What Is the XC2S200-6FGG1069C?

The XC2S200-6FGG1069C is a high-performance, cost-optimized Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. It operates at 2.5V and delivers up to 200,000 system gates, making it an excellent choice for high-volume, cost-sensitive digital design applications. This device is housed in a 1069-pin Fine-pitch Ball Grid Array (FGG BGA) package and carries a -6 speed grade for maximum commercial-grade performance.

Whether you are designing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG1069C provides the logic density, I/O flexibility, and programmable architecture needed to accelerate your product development cycle. For a broader selection of programmable logic devices, explore our full range of Xilinx FPGA solutions.

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XC2S200-6FGG1069C Part Number Breakdown

Understanding the part number helps engineers quickly identify the correct device for their design.

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XC2S200-6FGG1069C Key Specifications

General Electrical Specifications

Memory and Logic Resources

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XC2S200-6FGG1069C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1069C is built around a 28 × 42 array of Configurable Logic Blocks (CLBs). Each CLB contains four logic cells, with each cell consisting of a function generator (LUT), carry logic, and a storage element. This architecture gives designers tremendous flexibility in implementing combinational and sequential logic.

Input/Output Blocks (IOBs)

The device offers 284 user I/O pins, each governed by a dedicated Input/Output Block (IOB). Each IOB supports a wide range of I/O standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, and SSTL, making the XC2S200-6FGG1069C highly compatible with modern interface standards.

Block RAM

The XC2S200-6FGG1069C contains 14 fully synchronous dual-port Block RAM modules, each with a capacity of 4,096 bits. Each port can be independently configured for different data widths, enabling flexible memory architectures for FIFOs, lookup tables, and data buffers.

Delay-Locked Loops (DLLs)

Four on-chip Delay-Locked Loops (DLLs) — one at each corner of the die — provide robust clock management. DLLs eliminate clock distribution delay, support clock frequency synthesis, and enable board-level clock deskewing when the output is looped off-chip and back.

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Configuration Modes for XC2S200-6FGG1069C

The XC2S200-6FGG1069C supports multiple configuration modes, giving designers maximum flexibility for system integration.

Note: During power-on and throughout configuration, all I/O drivers remain in a high-impedance state. After configuration, unused I/Os also remain high-impedance unless otherwise assigned.

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XC2S200-6FGG1069C I/O Standards Supported

The flexible IOB architecture of the XC2S200-6FGG1069C supports a wide range of single-ended and differential I/O standards:

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Key Features and Benefits of the XC2S200-6FGG1069C

#### 1. Superior Alternative to Mask-Programmed ASICs

The XC2S200-6FGG1069C eliminates the high NRE (Non-Recurring Engineering) costs and lengthy development cycles associated with custom ASICs. Because it is fully reprogrammable, design upgrades can be deployed in the field without any hardware replacement — a capability that ASICs simply cannot match.

#### 2. Fastest Commercial Speed Grade (-6)

The -6 speed grade is the highest performance tier available for the Spartan-II commercial temperature range. It ensures minimum propagation delays and maximum operating frequency, which is critical for high-speed data processing and communication applications.

#### 3. High-Density 1069-Pin BGA Package

The FGG1069 BGA package provides a compact, high-density footprint ideal for space-constrained PCB designs. The fine-pitch ball grid array allows more I/O pins without increasing board area, which is a significant advantage in modern electronics miniaturization.

#### 4. On-Chip Clock Management with DLLs

Four integrated DLLs provide zero-delay clock buffering, clock multiplication, clock division, and phase shifting. This reduces the need for external clock management components and improves overall system reliability.

#### 5. Pb-Free Packaging Available

The XC2S200-6FGG1069C is available in standard and RoHS-compliant Pb-free packaging options, supporting global environmental compliance requirements such as EU RoHS and WEEE directives.

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XC2S200-6FGG1069C vs. Other Spartan-II Devices

The XC2S200-6FGG1069C is the highest-density device in the Spartan-II family, offering the most system gates, logic cells, I/O pins, and block RAM.

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Typical Applications of the XC2S200-6FGG1069C

The XC2S200-6FGG1069C is widely used across a broad range of industries and applications:

• Telecommunications: Protocol conversion, signal processing, and line card controllers
• Industrial Automation: Motor control, PLC interfaces, and sensor fusion
• Consumer Electronics: Display controllers, set-top box logic, and USB bridging
• Embedded Systems: Co-processing, custom bus interfaces, and hardware accelerators
• Military & Aerospace (via similar variants): Mission-critical logic and interface management
• Networking: Packet processing, switching fabric, and multi-protocol bridging
• Test & Measurement: Data acquisition front-ends and instrument control logic

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Design Tools for XC2S200-6FGG1069C

#### Xilinx ISE Design Suite

The XC2S200-6FGG1069C is supported by Xilinx’s ISE Design Suite, which includes synthesis, place-and-route, simulation, and programming tools. ISE is the recommended toolchain for all Spartan-II devices.

#### HDL Support

Designers can implement XC2S200-6FGG1069C designs using:

• VHDL — Industry-standard hardware description language
• Verilog — Popular alternative HDL with C-like syntax
• Schematic Entry — For traditional gate-level design entry

#### JTAG Boundary Scan (IEEE 1149.1)

The device includes full JTAG boundary-scan support for in-system programming, board-level testing, and configuration loading without external programming hardware.

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Ordering Information

Tip: When sourcing the XC2S200-6FGG1069C, always verify the manufacturer date code and confirm the component is sourced from authorized or franchised distributors to avoid counterfeit parts.

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Frequently Asked Questions (FAQ)

What does the “-6” speed grade mean on the XC2S200-6FGG1069C?

The -6 speed grade represents the fastest timing performance tier available for the Spartan-II family in the commercial temperature range. A lower speed grade number (e.g., -5) indicates slower timing. The -6 grade ensures the shortest propagation delays and highest achievable operating frequency.

What is the operating voltage of the XC2S200-6FGG1069C?

The XC2S200-6FGG1069C operates with a 2.5V core supply voltage (VCCINT). I/O banks can be independently powered at different voltages to support various I/O standards.

Is the XC2S200-6FGG1069C still in production?

The Spartan-II family, including the XC2S200-6FGG1069C, is classified as a mature/legacy product by AMD (formerly Xilinx). While it may still be available through distributors and excess inventory channels, designers are encouraged to consider newer Spartan families for new designs.

Can the XC2S200-6FGG1069C be used in industrial temperature environments?

The “C” suffix designates the commercial temperature range (0°C to +85°C). For industrial applications requiring -40°C to +85°C operation, an industrial-grade variant (with an “I” suffix) would be required. The -6 speed grade is exclusively available in the commercial temperature range.

What configuration memory does the XC2S200-6FGG1069C require?

The device requires 1,335,840 configuration bits. It can be loaded via a dedicated Xilinx PROM (such as the XCF series), or through Master Serial, Slave Serial, Slave Parallel, or JTAG boundary-scan modes directly from a microcontroller or other host.

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Conclusion

The XC2S200-6FGG1069C is a powerful, field-proven Xilinx Spartan-II FPGA that delivers 200,000 system gates, 284 user I/Os, 56 Kb of block RAM, and four on-chip DLLs — all in a compact 1069-pin FGG BGA package with the fastest commercial speed grade (-6). It remains a highly capable device for embedded, industrial, and communication applications where programmable logic, design flexibility, and cost efficiency are priorities.

For engineers and procurement teams looking for a comprehensive source of Xilinx programmable logic devices, browse the complete catalog of Xilinx FPGA products to find the right device for your next design.