The XC2S200-6FGG1079C is a high-performance, cost-effective Field-Programmable Gate Array (FPGA) manufactured by Xilinx (now AMD), part of the industry-proven Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, a -6 speed grade, and a lead-free 1079-ball Fine Pitch BGA package, this device is engineered for high-volume commercial applications that demand flexible, reprogrammable logic at a competitive price point. Whether you are designing digital signal processing systems, embedded controllers, or communication interfaces, the XC2S200-6FGG1079C delivers the performance and I/O density your project requires.

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What Is the XC2S200-6FGG1079C? Understanding the Part Number

Before diving into specifications, it helps to decode the part number:

The “G” in FGG is Xilinx’s designation for lead-free (Pb-free) packaging, making this variant RoHS-compliant and suitable for modern eco-conscious manufacturing and export regulations.

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XC2S200-6FGG1079C Key Specifications at a Glance

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XC2S200-6FGG1079C Detailed Features

High-Density Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1079C is built around a 28 × 42 array of Configurable Logic Blocks, totaling 1,176 CLBs. Each CLB contains four logic cells, and each logic cell includes a 4-input function generator (LUT), a carry chain, and a storage element (flip-flop). This architecture makes the device exceptionally efficient for implementing complex combinational and sequential logic without wasting resources.

Maximum I/O Flexibility with 284 User I/O Pins

With up to 284 programmable user I/O pins, the XC2S200-6FGG1079C is ideal for applications that require a large number of external interfaces. Each I/O pin supports multiple standards including LVTTL, LVCMOS, PCI, GTL, HSTL, and more, giving designers broad compatibility with external peripherals, memory devices, and communication buses. Note that this I/O count does not include the four dedicated global clock/user input pins.

On-Chip Memory: Distributed RAM and Block RAM

The dual-port Block RAM can be configured as either synchronous or asynchronous memory and supports independent read and write clocks — critical for FIFO buffers, look-up tables, and data storage in high-speed designs. Distributed RAM is derived from the LUT fabric and is ideal for small, fast, local storage.

Four Delay-Locked Loops (DLLs) for Clock Management

The XC2S200-6FGG1079C integrates four Delay-Locked Loops (DLLs), one at each corner of the die. The DLLs are used for:

• Zero-delay clock buffering — eliminates clock skew
• Clock phase shifting — generate 90°, 180°, and 270° phase offsets
• Frequency synthesis — multiply or divide input clock frequencies
• Clock edge alignment — synchronize internal and external clocks

This makes the device well-suited for synchronous designs operating at or near the 200 MHz system speed boundary.

Speed Grade -6: The Fastest Spartan-II Variant

The -6 speed grade is the fastest available in the Spartan-II family, and it is exclusively offered in the commercial temperature range (0°C to +85°C). Designers building latency-sensitive systems — such as real-time video processing, high-frequency data acquisition, or fast bus interfaces — will benefit from the reduced propagation delays this speed grade delivers.

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Spartan-II Family Comparison: Where XC2S200 Stands

The XC2S200 is the largest and highest-capacity device in the Spartan-II family, making it the preferred choice for designers who need maximum gate density while remaining within the Spartan-II ecosystem.

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Why Choose the XC2S200-6FGG1079C Over a Mask-Programmed ASIC?

The Spartan-II FPGA family, including the XC2S200-6FGG1079C, was designed as a superior alternative to mask-programmed ASICs. Here is why:

The FPGA’s programmability allows design upgrades in the field with no hardware replacement, a capability that is simply impossible with traditional ASICs.

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XC2S200-6FGG1079C Package Details: 1079-Ball FGG BGA

The FGG1079 (Fine Pitch BGA, 1079 balls) package offers a dense, compact footprint suited for space-constrained PCB designs. Key package attributes include:

The lead-free designation is critical for manufacturers who must comply with the European Union’s RoHS Directive and similar global environmental regulations.

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Supported I/O Standards

The XC2S200-6FGG1079C I/O blocks (IOBs) support a comprehensive range of interface standards:

This I/O versatility ensures seamless integration with a wide range of external devices, from DDR SDRAM and processors to PLDs and custom logic.

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Typical Applications for the XC2S200-6FGG1079C

The XC2S200-6FGG1079C is widely used in the following application domains:

• Digital Signal Processing (DSP) — filters, FFTs, and signal conditioning
• Embedded System Logic — glue logic, bus bridging, and memory controllers
• Communications Equipment — protocol conversion, framing, and buffering
• Industrial Control — motor control, sensor interfaces, and state machines
• Test & Measurement — data acquisition, signal generation, and pattern recognition
• Automotive Electronics — (with proper qualification; commercial temperature range)
• Consumer Electronics — set-top boxes, displays, and multimedia processing
• Prototyping and Emulation — rapid ASIC prototyping and SOC emulation

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Configuration and Programming

Spartan-II FPGAs, including the XC2S200-6FGG1079C, support multiple configuration modes:

The device is compatible with Xilinx ISE Design Suite for synthesis, place-and-route, and bitstream generation. VHDL, Verilog, and mixed-language designs are fully supported.

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Design Tool Compatibility

Note: While newer AMD/Xilinx tools such as Vivado do not natively support Spartan-II devices, the legacy ISE 14.7 is freely available and fully supports the XC2S200 family. ISE 14.7 runs on Windows 7 and Linux environments.

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Ordering Information and Part Number Variants

The XC2S200-6FGG1079C stands out as the fastest (-6) and most highly integrated (1,079-ball) Pb-free commercial package in the XC2S200 lineup — ideal when maximum pin availability and RoHS compliance are both required.

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Frequently Asked Questions (FAQ)

What does the -6 speed grade mean for XC2S200-6FGG1079C?

The -6 speed grade is the fastest available in the Spartan-II family. It indicates reduced propagation delays across the device’s logic fabric, routing, and I/O buffers. The -6 grade is exclusively available in the commercial temperature range (0°C to +85°C), so it is not offered in industrial variants.

Is the XC2S200-6FGG1079C RoHS compliant?

Yes. The “G” in FGG designates a lead-free (Pb-free) package, making this part fully RoHS-compliant and suitable for designs targeting European and global environmental compliance standards.

What software is used to program the XC2S200-6FGG1079C?

The recommended tool is Xilinx ISE Design Suite 14.7, which is the last version to support Spartan-II devices. It is freely available for download and supports VHDL, Verilog, and constraint-based timing analysis.

What is the core voltage of the XC2S200-6FGG1079C?

The core voltage is 2.5V. I/O banks can be driven at different voltage levels (3.3V, 2.5V, etc.) depending on the selected I/O standard.

Can the XC2S200-6FGG1079C be used as an ASIC replacement?

Absolutely. The Spartan-II family was designed specifically as a cost-effective alternative to mask-programmed ASICs, eliminating the high NRE costs, long lead times, and design risks associated with ASIC development.

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Summary: Is the XC2S200-6FGG1079C Right for Your Design?

The XC2S200-6FGG1079C is an excellent choice for engineers and procurement teams who need:

• The highest gate density in the Spartan-II family (200K gates, 5,292 cells)
• The fastest speed grade available (-6) for time-critical logic paths
• A high pin-count, Pb-free BGA package (1,079 balls) for maximum I/O connectivity
• RoHS compliance for regulatory requirements
• Low-cost FPGA programmability as an ASIC alternative
• Proven support from the Xilinx ISE ecosystem

For engineers looking to explore the full Xilinx FPGA product portfolio — from Spartan-II through to the latest AMD adaptive SoCs — visit our complete Xilinx FPGA resource page for datasheets, alternative part recommendations, and design support.