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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG1068C: Xilinx Spartan-II FPGA – Full Specifications & Buyer’s Guide

Product Details

The XC2S200-6FGG1068C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Designed for cost-sensitive, high-volume applications, this device combines powerful programmable logic with a versatile 1068-ball Fine-Pitch BGA (FBGA) package, making it an excellent choice for engineers who need maximum I/O density and design flexibility. Whether you are working on embedded systems, digital signal processing, or industrial control applications, the XC2S200-6FGG1068C delivers reliable performance at the -6 speed grade — the fastest available in the Spartan-II lineup.

For a broader selection of compatible programmable devices, visit our Xilinx FPGA product page.


What Is the XC2S200-6FGG1068C?

The XC2S200-6FGG1068C belongs to Xilinx’s Spartan-II FPGA family, a 2.5V programmable logic platform designed as a cost-effective alternative to mask-programmed ASICs. The part number breaks down as follows:

Code Segment Meaning
XC2S200 Spartan-II device with ~200,000 system gates
-6 Speed grade 6 (fastest available; commercial temp only)
FGG Fine-Pitch Ball Grid Array (FBGA) package, Pb-free
1068 1,068 total ball count
C Commercial temperature range (0°C to +85°C)

This combination gives the XC2S200-6FGG1068C its unique position in the Spartan-II lineup: the largest logic density member, packaged in the highest pin-count BGA housing, and running at maximum speed — all within the commercial temperature envelope.


XC2S200-6FGG1068C Key Specifications

Core Logic Resources

Parameter XC2S200 Value
Logic Cells 5,292
Equivalent System Gates 200,000
CLB Array (Rows × Columns) 28 × 42
Total Configurable Logic Blocks (CLBs) 1,176
Total Distributed RAM Bits 75,264 bits
Total Block RAM Bits 56K bits
Block RAM Columns 2

I/O and Package Details

Parameter Value
Maximum User I/O Pins 284
Package Type FBGA (Fine-Pitch Ball Grid Array)
Package Designation FGG1068
Total Pin Count 1,068
Supply Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V – 3.3V
Temperature Range Commercial: 0°C to +85°C

Speed and Timing

Parameter Value
Speed Grade -6 (Fastest)
Configuration Bits 1,335,840
Delay-Locked Loops (DLLs) 4 (one per die corner)
Clock Inputs 4 dedicated global clock pins

Note: The -6 speed grade is exclusively available in the Commercial (C) temperature range. Industrial temperature options use lower speed grades.


XC2S200-6FGG1068C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II CLB is the fundamental building block of the XC2S200-6FGG1068C. Each CLB contains two slices, and each slice consists of two 4-input Look-Up Tables (LUTs), dedicated carry logic, and two flip-flops. This architecture enables efficient implementation of both combinatorial and sequential logic, arithmetic functions, and distributed RAM configurations.

Input/Output Blocks (IOBs)

The XC2S200-6FGG1068C features programmable IOBs that support a wide range of single-ended and differential I/O standards. Each IOB includes input and output registers, programmable pull-up and pull-down resistors, and slew-rate control. The device supports LVTTL, LVCMOS33, LVCMOS25, LVCMOS18, and other common standards.

Block RAM

Two vertical columns of block RAM are positioned on opposite sides of the CLB array. Each block RAM tile is a true dual-port memory with configurable data widths. The XC2S200 provides a total of 56K bits of dedicated block RAM — ideal for FIFOs, frame buffers, and on-chip data storage.

Delay-Locked Loops (DLLs)

Four DLLs — one placed at each corner of the die — provide precise clock management. The DLLs allow for clock phase shifting, frequency synthesis (multiply and divide), and duty-cycle correction. This makes the XC2S200-6FGG1068C well-suited for synchronous design across multiple clock domains.


Configuration Modes

The XC2S200-6FGG1068C supports several standard Xilinx configuration modes, selected via the M[0:2] mode pins:

Configuration Mode M2:M1:M0 CCLK Direction Data Width DOUT
Master Serial 0:0:0 Output 1-bit Yes
Slave Parallel 0:1:0 Input 8-bit No
Boundary-Scan (JTAG) 1:0:0 N/A 1-bit No
Slave Serial 1:1:0 Input 1-bit Yes

The device powers up with all I/O drivers in a high-impedance state and remains there throughout the configuration process, protecting connected circuitry from spurious signals.


Spartan-II Family Comparison

Understanding where the XC2S200-6FGG1068C sits within the broader Spartan-II family helps engineers make the right device selection.

Device Logic Cells System Gates Total CLBs Max User I/O Block RAM
XC2S15 432 15,000 96 86 16K
XC2S30 972 30,000 216 92 24K
XC2S50 1,728 50,000 384 176 32K
XC2S100 2,700 100,000 600 176 40K
XC2S150 3,888 150,000 864 260 48K
XC2S200 5,292 200,000 1,176 284 56K

The XC2S200 is the largest and most capable member of the Spartan-II family. It offers nearly 12× more logic cells than the entry-level XC2S15 and provides the highest block RAM capacity in the family.


Typical Applications for the XC2S200-6FGG1068C

The XC2S200-6FGG1068C is widely deployed across a range of industries and application categories:

Communications and Networking

Its high I/O count and fast speed grade make this FPGA suitable for line-rate data processing, protocol bridging, and packet classification in networking equipment.

Digital Signal Processing (DSP)

The XC2S200-6FGG1068C’s large distributed RAM and CLB array support FIR filters, FFT engines, and other DSP pipelines for audio, video, and sensor processing.

Industrial Control Systems

With 284 user I/O pins, the device can interface directly with sensors, actuators, motor controllers, and industrial communication buses such as RS-485 or CAN.

Embedded Systems and Co-Processing

System designers use this FPGA to offload compute-intensive tasks from embedded processors, acting as a hardware accelerator in SoC and SoPC architectures.

Test and Measurement Equipment

The speed grade -6 performance and flexible I/O standards make the XC2S200-6FGG1068C a popular choice for high-throughput data acquisition and signal generation in bench and production test equipment.


Why Choose the XC2S200-6FGG1068C?

Highest Performance in the Spartan-II Family

The -6 speed grade designation means this is the fastest variant available for the XC2S200 silicon. Designers who need tight timing margins and minimal propagation delays should specify this speed grade.

Maximum Logic and I/O Density

With 5,292 logic cells and 284 user I/O pins, the XC2S200-6FGG1068C provides the highest capacity in the entire Spartan-II lineup. This is the go-to device when design complexity has outgrown smaller family members.

Pb-Free Package

The “G” suffix in “FGG” indicates a Pb-free (lead-free) FBGA package, ensuring compliance with RoHS and environmental regulations required in modern electronics manufacturing.

Cost-Effective Alternative to ASICs

The Spartan-II family was engineered to bridge the gap between simple CPLDs and expensive custom silicon. The XC2S200-6FGG1068C provides ASIC-like logic density at a fraction of the non-recurring engineering (NRE) cost, with the added advantage of full reprogrammability.


Ordering and Availability

When sourcing the XC2S200-6FGG1068C, verify the complete part number to ensure you receive the correct speed grade, package, and temperature rating.

Attribute Value
Manufacturer Xilinx (AMD)
Part Number XC2S200-6FGG1068C
Family Spartan-II
Package 1068-ball FBGA
Speed Grade -6
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free)
JTAG Support IEEE 1149.1 Boundary Scan

Frequently Asked Questions About the XC2S200-6FGG1068C

What does the “-6” speed grade mean on the XC2S200-6FGG1068C?

The -6 designation indicates the fastest speed grade within the Spartan-II XC2S200 device. A higher number means faster internal propagation delays and the ability to support higher clock frequencies. It is only available in the commercial temperature range.

Is the XC2S200-6FGG1068C still in production?

The Spartan-II family reached end-of-life status per Xilinx’s product discontinuation notices. Availability is typically through authorized distributors and excess inventory channels. Always verify stock and date codes when sourcing.

What software is used to program the XC2S200-6FGG1068C?

The XC2S200-6FGG1068C is supported by Xilinx ISE Design Suite. Note that the newer Vivado tool does not support the Spartan-II family. ISE is still available through AMD Xilinx’s legacy software portal.

How many I/O pins does the XC2S200-6FGG1068C have?

The device supports up to 284 user-configurable I/O pins. This count does not include the four dedicated global clock/user input pins.

What configuration interface does the XC2S200-6FGG1068C support?

The device supports Master Serial, Slave Serial, Slave Parallel, and JTAG (Boundary-Scan) configuration modes. It can be configured from an external PROM, a microprocessor, or a JTAG cable.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.