The XC2S200-6FGG1065C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, a 1065-pin Fine-Pitch Ball Grid Array (FBGA) package, and a -6 commercial speed grade, this device delivers powerful reconfigurable logic for engineers seeking a cost-effective, flexible alternative to mask-programmed ASICs. Whether you’re designing for telecommunications, industrial automation, consumer electronics, or embedded systems, the XC2S200-6FGG1065C offers the performance, I/O density, and programmability your project demands.

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What Is the XC2S200-6FGG1065C?

The XC2S200-6FGG1065C is part of Xilinx’s Spartan-II FPGA family, manufactured on an advanced 0.18 µm CMOS process and operating on a 2.5V core supply voltage. As a fully reprogrammable logic device, it eliminates the high NRE (Non-Recurring Engineering) costs associated with custom ASICs while offering comparable gate density and speed. The part number breaks down as follows:

For engineers exploring the full Xilinx FPGA portfolio, the XC2S200-6FGG1065C represents one of the highest I/O-density configurations in the Spartan-II lineup.

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XC2S200-6FGG1065C Key Specifications at a Glance

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XC2S200-6FGG1065C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1065C contains 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 matrix. Each CLB consists of two slices, and each slice includes two 4-input Look-Up Tables (LUTs), two storage elements (flip-flops or latches), and dedicated carry and control logic. This architecture provides:

• 75,264 bits of distributed RAM available from LUT-based memory
• 4,704 flip-flops for high-density sequential logic
• Full support for combinational and registered logic in a single CLB

Block RAM – Dual-Port Synchronous Memory

The device includes 14 block RAM modules, each a fully synchronous dual-port 4,096-bit RAM with independent control signals for each port. Key block RAM features include:

This makes the XC2S200-6FGG1065C ideal for applications requiring embedded FIFOs, lookup tables, data buffers, or small embedded processors.

Input/Output Blocks (IOBs) and User I/O

With 514 user-accessible I/O pins in the 1065-pin package, the XC2S200-6FGG1065C delivers the highest pin count in the XC2S200 package family. Each IOB supports:

• Programmable input delay (zero hold time)
• Three-state output control
• Individually configurable slew rate (fast/slow)
• Compatibility with multiple I/O standards (LVTTL, LVCMOS2, PCI, GTL+, SSTL, HSTL, CTT)

Delay-Locked Loops (DLLs)

Four integrated Delay-Locked Loops are placed at the four corners of the die. DLLs provide:

• Zero-skew clock distribution across the device
• Clock frequency synthesis (multiply/divide)
• Board-level clock deskewing when used as a clock mirror
• Phase shifting capability for timing optimization

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XC2S200-6FGG1065C Speed Grade and Timing Performance

The -6 speed grade is the highest-performance grade available for the XC2S200 and is exclusive to the commercial temperature range. This makes the XC2S200-6FGG1065C the optimal choice for speed-critical commercial designs.

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Configuration Modes for XC2S200-6FGG1065C

The XC2S200-6FGG1065C supports multiple configuration modes to suit different system designs and startup requirements:

The device holds all I/O in a high-impedance state during and after configuration until actively driven, ensuring safe power-up sequencing in multi-FPGA board designs.

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XC2S200-6FGG1065C Package: FGG1065 Fine-Pitch BGA

The FGG1065 package is a Fine-Pitch Ball Grid Array with 1,065 total solder balls, making it the largest footprint available for the XC2S200 and enabling access to all 514 user I/Os simultaneously. This is critical for bandwidth-intensive designs that require high pin-count connectivity.

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XC2S200-6FGG1065C vs. Other XC2S200 Package Variants

The XC2S200-6FGG1065C is the clear choice when maximum I/O availability is required, enabling complex multi-bus designs, high-density interface bridging, and parallel data processing architectures.

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Top Applications for the XC2S200-6FGG1065C FPGA

Telecommunications and Networking

The XC2S200-6FGG1065C’s high I/O count and fast -6 speed grade make it well-suited for implementing custom communication protocols, line-card interfaces, and high-speed routing logic in telecom systems.

Industrial Automation and Control

In factory automation environments, the device supports motor control, sensor fusion, and real-time machine control with deterministic timing — a key advantage over microcontrollers for parallel operations.

Embedded Systems and SoC Prototyping

The large block RAM and distributed RAM capacity make it a natural fit for soft-processor implementations (e.g., PicoBlaze), SoC prototyping, and hardware/software co-design validation.

Digital Signal Processing (DSP)

The CLB architecture with dedicated carry logic efficiently implements FIR/IIR filters, FFT engines, and other DSP algorithms that require parallel MAC (Multiply-Accumulate) structures.

Medical and Defense Electronics

Reliability, deterministic behavior, and field reprogrammability make the XC2S200-6FGG1065C suitable for imaging systems, diagnostic equipment, and ruggedized applications where design changes post-deployment are essential.

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Why Choose the XC2S200-6FGG1065C Over a Custom ASIC?

For most low-to-medium volume production runs and R&D applications, the XC2S200-6FGG1065C provides a faster, lower-risk, and more cost-effective development path.

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Development Tools and Software Support

The XC2S200-6FGG1065C is fully supported by Xilinx ISE Design Suite (the legacy toolchain for Spartan-II devices). Engineers can design using:

Note: Vivado Design Suite does not support Spartan-II devices. Use Xilinx ISE 14.7 for full compatibility with the XC2S200-6FGG1065C.

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Ordering Information and Part Number Decoder

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XC2S200-6FGG1065C: Frequently Asked Questions

What is the maximum operating frequency of the XC2S200-6FGG1065C?

With the -6 speed grade, the XC2S200-6FGG1065C can support internal logic operating frequencies above 200 MHz, with the DLLs enabling reliable high-speed clocking up to approximately 263 MHz under optimal conditions.

Is the XC2S200-6FGG1065C RoHS compliant?

The standard XC2S200-6FGG1065C is not RoHS compliant. For lead-free (Pb-free) versions, Xilinx uses a “G” in the part code (e.g., XC2S200-6FGG1065CGQ or similar). Check with your authorized distributor for current RoHS-compliant stock availability.

What software do I need to program the XC2S200-6FGG1065C?

You need Xilinx ISE Design Suite version 14.7 (the final ISE release). Design your RTL in VHDL or Verilog, synthesize and implement using ISE, then download the bitstream via JTAG using iMPACT or a compatible programmer.

How many I/O pins does the XC2S200-6FGG1065C have?

The FGG1065 package provides 514 user I/O pins, the highest count available for the XC2S200 family, making it ideal for high pin-count interface applications.

Can the XC2S200-6FGG1065C operate in industrial temperature ranges?

No — the -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C). For industrial temperature operation (-40°C to +85°C), use a slower speed grade variant such as the -5 or -4 grade.

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Summary: XC2S200-6FGG1065C Product Highlights

The XC2S200-6FGG1065C is a proven, versatile FPGA solution from Xilinx’s Spartan-II family that continues to serve legacy and new designs requiring high I/O density in a commercial temperature environment. With 200,000 system gates, 514 user I/O pins, 57,344 bits of block RAM, four DLLs, and the fastest -6 speed grade, it delivers a compelling combination of performance and programmability. Its 1065-pin FBGA footprint maximizes pin accessibility, making it the go-to package when interface bandwidth is a primary design constraint.

Whether you are prototyping a new embedded system, maintaining a legacy production design, or looking for an ASIC alternative, the XC2S200-6FGG1065C offers the flexibility, toolchain support, and architectural depth to meet your requirements.