The XC2S200-6FGG1071C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Built on 0.18µm CMOS process technology and operating at a 2.5V core voltage, this device delivers up to 200,000 system gates, making it an ideal solution for high-volume embedded applications, digital signal processing, and prototyping workloads. Whether you are an electronics engineer, procurement specialist, or hardware designer, this guide covers everything you need to know about the XC2S200-6FGG1071C — from core architecture to ordering information.

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What Is the XC2S200-6FGG1071C?

The XC2S200-6FGG1071C is a member of the Xilinx Spartan-II FPGA family, a product line engineered as a cost-effective, high-performance alternative to mask-programmed ASICs. The part number breaks down as follows:

Unlike traditional ASICs, the XC2S200-6FGG1071C eliminates costly development cycles and allows in-field design updates without any hardware replacement — a critical advantage in rapidly evolving product environments.

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XC2S200-6FGG1071C Key Specifications at a Glance

The table below summarizes the most important technical specifications of the XC2S200-6FGG1071C:

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XC2S200-6FGG1071C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1071C features a 28 × 42 matrix of Configurable Logic Blocks (CLBs), totaling 1,176 CLBs. Each CLB contains Look-Up Tables (LUTs), flip-flops, and carry logic, providing a flexible and efficient fabric for implementing complex digital functions. The CLB architecture supports both combinational and registered logic, making the XC2S200-6FGG1071C equally capable in data-path and control-plane designs.

Input/Output Blocks (IOBs)

Surrounding the CLB core is a perimeter of programmable Input/Output Blocks (IOBs). The XC2S200 supports up to 284 user I/O pins, each individually configurable for input, output, or bidirectional operation. IOBs support a range of I/O standards, offering the design flexibility needed for interfacing with diverse peripherals and bus architectures.

Block RAM

The XC2S200-6FGG1071C integrates 56 Kbits of on-chip block RAM arranged in two vertical columns on opposite sides of the die. Each block RAM is a fully synchronous, dual-ported 4096-bit RAM with independent control signals per port. Data width on both ports is independently configurable, enabling built-in support for multi-width memory interfaces.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide robust clock management capabilities. DLLs eliminate clock skew, support clock multiplication and division, and can operate as clock mirrors to synchronize board-level clocks across multiple Spartan-II devices.

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Speed Grade -6: Performance Advantages

The -6 speed grade is the fastest commercially available grade for the Spartan-II family and is exclusively available for the commercial temperature range. The table below compares performance characteristics across speed grades:

Choosing the -6 speed grade ensures maximum timing margin in high-speed designs, including fast DSP pipelines, high-bandwidth memory controllers, and multi-protocol communication interfaces.

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FGG Package: Fine-Pitch Ball Grid Array

The FGG (Fine-Pitch Ball Grid Array) package of the XC2S200-6FGG1071C is designed for space-constrained, high-density PCB layouts. Key advantages of the FGG package include:

The 1071-pin configuration provides an abundance of I/O connectivity, making it suitable for complex SoC-level system integration where a large number of external signals must be routed to and from the FPGA fabric.

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Configuration Modes

The XC2S200-6FGG1071C supports multiple configuration modes, enabling flexible system integration:

During power-on and throughout the configuration process, all I/O drivers remain in a high-impedance state, protecting connected components from drive conflicts. After configuration, unused I/Os also remain in high-impedance unless explicitly assigned in the bitstream.

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Key Features of the XC2S200-6FGG1071C

• 200,000 system gates — ample logic capacity for complex embedded designs
• 5,292 logic cells in a structured 28 × 42 CLB array
• 75,264 flip-flops for high-register-density pipelining
• 56 Kbits block RAM with dual-port, independently configurable width
• 4 on-chip DLLs for zero-skew clock distribution and frequency synthesis
• Speed Grade -6 — the fastest available commercial Spartan-II option
• 2.5V core supply for low-power operation
• 0.18µm process for compact die size and proven manufacturing yield
• JTAG Boundary Scan support for board-level testing and in-system programming
• Superior ASIC replacement — field-upgradable logic without hardware changes

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Applications of the XC2S200-6FGG1071C

The XC2S200-6FGG1071C is widely deployed across a broad range of industries and applications:

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XC2S200-6FGG1071C vs. Other Spartan-II Variants

Understanding how the XC2S200-6FGG1071C compares to other members of the Spartan-II family helps in selecting the right device for your design:

The XC2S200 is the largest and most capable device in the Spartan-II family, offering the greatest logic density, I/O count, and on-chip memory — making the XC2S200-6FGG1071C the premium choice when maximum resources are required.

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Design Tools and Support

The XC2S200-6FGG1071C is supported by Xilinx’s comprehensive design toolchain:

• ISE Design Suite — The primary legacy design environment for Spartan-II devices, including synthesis, place-and-route, simulation, and bitstream generation.
• ModelSim / XSim — For RTL and gate-level simulation to verify design functionality.
• ChipScope Pro — For on-chip debug and signal capture during hardware bring-up.
• JTAG Programming Cable — For in-system configuration via the Boundary-Scan interface.

Designers new to Xilinx FPGAs can explore the full range of Xilinx FPGA devices and development resources to find the right platform for their project requirements.

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Ordering Information

When ordering the XC2S200-6FGG1071C, verify the following part number components to ensure you receive the correct device configuration:

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Frequently Asked Questions (FAQ)

What is the XC2S200-6FGG1071C used for?

The XC2S200-6FGG1071C is used in embedded systems, digital signal processing, telecommunications, industrial automation, and ASIC prototyping. Its 200K gate capacity and 284 I/O pins make it suitable for complex digital designs.

What is the core voltage of the XC2S200-6FGG1071C?

The XC2S200-6FGG1071C operates at a 2.5V core supply voltage, with I/O voltages configurable to interface with 3.3V and other standard logic levels.

Is the XC2S200-6FGG1071C still in production?

The Spartan-II family is a mature product line. Availability may be subject to last-time-buy restrictions. Contact your authorized Xilinx (AMD) distributor to confirm current inventory and lead times.

What programming software does the XC2S200-6FGG1071C require?

The XC2S200-6FGG1071C is programmed using the Xilinx ISE Design Suite. Hardware configuration is performed via the JTAG interface or serial/parallel configuration modes.

What is the maximum operating frequency of the XC2S200-6FGG1071C?

With speed grade -6, the XC2S200-6FGG1071C supports internal clock frequencies up to approximately 263 MHz under commercial temperature conditions.

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Summary

The XC2S200-6FGG1071C is a powerful, proven, and versatile FPGA that offers the highest logic density in the Spartan-II product family. With 200,000 system gates, 5,292 logic cells, 284 user I/O pins, 56 Kbits of dual-port block RAM, and the fastest -6 speed grade, this device is well-suited for demanding embedded and signal processing applications. Its fine-pitch BGA packaging and 2.5V operation deliver the performance and board-level integration engineers need. For a broader selection of programmable logic devices, explore the complete range of Xilinx FPGA solutions available today.