The XC2S200-6FGG1074C is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device delivers 200,000 system gates, 5,292 logic cells, and a 1074-ball Fine-Pitch BGA (FBGA) package — making it one of the most capable options in the Spartan-II lineup. Whether you’re designing communications hardware, embedded control systems, or digital signal processing solutions, the XC2S200-6FGG1074C offers the performance and flexibility your project demands.

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What Is the XC2S200-6FGG1074C?

The XC2S200-6FGG1074C is a 2.5V Spartan-II FPGA manufactured by Xilinx (now AMD). It belongs to the XC2S200 device family — the largest member of the Spartan-II series — and comes in the lead-free (Pb-free) FGG1074 package with 1074 pins. The “-6” suffix denotes its speed grade, available exclusively in the Commercial temperature range (0°C to +85°C).

This device is a proven alternative to mask-programmed ASICs, eliminating the high upfront costs and long development cycles associated with custom silicon. Its in-field reprogrammability enables design iteration and upgrades without any hardware replacement.

For a broader overview of the product family, visit Xilinx FPGA resources to explore related devices and selection guides.

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XC2S200-6FGG1074C Part Number Decoder

Understanding the part number helps engineers confirm they’re ordering the correct component.

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Key Specifications of the XC2S200-6FGG1074C

Core Logic Resources

Electrical & Physical Characteristics

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XC2S200-6FGG1074C Key Features

High-Density Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1074C contains 1,176 CLBs arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice contains two 4-input Look-Up Tables (LUTs) and two flip-flops. This architecture supports efficient implementation of combinatorial and sequential logic — from simple state machines to complex arithmetic pipelines.

Distributed and Block RAM Architecture

The device provides 75,264 bits of distributed RAM embedded within the CLB array and 56K bits of dedicated block RAM arranged in two columns on either side of the CLB matrix. Block RAM supports true dual-port operation, enabling simultaneous read/write access from two independent clock domains.

Four Delay-Locked Loops (DLLs)

Four on-chip DLLs — one at each corner of the die — provide precise clock management. They support zero-delay buffering, frequency synthesis, and phase shifting, essential for high-speed synchronous system design.

Flexible Input/Output Blocks (IOBs)

With up to 284 user I/O pins (plus 4 dedicated global clock inputs), the XC2S200-6FGG1074C supports multiple I/O standards including LVTTL, LVCMOS2, PCI, GTL, SSTL, HSTL, and CTT. Each IOB includes programmable slew rate control and optional pull-up/pull-down resistors.

JTAG Boundary Scan Support

The device is fully IEEE 1149.1 JTAG compliant, supporting in-circuit testing, in-system programming (ISP), and functional board-level debug — simplifying manufacturing test and verification workflows.

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XC2S200-6FGG1074C vs. Other Spartan-II Family Members

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the most logic resources, the highest I/O count, and the largest memory capacity.

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Speed Grade Comparison: XC2S200 Options

The -6 speed grade (as in the XC2S200-6FGG1074C) provides the fastest propagation delays and highest clock frequencies, making it ideal for performance-critical designs operating in controlled commercial environments.

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Typical Applications of the XC2S200-6FGG1074C

The XC2S200-6FGG1074C FPGA is widely used across a range of industries and application domains:

Digital Signal Processing (DSP)

Its large CLB array and distributed RAM make it well-suited for FIR/IIR filters, FFT engines, and custom DSP datapaths where both logic density and memory bandwidth matter.

Communications and Networking

The flexible IOB architecture supports multiple high-speed I/O standards needed in serial communication interfaces, Ethernet framing logic, and protocol bridging applications.

Embedded Control Systems

With its rich logic resources and JTAG programmability, this FPGA is commonly used in motor control, industrial automation, and embedded processing applications where in-field updates are a requirement.

Prototyping and ASIC Replacement

The XC2S200-6FGG1074C is a cost-effective ASIC replacement, enabling full-chip prototyping before committing to expensive mask sets — saving time and development budget.

Medical and Test Equipment

Its high I/O density and block RAM capacity support data acquisition systems, image processing pipelines, and test & measurement instruments.

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Programming and Development Tools

Supported Design Tools

The XC2S200-6FGG1074C is compatible with Xilinx ISE Design Suite, which supports VHDL, Verilog, and schematic-based design entry. Note that this device is not supported by Vivado — ISE is the appropriate toolchain for all Spartan-II designs.

Configuration Modes

The XC2S200-6FGG1074C supports multiple configuration modes including:

• Master Serial (using Xilinx XCF PROMs)
• Slave Serial
• Slave Parallel (SelectMAP)
• JTAG (Boundary Scan)

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Ordering Information and Package Options for XC2S200

The FGG1074 package (as in the XC2S200-6FGG1074C) provides the maximum available I/O count, making it the preferred choice for designs requiring a high number of external connections.

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Why Choose the XC2S200-6FGG1074C Over Alternatives?

Advantages Over Smaller Spartan-II Devices

• Maximum logic density in the Spartan-II family
• Largest I/O count (284 user I/O pins) for interface-heavy designs
• Most distributed and block RAM for memory-intensive applications

Advantages Over ASICs

• No NRE (Non-Recurring Engineering) costs
• In-field reprogrammability — update functionality without hardware changes
• Faster time-to-market — eliminate mask fabrication lead times
• Lower risk for low-to-medium volume production

Considerations

• Power consumption is higher than dedicated ASICs at volume
• Performance ceiling below modern Xilinx 7-Series or UltraScale FPGAs
• ISE toolchain required (not Vivado-compatible)
• Pb-Free (FGG) variant ensures RoHS compliance for global market access

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Frequently Asked Questions (FAQ)

What does “6FGG1074C” mean in the part number XC2S200-6FGG1074C?

The “-6” indicates the speed grade (fastest available for Spartan-II Commercial devices). “FGG” denotes a lead-free Fine-Pitch Ball Grid Array package. “1074” is the total ball count, and “C” specifies the Commercial temperature range (0°C to +85°C).

Is the XC2S200-6FGG1074C RoHS compliant?

Yes. The “G” in “FGG” indicates a Pb-Free (lead-free) package, confirming RoHS compliance for the XC2S200-6FGG1074C.

What design software is compatible with XC2S200-6FGG1074C?

The XC2S200-6FGG1074C is supported by Xilinx ISE Design Suite. It is not compatible with the newer Vivado Design Suite, which supports only 7-Series and newer devices.

How does the XC2S200-6FGG1074C compare to Spartan-3 devices?

The Spartan-3 family (e.g., XC3S200) offers improved logic density, lower power, and Vivado compatibility compared to Spartan-II. However, the XC2S200-6FGG1074C remains in use for legacy system maintenance and replacement.

Can the XC2S200-6FGG1074C be reconfigured in-system?

Yes. Using JTAG or SelectMAP configuration modes, the XC2S200-6FGG1074C can be reconfigured in-system without removing it from the board.

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Summary

The XC2S200-6FGG1074C is Xilinx’s largest and highest-performance Spartan-II FPGA device, delivering 200K system gates, 5,292 logic cells, 284 user I/O pins, and 56K bits of block RAM in a lead-free 1074-ball Fine-Pitch BGA package. Its -6 speed grade ensures maximum timing performance for Commercial-temperature applications. From digital signal processing to communications, embedded control, and ASIC prototyping, this device remains a reliable, proven choice for engineers seeking programmable logic with high I/O density and robust memory resources.

For more information on the broader Xilinx programmable logic ecosystem, explore Xilinx FPGA options available for your next design.