The XC2S200-6FGG1070C is a high-performance, cost-optimized Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a robust 1070-ball Fine Pitch BGA (Pb-free) package, this device delivers outstanding programmable logic capability for commercial-grade embedded applications. Whether you are designing communication systems, industrial controllers, or digital signal processing modules, the XC2S200-6FGG1070C provides the logic density, speed, and I/O flexibility your project demands.
What Is the XC2S200-6FGG1070C?
The XC2S200-6FGG1070C is part of Xilinx’s Spartan-II FPGA product line, built on a proven 0.18-micron process technology with a 2.5V core supply voltage. The part number breaks down as follows:
| Part Number Segment |
Meaning |
| XC2S200 |
Spartan-II family, 200K system gate device |
| -6 |
Speed grade -6 (fastest available for commercial range) |
| FGG |
Fine Pitch Ball Grid Array, Pb-free (RoHS-compliant) |
| 1070 |
1070 solder ball package |
| C |
Commercial temperature range (0°C to +85°C) |
XC2S200-6FGG1070C Key Specifications
Core Logic Resources
| Parameter |
Value |
| Logic Cells |
5,292 |
| System Gates (Logic + RAM) |
200,000 |
| CLB Array (Rows × Columns) |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Total Distributed RAM |
75,264 bits |
| Total Block RAM |
56K bits |
Electrical & Physical Characteristics
| Parameter |
Value |
| Process Technology |
0.18µm CMOS |
| Core Supply Voltage (VCCINT) |
2.5V |
| I/O Supply Voltage (VCCO) |
1.8V / 2.5V / 3.3V |
| Maximum System Performance |
200 MHz |
| Speed Grade |
-6 (Commercial) |
| Package Type |
FGG1070 Fine Pitch BGA (Pb-free) |
| Total Package Pins |
1,070 |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliance |
Yes (Pb-free “G” designation) |
Spartan-II Family Comparison: Where Does XC2S200 Fit?
The XC2S200 is the largest and most capable device in the Spartan-II FPGA family, offering the highest logic density and I/O count in its series.
| Device |
Logic Cells |
System Gates |
CLB Array |
Max User I/O |
Distributed RAM |
Block RAM |
| XC2S15 |
432 |
15,000 |
8×12 |
86 |
6,144 bits |
16K |
| XC2S30 |
972 |
30,000 |
12×18 |
92 |
13,824 bits |
24K |
| XC2S50 |
1,728 |
50,000 |
16×24 |
176 |
24,576 bits |
32K |
| XC2S100 |
2,700 |
100,000 |
20×30 |
176 |
38,400 bits |
40K |
| XC2S150 |
3,888 |
150,000 |
24×36 |
260 |
55,296 bits |
48K |
| XC2S200 |
5,292 |
200,000 |
28×42 |
284 |
75,264 bits |
56K |
XC2S200-6FGG1070C Architecture & Key Features
Configurable Logic Blocks (CLBs)
The Spartan-II architecture organizes logic into Configurable Logic Blocks (CLBs), each containing two slices. Each slice includes two 4-input Look-Up Tables (LUTs), storage elements (flip-flops), and carry logic. The XC2S200 provides 1,176 CLBs, supporting everything from simple glue logic to complex state machines and arithmetic pipelines.
Block RAM
The XC2S200 includes 56K bits of dedicated Block RAM organized in two columns on opposite sides of the die. Block RAM is dual-port and can be configured as various width/depth combinations, making it ideal for FIFOs, look-up tables, and on-chip data buffers.
Distributed RAM
Beyond block RAM, the device offers 75,264 bits of distributed RAM embedded within the LUT fabric. This provides fast, single-cycle access memory scattered throughout the logic array — perfect for register files and small data arrays.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops (DLLs) — one at each corner of the die — provide advanced clock management. DLLs eliminate clock distribution delays, enable clock multiplication/division, and support phase shifting, giving designers full control over system timing.
Input/Output Blocks (IOBs)
Up to 284 user I/O pins are available in the FGG1070 package. Each IOB supports multiple programmable I/O standards including:
| I/O Standard |
Description |
| LVTTL |
Low-Voltage TTL (3.3V) |
| LVCMOS33 / LVCMOS25 / LVCMOS18 |
Low-Voltage CMOS |
| SSTL2 / SSTL3 |
Stub-Series Terminated Logic |
| GTL / GTL+ |
Gunning Transceiver Logic |
| AGP |
Accelerated Graphics Port compatible |
| PCI |
3.3V PCI bus compatible |
XC2S200-6FGG1070C vs. Alternative Packages
The XC2S200 die is available in multiple package options. The FGG1070 Pb-free package provides the maximum number of accessible I/O pins and is the best choice for designs requiring high pin counts and RoHS compliance.
| Package |
Pins |
I/O Availability |
Pb-Free |
Best For |
| PQ208 / PQG208 |
208 |
Limited I/O |
Yes (G variant) |
Simple, compact designs |
| FG256 / FGG256 |
256 |
Moderate |
Yes (G variant) |
Mid-range I/O requirements |
| FG456 / FGG456 |
456 |
High |
Yes (G variant) |
High I/O, larger boards |
| FGG1070 |
1,070 |
Maximum (284 user I/O) |
Yes |
High-density, complex systems |
Applications of the XC2S200-6FGG1070C
The XC2S200-6FGG1070C is a versatile component used across a wide range of industries and application domains:
Communications & Networking
The high I/O count and 200 MHz performance make this FPGA ideal for line-card logic, protocol bridging, packet switching, and serializer/deserializer (SerDes) implementations in telecommunications equipment.
Industrial Automation & Control
With programmable I/O standards and on-chip DLLs, the XC2S200-6FGG1070C supports motor control interfaces, sensor fusion logic, PLC co-processing, and real-time data acquisition systems.
Digital Signal Processing (DSP)
The combination of distributed and block RAM, along with high-speed CLBs, enables efficient implementation of FIR/IIR filters, FFT engines, image processing pipelines, and other compute-intensive DSP workloads.
Embedded Systems
Designers can implement soft-core processors (such as PicoBlaze or MicroBlaze), custom bus interfaces, and peripheral controllers directly in FPGA fabric, reducing BOM cost and board space.
Test & Measurement
The device’s large logic capacity and high pin count make it well-suited for pattern generators, logic analyzers, ATE interface adapters, and protocol compliance testers.
Programming & Design Tools
The XC2S200-6FGG1070C is supported by Xilinx ISE (Integrated Software Environment) design tools. Designers can use:
- ISE Design Suite – Synthesis, implementation, and bitstream generation
- iMPACT – JTAG-based configuration and programming tool
- ChipScope Pro – In-system logic analysis and debugging
- HDL Support – Full VHDL and Verilog design entry
The device supports boundary scan (JTAG IEEE 1149.1) for board-level testing and in-circuit configuration.
Ordering & Part Number Decoder
When ordering, always verify the full part number to ensure you receive the correct speed grade, package, and temperature range.
| Field |
XC2S200-6FGG1070C |
XC2S200-5FGG1070C |
| Family |
Spartan-II |
Spartan-II |
| Gates |
200K |
200K |
| Speed Grade |
-6 (Fastest) |
-5 |
| Package |
FGG1070 (Pb-free BGA) |
FGG1070 (Pb-free BGA) |
| Temperature |
Commercial (0–85°C) |
Commercial (0–85°C) |
The -6 speed grade is only available in the commercial range. For industrial temperature (-40°C to +100°C) requirements, the -5 speed grade in an industrial-rated part should be selected.
Why Choose the XC2S200-6FGG1070C Over an ASIC?
One of the strongest arguments for selecting the XC2S200-6FGG1070C is its advantage over traditional mask-programmed ASICs:
| Comparison Factor |
XC2S200-6FGG1070C (FPGA) |
Mask-Programmed ASIC |
| Non-Recurring Engineering (NRE) Cost |
None |
Very High ($500K–$5M+) |
| Time to First Silicon |
Hours (re-program) |
3–12 months |
| Design Change Flexibility |
In-field reprogrammable |
Impossible without new tape-out |
| Risk on Design Error |
Low (re-program) |
Very High (re-spin required) |
| Production Volume |
Any quantity |
Only cost-effective at high volume |
For low-to-medium production volumes, prototyping, and applications requiring field updates, the XC2S200-6FGG1070C delivers compelling total-cost-of-ownership advantages over equivalent ASICs.
Frequently Asked Questions (FAQ)
What is the XC2S200-6FGG1070C used for?
The XC2S200-6FGG1070C is used in digital design applications requiring programmable logic, including communications, embedded systems, DSP, industrial automation, and test and measurement equipment.
What does the “-6” speed grade mean on the XC2S200?
The -6 speed grade is the fastest available for the XC2S200 device and supports system performance up to 200 MHz. It is exclusively offered in the commercial temperature range (0°C to +85°C).
Is the XC2S200-6FGG1070C RoHS compliant?
Yes. The “G” in FGG1070 indicates a Pb-free (lead-free) package, making this part fully RoHS compliant.
What design software is used with the XC2S200-6FGG1070C?
Xilinx ISE Design Suite is the primary toolchain for the Spartan-II family. Designs are entered in VHDL or Verilog, synthesized, implemented, and programmed via JTAG using iMPACT.
Can the XC2S200-6FGG1070C be reprogrammed in the field?
Yes. As an SRAM-based FPGA, the XC2S200-6FGG1070C supports full in-system reconfiguration, allowing logic updates without hardware replacement.
Where to Buy the XC2S200-6FGG1070C
The XC2S200-6FGG1070C is available through authorized distributors and component sourcing specialists. For a wide selection of Xilinx FPGA products including the Spartan-II family and the latest AMD Xilinx devices, trusted distributors offer both new production stock and qualified excess inventory with full traceability.
Conclusion
The XC2S200-6FGG1070C is the top-tier commercial-grade device in Xilinx’s Spartan-II FPGA family, delivering 200,000 system gates, 5,292 logic cells, 284 user I/O pins, and a robust FGG1070 Pb-free BGA package with the fastest available -6 speed grade. Its flexible architecture — featuring distributed RAM, block RAM, DLLs, and multi-standard IOBs — makes it an excellent solution for a broad range of commercial embedded applications. With zero NRE cost, full in-system reprogrammability, and proven Xilinx ISE toolchain support, the XC2S200-6FGG1070C remains a reliable, field-proven FPGA choice for engineers worldwide.
