The XC2S200-6FGG1075C is a high-density, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family. Engineered on a 0.18µm process technology with a 2.5V core supply, it delivers 200,000 system gates, up to 263 MHz performance, and an expansive 1075-pin Fine-Pitch Ball Grid Array (FGG) package — making it one of the most capable Spartan-II devices for commercial-grade embedded and digital design applications.

Whether you’re developing telecom infrastructure, industrial control systems, or high-volume consumer electronics, the XC2S200-6FGG1075C offers the programmability, density, and speed-grade performance your project demands.

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What Is the XC2S200-6FGG1075C? Understanding the Part Number

Before diving into technical specifications, it helps to decode the part number:

This part is a commercial-temperature, speed-grade -6 variant housed in a 1075-ball FBGA package — ideal for high-speed, density-critical PCB designs.

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XC2S200-6FGG1075C Key Specifications at a Glance

Core Architecture Specifications

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XC2S200-6FGG1075C Architecture Deep Dive

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This translates into significant combinational and sequential logic density — capable of implementing complex FSMs, data paths, and arithmetic functions with high resource efficiency.

Block RAM – Dual-Port Synchronous Memory

One of the XC2S200’s standout features is its 14 blocks of 4,096-bit dual-port synchronous RAM, totalling 56K bits of on-chip storage. Key characteristics include:

• Fully synchronous operation on both ports independently
• Configurable data width on each port (independently configurable)
• Ideal for FIFOs, look-up tables, buffers, and embedded memory applications
• Each block is 4 CLBs high and arranged in two vertical columns at each edge of the die

Input/Output Blocks (IOBs) and User I/O

The XC2S200-6FGG1075C provides 284 user I/O pins (excluding the 4 global clock/user input pins). The IOBs support:

• Programmable input/output signal standards
• 3-state output control
• Input delay and output slew-rate control
• Boundary-scan JTAG (IEEE 1149.1) support for in-system testing

Delay-Locked Loops (DLLs)

Four DLLs — one at each corner of the die — enable advanced clock management capabilities:

• Clock deskewing across the device
• Frequency synthesis (multiply and divide)
• Clock mirroring for board-level clock synchronization across multiple devices
• Phase-shift control for timing-critical designs

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Configuration Modes for XC2S200-6FGG1075C

The XC2S200 supports multiple configuration modes to suit different system architectures:

Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state. Unused I/Os remain tri-stated after configuration completes.

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Why Choose the XC2S200-6FGG1075C? Top Benefits

#### 1. Fastest Commercial Speed Grade

The -6 speed grade is the highest available in the Spartan-II commercial range, delivering up to 263 MHz maximum operation. This makes the XC2S200-6FGG1075C the go-to choice when timing closure is critical.

#### 2. Superior Alternative to Mask-Programmed ASICs

Like all Spartan-II devices, the XC2S200-6FGG1075C eliminates the costly NRE (Non-Recurring Engineering) fees associated with ASICs. There’s no lengthy tape-out cycle, and the field-programmable nature means hardware upgrades without board replacement — a key advantage in fast-moving product cycles.

#### 3. High Pin Count in Compact BGA Footprint

The FGG1075 package provides 1,075 pins in a fine-pitch ball grid array, enabling maximum connectivity in complex multi-chip designs while maintaining a compact PCB footprint compared to QFP alternatives.

#### 4. Proven 0.18µm Process Node Reliability

Built on a mature and stable 0.18µm silicon process, the XC2S200-6FGG1075C offers predictable electrical characteristics and long-term supply reliability — an important consideration for industrial and defense-adjacent commercial applications.

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XC2S200-6FGG1075C vs Other XC2S200 Package Variants

The FGG1075 package stands apart by offering the highest pin count in the XC2S200 lineup, giving designers maximum I/O flexibility for complex system integrations.

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Typical Applications for XC2S200-6FGG1075C

The XC2S200-6FGG1075C is widely deployed across industries that require high-speed, configurable logic with substantial I/O bandwidth:

• Telecommunications: Protocol bridging, line-card control, framing logic
• Industrial Automation: Motor drive control, PLC co-processing, real-time signal conditioning
• Embedded Systems: Custom co-processors, peripheral interface expansion, glue logic replacement
• Test & Measurement Equipment: High-speed data capture, pattern generation, signal routing
• Consumer Electronics: Display controllers, high-bandwidth data interfaces
• Networking: Packet processing, switching fabric assist, MAC layer acceleration

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Design Tools & Programming Support

Xilinx Spartan-II devices including the XC2S200-6FGG1075C are fully supported by:

• Xilinx ISE Design Suite – Primary legacy tool for Spartan-II synthesis, implementation, and bitstream generation
• JTAG In-System Programming – Via standard IEEE 1149.1 boundary-scan interface
• ModelSim / Active-HDL – For VHDL/Verilog simulation
• ChipScope Pro – For in-system logic analysis and debugging

For broader Xilinx FPGA design resources and related parts, visit Xilinx FPGA for an extensive selection of Xilinx FPGAs and expert sourcing support.

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Ordering Information & Compliance

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1075C used for?

The XC2S200-6FGG1075C is a Spartan-II FPGA used in applications requiring reprogrammable logic, including telecom, industrial control, test equipment, networking, and embedded system design.

What does the “-6” speed grade mean on the XC2S200?

The -6 speed grade is the fastest available commercial grade for the XC2S200, supporting system frequencies up to 263 MHz. It is exclusively available in the commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1075C RoHS compliant?

The standard “C” suffix part is not RoHS compliant. The lead-free, RoHS-compliant equivalent is the XC2S200-6FGG1075GC, which includes a “G” in the ordering code denoting Pb-free packaging.

What software do I need to program the XC2S200-6FGG1075C?

The recommended design software is Xilinx ISE Design Suite (legacy tool), available from AMD/Xilinx. JTAG-based in-system configuration is supported via the standard 1149.1 boundary-scan interface.

What is the difference between FGG and FG packages in Xilinx part numbers?

Both are Fine-Pitch Ball Grid Array (FBGA) packages. FGG generally denotes a larger, higher-pin-count variant compared to the standard FG designation — in this case, the FGG1075 provides 1,075 pins vs. 256 or 456 in smaller FG packages.

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Conclusion

The XC2S200-6FGG1075C is an exceptionally capable Spartan-II FPGA that combines 200K system gates, 263 MHz performance at speed grade -6, 284 user I/O pins, and on-chip dual-port block RAM in a high-density 1075-pin FBGA package. It remains a trusted solution for engineers who need field-programmable logic density, fast clock speeds, and a rich I/O count in commercial-temperature environments — all without the cost and rigidity of ASIC alternatives.

For sourcing, datasheets, and related Xilinx products, visit Xilinx FPGA.