The XC2S200-6FGG1077C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for high-volume commercial applications, this device combines 200,000 logic gates with a large 1077-pin Fine-Pitch Ball Grid Array (FBGA) package and a -6 commercial speed grade. Whether you are building embedded systems, communications hardware, or digital signal processing circuits, the XC2S200-6FGG1077C delivers the flexibility and reliability engineers demand.

For a broader selection of compatible programmable logic devices, explore our full range of Xilinx FPGA solutions.

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What Is the XC2S200-6FGG1077C? – Product Overview

The XC2S200-6FGG1077C belongs to the Xilinx Spartan-II FPGA family, a 2.5V programmable logic platform fabricated using Xilinx’s advanced 0.18-micron, six-layer metal CMOS process. The “XC2S200” designates the die variant with 200,000 system gates and 5,292 logic cells. The “-6” suffix identifies the commercial speed grade, and “FGG1077” specifies the 1077-ball Fine-Pitch BGA package optimized for high I/O density applications.

This device is a direct, programmable alternative to mask-programmed ASICs — offering rapid design cycles, field upgradability, and significant NRE cost savings.

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XC2S200-6FGG1077C Key Specifications at a Glance

General Electrical & Logic Specifications

Package & Physical Specifications

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Detailed Architecture of the XC2S200-6FGG1077C

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1077C contains 1,176 CLBs arranged in a 28-row by 42-column symmetrical array. Each CLB consists of two slices, and each slice contains:

• Two 4-input Look-Up Tables (LUTs)
• Two edge-triggered D flip-flops
• Fast carry and arithmetic logic

This architecture enables highly efficient implementation of both combinatorial and sequential digital logic, making the XC2S200-6FGG1077C suitable for complex finite state machines, arithmetic units, and pipelined data paths.

Block RAM – Dual-Port Memory Architecture

The XC2S200-6FGG1077C integrates 56K bits of on-chip block RAM, distributed across 14 independent dual-port memory blocks. Each block RAM cell provides:

• 4,096 bits of fully synchronous storage
• Independent control signals for each port
• Configurable data width for each port independently
• Support for true dual-port access patterns

Block RAM columns are located along the vertical edges of the die, flanked by CLBs and IOBs, ensuring minimal routing delays for memory-intensive designs.

Input/Output Blocks (IOBs) & I/O Standards

The XC2S200-6FGG1077C provides up to 284 user I/O pins (excluding four dedicated global clock inputs). Each IOB supports multiple industry-standard signaling levels, including:

Each IOB includes programmable input delay, optional output flip-flops, and 3-state control, making the XC2S200-6FGG1077C highly compatible with modern memory interfaces and high-speed buses.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops are placed at each corner of the die. The DLLs provide:

• Zero-propagation-delay global clock distribution
• Clock phase shifting and skew elimination
• Clock multiplication and division
• Board-level clock deskewing (via external feedback)

This makes the XC2S200-6FGG1077C ideal for clock-sensitive designs in communications, imaging, and data acquisition systems.

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XC2S200-6FGG1077C Configuration Modes

The XC2S200-6FGG1077C supports four standard FPGA configuration modes, selected via the M0, M1, and M2 mode pins.

Note: All I/O drivers remain in a high-impedance state during power-on and throughout configuration. The total configuration bitstream size for the XC2S200 is 1,335,840 bits.

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Performance Characteristics – Speed Grade -6 Explained

The -6 speed grade is the fastest commercially available variant in the Spartan-II XC2S200 lineup. Key performance benchmarks include:

The -6 speed grade is exclusively offered in the commercial temperature range, making the XC2S200-6FGG1077C the go-to choice for rack-mounted equipment, industrial controllers, and consumer electronics requiring maximum throughput.

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Why Choose the XC2S200-6FGG1077C Over Mask-Programmed ASICs?

The XC2S200-6FGG1077C offers compelling advantages over traditional ASIC designs:

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Boundary Scan & IEEE 1149.1 JTAG Support

The XC2S200-6FGG1077C fully supports IEEE Standard 1149.1 (JTAG) Boundary-Scan, enabling:

• In-system programming via standard JTAG chains
• Board-level interconnect testing
• Readback of configuration data for verification
• Internal scan chains via the User Register (providing Reset, Update, and Shift outputs)

This makes it straightforward to integrate the XC2S200-6FGG1077C into automated test environments and production programming fixtures.

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Common Applications for the XC2S200-6FGG1077C

The XC2S200-6FGG1077C is widely used across multiple industries and applications:

#### Communications & Networking

• Line-card interface logic
• Protocol bridging (UART, SPI, I²C, PCI)
• High-speed serial-to-parallel conversion

#### Digital Signal Processing (DSP)

• FIR and IIR filter implementations
• FFT engines
• Image and video processing pipelines

#### Embedded Systems & SoC Design

• Custom peripheral controllers
• Memory management units
• Glue logic replacement for multi-chip designs

#### Industrial & Test Equipment

• Motor control and encoder interfaces
• Data acquisition front-ends
• Automated test equipment (ATE) logic

#### Aerospace & Defense (Development/Prototyping)

• Rapid prototyping of mission-critical control logic
• Interface standard conversion
• Reconfigurable computing platforms

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Ordering Information & Part Number Decoder

Understanding the XC2S200-6FGG1077C part number is essential for procurement and cross-referencing:

Related Part Numbers in the Spartan-II XC2S200 Family

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Development Tools & Software Support

The XC2S200-6FGG1077C is supported by Xilinx’s suite of EDA tools:

• Xilinx ISE Design Suite – The primary design environment for Spartan-II devices, supporting VHDL and Verilog synthesis, place & route, and timing analysis.
• ModelSim / XSIM – RTL and gate-level simulation.
• JTAG programming via Xilinx iMPACT – For bitstream download and readback.
• Third-party EDA tools – Synopsys Synplify, Mentor Graphics Precision, Cadence Encounter, and others support XC2S200 device targets.

Configuration without a dedicated PROM is also supported, allowing bitstream storage on standard FLASH cards, hard drives, or any nonvolatile memory available on the host board.

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Frequently Asked Questions (FAQ)

Q: What is the maximum operating frequency of the XC2S200-6FGG1077C? A: With the -6 speed grade, the XC2S200-6FGG1077C achieves a maximum system clock frequency of 263 MHz, making it one of the fastest variants in the Spartan-II family.

Q: Is the XC2S200-6FGG1077C RoHS compliant? A: The standard XC2S200-6FGG1077C is not RoHS compliant. Xilinx does offer Pb-free packaging variants, which include a “G” character in the ordering code (e.g., XC2S200-6FGG1077GC).

Q: Can the XC2S200-6FGG1077C operate in industrial temperature ranges? A: The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature range (-40°C to +85°C), an alternative speed grade such as -5I would be required.

Q: How many block RAM bits does the XC2S200-6FGG1077C provide? A: The device provides 56K bits (56,000 bits) of block RAM across 14 independent, synchronous dual-port memory blocks.

Q: What configuration modes are supported? A: The XC2S200-6FGG1077C supports Master Serial, Slave Serial, Slave Parallel (SelectMAP), and JTAG Boundary-Scan configuration modes.

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Conclusion – Is the XC2S200-6FGG1077C Right for Your Design?

The XC2S200-6FGG1077C remains a capable, versatile FPGA solution for engineers who need a proven 200K-gate programmable device in a high-density 1077-pin FBGA package. Its combination of a 263 MHz maximum clock, 56K bits of block RAM, 284 user I/Os, four DLLs, and full JTAG support makes it well-suited for communications, DSP, embedded control, and rapid ASIC prototyping applications.

Its programmable, reconfigurable nature eliminates ASIC NRE costs and dramatically shortens design cycles, offering a cost-effective path from prototype to production.