
Spartan-II Family Comparison
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Block RAM |
| XC2S15 |
432 |
15,000 |
8 × 12 |
86 |
16K |
| XC2S30 |
972 |
30,000 |
12 × 18 |
92 |
24K |
| XC2S50 |
1,728 |
50,000 |
16 × 24 |
176 |
32K |
| XC2S100 |
2,700 |
100,000 |
20 × 30 |
176 |
40K |
| XC2S150 |
3,888 |
150,000 |
24 × 36 |
260 |
48K |
| XC2S200 |
5,292 |
200,000 |
28 × 42 |
284 |
56K |
The XC2S200 sits at the top of the Spartan-II family, offering the highest logic density, the most user I/O, and the largest block RAM capacity in this product line.
XC2S200-6FGG1080C Architecture Deep Dive
Configurable Logic Blocks (CLBs)
The XC2S200 features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells capable of implementing combinatorial and registered logic. The CLB architecture supports fast carry-chain arithmetic, making it ideal for counters, accumulators, and ALU designs.
Input/Output Blocks (IOBs)
The device provides up to 284 maximum user I/O pins, each housed in dedicated Input/Output Blocks. Each IOB supports:
- Programmable input delay for setup/hold optimization
- Optional output slew-rate control
- Pull-up, pull-down, and keeper resistors
- Compatibility with multiple I/O standards (LVTTL, LVCMOS25, LVCMOS33, PCI, GTL, HSTL, SSTL)
Block RAM
The XC2S200 includes 56 Kbits of true dual-port Block RAM organized in two columns on opposite sides of the die. Block RAM can be configured as various widths and depths, serving as FIFOs, lookup tables, or local memory buffers.
Delay-Locked Loops (DLLs)
Four on-chip Delay-Locked Loops — one at each corner of the die — enable precise clock management, phase shifting, duty-cycle correction, and clock multiplication/division without external components.
Why Choose the -6 Speed Grade?
The -6 speed grade is the highest (fastest) speed grade available for the XC2S200 in the commercial temperature range. It offers the shortest propagation delays through the CLB fabric and I/O, enabling higher system clock frequencies and tighter timing margins.
| Speed Grade |
Target Application |
| -5 |
Standard-speed, cost-sensitive designs |
| -6 |
Maximum performance, commercial range |
Note: The -6 speed grade is exclusively available in the Commercial (C) temperature range (0°C to +85°C). Industrial temperature range designs must use the -5 speed grade.
FGG Package & Pb-Free Compliance
The FGG (Fine Pitch Ball Grid Array, Pb-Free) package is identified by the double “G” in the package code, confirming RoHS-compliant, lead-free construction. With 1080 pins, this package provides exceptional I/O density and routing flexibility for complex, multi-bus board designs.
Package Dimensions & Pinout Overview
| Attribute |
Detail |
| Package Name |
FGG1080 |
| Package Style |
Fine Pitch BGA |
| Total Pins |
1,080 |
| Pb-Free |
Yes (RoHS Compliant) |
| Ball Pitch |
Fine pitch (high-density PCB routing) |
| Configuration Pins |
Dedicated (not counted in user I/O) |
XC2S200-6FGG1080C Typical Applications
The XC2S200-6FGG1080C is well-suited for a wide range of commercial and industrial applications:
#### Communications & Networking
- Protocol bridging (UART, SPI, I2C, custom serial)
- Line-rate packet processing and filtering
- Multi-port interface controllers
#### Digital Signal Processing (DSP)
- FIR/IIR filter implementations
- FFT and spectral analysis engines
- Image and video processing pipelines
#### Embedded Systems & SoC Integration
- Glue logic replacement in multi-chip designs
- Bus arbitration and DMA controllers
- Processor coprocessors and peripherals
#### Industrial Control
- Motor drive controllers
- Sensor fusion and real-time data acquisition
- Machine vision front-ends
#### Consumer Electronics
- Display controllers
- Audio processing units
- Custom interface solutions
Ordering Information & Part Number Decoder
| Field |
Value |
Description |
| Device |
XC2S200 |
200K gate Spartan-II FPGA |
| Speed Grade |
-6 |
Fastest commercial speed |
| Package |
FGG |
Pb-Free Fine Pitch BGA |
| Pin Count |
1080 |
Total package balls |
| Temp Range |
C |
Commercial (0°C to +85°C) |
| Full Part |
XC2S200-6FGG1080C |
Complete ordering code |
Design Tools & Configuration Support
The XC2S200-6FGG1080C is fully supported by Xilinx ISE Design Suite and compatible with standard JTAG-based programming and boundary scan. Configuration options include:
- Master Serial – Self-loading from external serial PROM
- Slave Serial – Controlled by an external microprocessor
- Slave Parallel (SelectMAP) – High-speed parallel configuration
- JTAG (IEEE 1149.1) – Boundary scan and in-system programming
The device supports PROM-based configuration using Xilinx XC17V and XCF PROM families.
XC2S200-6FGG1080C vs Competing Devices
| Feature |
XC2S200-6FGG1080C |
Typical Competing Device |
| System Gates |
200,000 |
Comparable logic class |
| Speed Grade |
-6 (fastest) |
Varies |
| Package |
FGG1080 (Pb-Free BGA) |
Various |
| Supply Voltage |
2.5V |
1.8V–3.3V |
| Block RAM |
56 Kbits |
18K–72K typical |
| DLLs |
4 |
2–8 |
| Config. Modes |
4 |
2–4 |
| Temp Range |
Commercial |
Commercial/Industrial |
Frequently Asked Questions (FAQ)
Q: What is the maximum operating frequency of the XC2S200-6FGG1080C? A: The -6 speed grade achieves the highest operating frequencies in the Spartan-II family. Typical system clock frequencies range from 100 MHz to over 200 MHz depending on the design and routing, as validated through timing analysis in Xilinx ISE.
Q: Is the XC2S200-6FGG1080C RoHS compliant? A: Yes. The double “G” suffix in the package code (FGG) confirms that this is a Pb-free, RoHS-compliant package.
Q: What is the difference between XC2S200-6FGG1080C and XC2S200-5FGG1080C? A: The -6 speed grade offers faster propagation delays and higher maximum clock frequencies compared to the -5 grade. The -6 grade is only available in the commercial temperature range (0°C to +85°C), while -5 is available in both commercial and industrial ranges.
Q: Can the XC2S200-6FGG1080C replace ASICs? A: Yes. The Spartan-II family was specifically designed as a cost-effective, reconfigurable alternative to mask-programmed ASICs for high-volume applications, eliminating NRE costs and reducing time to market.
Q: What programming software is required? A: The XC2S200-6FGG1080C is supported by Xilinx ISE Design Suite (WebPACK and full editions). VHDL, Verilog, and schematic-based design entry are all supported.
Summary
The XC2S200-6FGG1080C is the premier device in the Xilinx Spartan-II FPGA family for commercial-grade designs requiring maximum logic density and the fastest available speed grade. With 5,292 logic cells, 200,000 system gates, 284 user I/Os, 56 Kbits of block RAM, and 4 DLLs — all housed in a 1080-ball Pb-Free Fine Pitch BGA package — this FPGA delivers outstanding performance per dollar for production-volume applications.
Its -6 speed grade, broad I/O standard support, and flexible configuration options make it an enduring choice for communications, DSP, embedded control, and industrial applications. For a comprehensive selection of programmable logic devices and expert sourcing support, visit Xilinx FPGA.